M363 773 i、新型說明： 【新型所屬之技術領域】 '料本係有關於電子^件之散熱裝置，尤指一種用於M363 773 i, new description: [New technical field] 'Materials are related to the heat sink of electronic components, especially one for
Ic尊疋5亥電子兀件可以為發光晶'片、半導體元件或 寺’可將電子元件之工作熱源散去， 工作效能及效率之散熱裝置。 电千兀件之 【先前技術】 ►發光二極體（L咖EmlttingDlode，簡稱LED)因豆 ;:=、體積小、重量輕、不易破損、低耗電量和壽 t..，所以被廣泛地應用各式顯示產品中，其發光 原理如下：施加一電麼於_ ' 與電洞結合，並進==體上=使二極體裡的電子 10,請袁昭第一圖，1且古丄一般商品化的發光二極體 μ ®其具有一發光晶片11置於一基座14 ’ 光晶>{ 11係以導線12與該接腳15進行電性連 ί光二广極體1〇更包含一封裝材料13包覆於該 座14並露出接腳…用以保護該發光晶 時亦其晶“發光同 古.垂η ㈣其中心發光層之溫度可達到約 然而’封裝二極體所用之封裝材料，通 之樹脂類化合物，其熱導效果不佳，因 …度無法向上由環氧樹脂傳導致而散發至空氣，口能由 導線慢慢向下傳導。 知芏二乱，、此由 當發光二極體10内之熱量蓄積過高，易使包覆發光 M3 63 773 二極體ίο的封裝材料13 =ri4 與爾 影響一壽命，嚴重時更導忿 而持二一：面二?極體晶片所產生的熱量沒有散發出去 而持知累積，過兩的工作溫度導致 田云 光層之能隙（細Cti〇n)崩潰，如—體㈣接面發 發光二極體產生的亮度將二S3此所能使 降低甚至破壞。由於埶量限 x、、’率即因而 大雷、、古冰… …里限制了發先二極體所能注入的更 机’糾光二極體無法達到真正設定規格之標準。 【新型内容】 元件Γ H匕本創作之主要目的係藉由散熱裝置將電子 率，其中1電以確保電子元件之工作效能及效 孓、垂4 70可以為發光晶片、半導體元件或1c等。 含·· 上述目的，本創作之電子元件散熱裝置至少包 子元件$访電，几件:基板以及散熱部件，該基板係供電 連接 ’ 4純係設有導電部可與電子元件形成電性 孔接，且該基板相對應於供該電子元件置放處係設有貫 而，散熱部件係設置於該貫孔中，由該散熱部件與該 心:1=::元件作動時所發出之工作熱源’得 放熱縣有效散去，以確保電子元件之工作效能及效 實施方式】 為能使#審查委員清楚本創作之組成，以及實施方 M363773 式，炫配合圖式說明如下： +元所Γ:元件之散熱裝置」，該散熱裝置可將電 = 保電子元件之工作效 或ic等，如第二κ "以為發光晶片、'半導體元件 該散熱裝置至少包含，不’係以發光二極體為例， 至少一電子元件帝 — 、發光二極體至少包含有子Γ牛係為發光二極體，該 •之載體22、至少兩個電極接夕腳―2曰3日片U、用以呈載晶片U -透光殼體25，該載體22可 ：:组金線24以及 係相對構成晶片21 f广熱材f，雜金線24 25係罩設於晶片21外層； 之連接，而該透光殼體 件2 可以為咖，該基板3係供電子元 電性連接，如;所示部31可與電子元件2形成 ”間係設有導電黏著二2(可:為^ 接，且該基板”晴應於供該電=性連 孔33，而矽其缸电卞7°件2置放處係設有貫 而縣板3底部係設有—崎化 ’貝 散熱部件4，該散熱部件 : 中，該散熱部件4可以為導献數二之:貝子33中，其 碳膠或銅膠； 守…係數較円之材質例如銀膠、 於散熱部件fl, H = 52 7藉由—黏著件5組裝固定 】子元件之兩個電極接腳23並;’而該 板之導電部31形成電性連接，當m者件&與該基 上進而通電使用時，由田正豆土反、，且衣於其他裝置 由5亥導電部31將電源通入電極接腳 5 M363 773 23而令晶片21發光 詾问s手茶閱第三圖所示， 2]之工作熱源則經由載體22、 夺曰日 圖式所示，係本創作較佳實施例月者;以上之實施說明及 是以，舉凡與本創作之構造 =㈣此侷限本創作， 均應屬本創作之創設目的及申請、雷同者， 【圖式簡單說明】 ^第-圖係為習有發光二極 第二圖係為本創作中電:之結構不意圖。 第三圖係為本創作中 凡件散熱裴置之結構示; 电子讀工作熱源之流動 不 【主要元件符號説明】 發光二極體10 發光晶片11Ic 疋 疋 5 兀 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子[Previous technology] ►Lighting diode (L coffee ElmltingDlode, referred to as LED) because of beans;: =, small size, light weight, not easy to break, low power consumption and life t.., so widely In the application of various display products, the principle of illumination is as follows: Apply a power to _ 'in combination with the hole, and enter == body = make the electrons in the diode 10, please Yuan Zhao first map, 1 and ancient丄Generally available light-emitting diode μ® has a light-emitting chip 11 placed on a pedestal 14 'light crystal>{11 is electrically connected to the pin 15 by a wire 12, and a light-emitting diode 1 〇 Further comprising a packaging material 13 covering the seat 14 and exposing the pin ... for protecting the illuminating crystal, the crystal "lighting" is the same as the ancient yt (4), the temperature of the central illuminating layer can reach about the same as the package diode The encapsulating material used, the resin-based compound, has a poor thermal conductivity effect, and the degree can not be transmitted to the air by the epoxy resin, and the mouth can be slowly conducted downward by the wire. This is caused by the excessive accumulation of heat in the light-emitting diode 10, which makes it easy to cover the light-emitting M3 63 773 diode ίο The encapsulation material 13 = ri4 and the impact of a lifetime, in the case of serious, more entangled and hold two: the heat generated by the surface of the two-pole wafer is not emitted and accumulated, and the working temperature of the two passes the energy of the Tianyun optical layer. The gap (fine Cti〇n) collapses, such as the brightness of the body (four) junction light emitting diode will be reduced or even destroyed by the second S3. Because of the limit of x, the 'rate is thus greatly thunder, ancient The ice... limits the machine that the first diode can inject. The light-reducing diode cannot meet the standard of the true specification. [New content] Component Γ H匕 The main purpose of this creation is to use electrons to dissipate electrons. Rate, one of which is to ensure the working efficiency and efficiency of the electronic components, and the ray 4 70 can be a light-emitting chip, a semiconductor component or a 1c, etc. Including the above purpose, the electronic component heat sink of the present invention has at least a component to access the power, a plurality of pieces: a substrate and a heat dissipating member, wherein the substrate is provided with a conductive portion, and the conductive portion is electrically connected to the electronic component, and the substrate is correspondingly disposed for the electronic component to be placed. Heat sink The component is disposed in the through hole, and the working heat source issued by the heat dissipating component and the core: 1=:: component is effectively dissipated in the heat releasing county to ensure the working efficiency and effectiveness of the electronic component. It can make the #reviewer clear the composition of the creation, and the implementation of the M363773 style, the dazzle with the following description: + yuan Γ: the heat sink of the component, the heat sink can be used to protect the electronic components or ic Etc., for example, the second κ " illuminating wafer, 'the semiconductor device, the heat sink includes at least, not the light emitting diode, for example, at least one electronic component - the light emitting diode contains at least the yak system For the light-emitting diode, the carrier 22, at least two electrodes are connected to the foot-- 2曰3-day U, for carrying the wafer U-transparent housing 25, and the carrier 22 can be: group gold wire 24 And the oppositely constituting the wafer 21 f, the wide heating material f, the impurity gold wire 24 25 is disposed on the outer layer of the wafer 21; the light transmissive housing member 2 can be a coffee, and the substrate 3 is electrically connected by the electronic component. , for example, the portion 31 can be formed with the electronic component 2 The second 2 (may be: ^, and the substrate is sunny for the electrical connection hole 33, and the cylinder is electrically connected to the 7° member 2, and the bottom plate of the county plate 3 is provided. There is a - Qihua 'below heat dissipating component 4, the heat dissipating component: the heat dissipating component 4 can be a derivative number two: in the shell 33, the carbon glue or copper glue; the material with a relatively high coefficient such as silver glue, The heat dissipating member fl, H = 52 7 is assembled by fixing the two electrode pins 23 of the sub-element by the adhesive member 5; and the conductive portion 31 of the plate is electrically connected, and the m-piece & When the base is further energized, the Tianzheng bean is reversed, and the other device is powered by the 5H conductive portion 31 to the electrode pin 5 M363 773 23 to make the wafer 21 emit light. As shown, the working heat source of 2] is shown by the carrier 22 and the pattern of the smashing day, which is the preferred embodiment of the present invention; the above implementation description and the structure of the creation and the creation of the creation = (4) the limitation Creation, should be the creation purpose of this creation and the application, the same person, [simple description of the figure] ^The first picture is the second picture of Xiguang CLP creation: the structure is not the intent. The third figure is the structure of the heat sink of the piece in the creation; the flow of the heat source of the electronic reading is not [Main component symbol description] Light-emitting diode 10 Light-emitting chip 11
導線12 封裝材料13 基座14 接腳15 電子元件2 晶片21 栽體22 電極接腳23 M363773 冷線24 邊光殼體25 差板3 導電部31、 導電黏著件32 j孔33 鋼層34 ’ 镦熱部件4 _· 黏著件5Wire 12 Package material 13 Base 14 Pin 15 Electronic component 2 Wafer 21 Carrier 22 Electrode pin 23 M363773 Cold wire 24 Edge light housing 25 Differential plate 3 Conductive portion 31, Conductive adhesive member 32 J hole 33 Steel layer 34 ' Hot parts 4 _· Adhesive parts 5