TWI660527B - Light-emitting device and manufacturing method thereof - Google Patents

Abstract

The invention discloses a method for forming a light-emitting diode element, including: providing a transparent substrate; providing an LED die fixed on the transparent substrate, wherein the LED die includes two electrodes; providing a second substrate; and connecting The transparent substrate and the second substrate are used to place the LED die between the transparent substrate and the second substrate, so that the LED die is covered by the transparent substrate and the second substrate; wherein two electrodes lead The pins are located between the transparent substrate and the second substrate, and the two electrodes of the LED die are electrically connected to the two electrode pins in a non-wired connection process.

Description

Light emitting diode element and manufacturing method thereof

The invention relates to a light-emitting diode element of a package and a manufacturing method thereof.

Light-Emitting Diode (LED) has good photoelectric characteristics such as low energy consumption, low heat generation, long operating life, shock resistance, small size, fast response speed and stable output light wavelength, so it is suitable for various lighting applications. As the light emitting diode develops toward high power, the operating temperature of the overall LED component will increase accordingly. As shown in FIG. 1A, the traditional package is liable to cause poor luminous efficiency in high power applications due to poor heat dissipation. As shown in FIG. 1B, the LED element is provided with the LED die 101 on a heat sink 102 and then electrically connected to the two electrode pins 103a and 103b through metal wires 104a and 104b. This design relies on the heat dissipation of the heat sink 102 and the metal wiring process, which results in considerable costs. In addition, the above design has a poor light field in the horizontal direction, and it is often necessary to add an optical element to the LED element to improve the uniformity of the light field in the horizontal direction, which causes problems in cost and volume or thickness in application.

The present invention discloses a light source device including a carrier having a surface having an x-axis and a y-axis perpendicular to the x-axis; a first light-emitting diode element is disposed on the surface, and the first light-emitting diode The body element includes a first main light emitting surface, and a first LED die, having two electrodes and a first surface, and the two electrodes are disposed on the first surface, wherein the first main light emitting surface is roughly Perpendicular to the surface; a second light-emitting diode element is disposed on the surface; a third light-emitting diode element And a fourth light emitting diode element is provided on the surface, wherein the first light emitting diode element and the second light emitting diode element overlap in the x-axis direction, and The third light-emitting diode element and the fourth light-emitting diode element overlap in the x-axis direction, and the first light-emitting diode element, the second light-emitting diode element, and the third light-emitting diode The element and the fourth light-emitting diode element do not overlap each other in the direction of the y-axis.

In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments are described below in detail with reference to the accompanying drawings, as follows.

101‧‧‧LED die

102‧‧‧ Radiator

103a, 103b‧‧‧ electrode pins

104a, 104b‧‧‧ metal wire

20,200‧‧‧light-emitting diode element

201‧‧‧LED die

201a, 201b‧‧‧electrode

202a‧‧‧ transparent substrate

203a, 203b‧‧‧ electrode pins

204a, 204b ‧‧‧ metal wire

30,300‧‧‧light-emitting diode element

301‧‧‧LED die

301a, 301b‧‧‧ electrode

302a‧‧‧Transparent substrate

303a, 303b‧‧‧ electrode pins

304a, 304b‧‧‧ metal wire

307‧‧‧Fluorescent powder layer

308‧‧‧Packaging material

315‧‧‧groove

40,400‧‧‧light-emitting diode element

401‧‧‧LED die

401a, 401b‧‧‧ electrode

402a‧‧‧First transparent substrate

402b‧‧‧Second transparent substrate

403a, 403b‧‧‧ electrode pins

405‧‧‧Packaging material

501‧‧‧LED die

502a‧‧‧Transparent substrate

503a, 503b‧‧‧ electrode pins

509‧‧‧Self-radiating layer

509X, 509Y‧‧‧ stripe pattern

510‧‧‧ Insulation

60‧‧‧light-emitting diode element

601‧‧‧Blue Light Grain

601’‧‧‧Red LED die

611, 611a, 611b ‧‧‧ Optical Elements

70,700‧‧‧light-emitting diode element

701‧‧‧LED die

701a, 701b‧‧‧ electrode

702a‧‧‧ transparent base layer

703a, 703b ‧‧‧ electrode pins

708‧‧‧Packaging material

709‧‧‧Self-dissipating layer

712‧‧‧ substrate

720‧‧‧ carrier

721‧‧‧ base

722a, 722b‧‧‧ external power pin

722a ’, 722b’‧‧‧ power supply pad

723‧‧‧groove

800‧‧‧light-emitting diode element

821‧‧‧illuminated surface

831‧‧‧optical element

900‧‧‧ backlight module

920‧‧‧ carrier

923‧‧‧Groove

930‧‧‧Light field situation

Figure 1A shows the package of a conventional light emitting diode.

Figure 1B shows a conventional light emitting diode device with a heat dissipation design.

FIG. 2 shows a first embodiment of the light emitting diode device of the present invention.

FIG. 3 shows a second embodiment of the light-emitting diode element of the present invention.

FIG. 4 shows a third embodiment of the light-emitting diode element of the present invention.

FIG. 5 shows a fourth embodiment of the light-emitting diode element of the present invention.

FIG. 6 shows a fifth embodiment of the light-emitting diode element of the present invention.

FIG. 7 shows a sixth embodiment of the light-emitting diode element of the present invention.

FIG. 8 shows a conventional backlight module.

FIG. 9 shows a seventh embodiment of the present invention, and illustrates a case where a backlight module is constituted by using the light emitting diode element of the embodiment of the present invention.

FIG. 2 is a first embodiment of a light emitting diode device according to the present invention, and a method for forming the same includes: as shown in FIG. 2 (a), providing a transparent substrate 202a including a transparent material, such as glass, sapphire (Al2O3), CVD Diamond, and aluminum nitride (AlN); forming a plurality of electrode pins 203 on a transparent substrate The electrode pin 203 includes two electrode pins 203a and 203b, respectively. A plurality of LED dies 201 are provided to be adhered to the transparent substrate 202a through an adhesive material, wherein each LED dies 201 has two electrodes 201a and 201b. It is separated from its corresponding two electrode pins 203a, 203b by a distance, as shown in Figure 2 (b); a complex array of metal wires 204 is provided, and each group of metal wires 204 includes two metal wires 204a and 204b respectively. Connect the two electrodes 201a, 201b of each LED die 201 to the electrode pins 203a, 203b; then, as shown in FIG. 2 (c), cut the transparent substrate 202a to form a plurality of light-emitting diode elements 20; finally, as shown in FIG. As shown in FIG. 2 (d), each light-emitting diode element 20 is covered with a packaging material 205, such as epoxy or silicone. The packaging material 205 can be selectively dispersed with fluorescent powder. (Not shown). The aforementioned cutting step may also be performed after the light-emitting diode element is covered by the encapsulating material 205. In addition, a plurality of grooves (not shown) may be selectively formed on the transparent substrate 202a first. Each groove corresponds to the position where each LED die 201 is set, and the LED die 201 is placed in the recess. Inside the slot.

FIG. 2 (d) is a light-emitting diode device 200 formed according to the first embodiment of the present invention, including a transparent substrate 202a including a transparent material such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN ); A set of electrode pins 203 on a transparent substrate 202a, including two electrode pins 203a, 203b; an LED die 201 is placed on the transparent substrate 202a, the LED die 201 is separated from the two electrode pins 203a, 203b by one Distance, and the LED die 201 has two electrodes 201a, 201b; a set of metal wires 204 including two metal wires 204a, 204b correspondingly connect the two electrodes 201a, 201b of the LED die 201 to the electrode pins 203a, 203b; and A packaging material 205, such as epoxy or silicon, is packaged on the periphery of the component 20, that is, the packaging material 205 is packaged on the transparent substrate 202a, the LED die 201, the two electrode pins 203a, 203b, and the two metal wires 204a. , 204b, and two electrode pins 203a, 203b are exposed. Fluorescent powder (not shown) can be selectively dispersed in the packaging material 205. In addition, the transparent substrate 202a may optionally include a recess (not shown) for the LED die 201 to be placed therein, so that the LED die 201 is placed therein.

A second embodiment of the light-emitting diode element of the present invention is shown in FIG. 3, and this embodiment is a variation of the first embodiment. The method for forming a light-emitting diode device in this embodiment includes: as shown in FIG. 3 (a), providing a transparent substrate 302a including a transparent material, such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN). Forming a plurality of grooves 315; forming a plurality of electrode pins 303 on a transparent substrate, each group of electrode pins 303 respectively including two electrode pins 303a, 303b; forming a phosphor layer 307 on the transparent substrate 302a, and Coated on the groove 315 and its side wall, wherein the phosphor layer 307 may be a mixture of phosphor in a packaging material such as epoxy or silicone; a plurality of LED dies 301 are provided for transmission An adhesive material is adhered to the transparent substrate 302a, wherein each LED die 301 has two electrodes 301a, 301b, and is separated from its corresponding two electrode pins 303a, 303b by a distance, as shown in Figure 3 ( b); provide a plurality of metal lines 304, each group of metal lines 304 respectively includes two metal lines 304a, 304b correspondingly connect the two electrodes 301a, 301b of each LED die 301 to the electrode pins 303a, 303b; then As shown in FIG. 3 (c), the transparent substrate 302a is cut to form a plurality of light emitting diodes. Finally, as shown in FIG. 3 (d), the body element 30 is covered with a packaging material 308 on the LED die 301, the groove 315, and / or the transparent substrate 302a. The phosphor layer 307 has been provided first. Therefore, in one embodiment of the present invention, a packaging material 308 containing the same phosphor powder as the phosphor layer 307 can be selected to cover the exposed portion of the LED die 301. , So that the LED die 301 is completely covered by the encapsulating material 308 containing phosphor. In this embodiment, the packaging material 308 completely covers the opening of the groove 315. Different from the first embodiment described above, the packaging material 308 is substantially flat and adhered to the transparent substrate 302a and covers the LED die 301, which is beneficial to the thinning of the device or the convenience of applying an optical device on it. Wherein, the aforementioned cutting step may also be performed after the light-emitting diode element is covered by the encapsulating material 308.

Therefore, according to the second embodiment, a light emitting diode device 300 can be formed. A transparent substrate 302a includes a transparent material, such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN). The transparent substrate 302a It has a groove 315; a phosphor layer 307 on the transparent substrate 302a and is coated on the groove 315 and its side wall; a set of electrode pins 303 on the transparent substrate 302a includes two electrode pins 303a, 303b; An LED die 301 is placed on the transparent substrate 302a and located in the groove 315. The LED die 301 is separated from the two electrode pins 303a and 303b by a distance, and the LED die 301 has two electrodes 301a and 301b; The metal line 304 includes two metal lines 304a, 304b correspondingly connecting the two electrodes 301a, 301b of the LED die 301 to the electrode pins 303a, 303b; and a packaging material 308 covering the LED die 301, the groove 315, and / Or on a transparent substrate 302a. The packaging material 308 is, for example, epoxy or silicon. A fluorescent powder (not shown) can be selectively dispersed in the packaging material 308, and the fluorescent powder can be the same as the fluorescent powder in the fluorescent powder layer 307.

A third embodiment of the light emitting diode device of the present invention is shown in FIG. 4. The method for forming the light-emitting diode element of this embodiment includes: as shown in FIG. 4 (a), providing a first transparent substrate 402a including a transparent material, which can be, for example, glass, sapphire (Al2O3), CVD diamond And aluminum nitride (AlN); provide a plurality of LED die 401 and fix it on the first transparent substrate 402a, each LED die 401 has two electrodes 401a, 401b; as shown in Figure 4 (b) Provide a second transparent substrate 402b including a transparent material, the selection of this transparent material may be the same as the first transparent substrate 402a, and may be the same as or different from the first transparent substrate 402a; forming a plurality of array electrode pins 403 on the second transparent On the substrate 402b, each group of electrode pins 403 includes two electrode pins 403a and 403b, respectively. Next, as shown in FIG. 4 (c), the first transparent substrate 402a and the second transparent substrate 402b are aligned and bonded, so that each The two electrodes 401a, 401b of an LED die 401 are in contact with the two electrode pins 403b, 403a, respectively; the first transparent substrate 402a and the second transparent substrate 402b are cut and bonded to form a plurality of light emitting diode elements 40. Finally, As shown in FIG. 4 (d), a packaging material 405, such as An epoxy resin or silicone is packaged on the periphery of each element 40. That is, the packaging material 405 covers the first transparent substrate 402a and the second transparent substrate 402b, and exposes two electrode pins 403a, 403b. Fluorescent powder can be selectively dispersed in this epoxy resin or silicone (not shown). In addition, the first transparent substrate 402a can also selectively form a recess (not shown) for the LED die 401 for each LED die 401, so that the LED die 401 is placed therein.

Therefore, according to the third embodiment, a light-emitting diode element 400 can be formed. A first transparent substrate 402a includes a transparent material, such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN). The second transparent substrate 402b includes a transparent material, such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN). The second transparent substrate 402b is connected to the first transparent substrate 402a. A set of electrode pins 403 includes two Electrode pins 403a and 403b are interposed between the first transparent substrate and the second transparent substrate; and an LED die 401 has two electrodes 401a and 401b placed on the first transparent substrate 402a and the second transparent substrate 402b. Among them, the two electrodes 401a, 401b of the LED die 401 are correspondingly connected to the two electrode pins 403a, 403b.

A fourth embodiment of the light-emitting diode element of the present invention is shown in FIG. 5 and includes a “self-heat dissipating” design. This embodiment may be based on any one of the first to third embodiments described above, and combined with the self-heat dissipation layer structure of this embodiment to improve the heat dissipation efficiency of the light emitting diode element. The method for forming a light-emitting diode element in this embodiment includes: as shown in FIG. 5 (a), providing a transparent substrate 502a including a transparent material. The transparent substrate 502a may be, for example, the transparent substrate 202a, the transparent substrate in the foregoing embodiments. Any one of the substrate 302a, the first transparent substrate 402a, and the second transparent substrate 402b, forming a self-radiating layer 509 on the transparent substrate 502a including a transparent and highly thermally conductive material (for example, Thermal Conductivity> 100W / mK), This material can have the characteristics of high heat radiation. Forming the self-heat dissipation layer 509 on the transparent substrate 502a can improve the heat dissipation efficiency of the light emitting element. The self-radiating layer 509 may be a conductive material, such as a thin metal or alloy or a carbon-containing conductive material. Thin metals or alloys can be selected from tin (Sn), aluminum (Al), gold (Au), platinum (Pt), zinc (Zn), silver (Ag), titanium (Ti), tin (Pb), copper (Cu) , Nickel (Ni), or an alloy of the above metals. The carbon-containing conductive material may be a conductive material containing a carbon composition close to or equal to 100%, such as Graphene. In one embodiment, the self-heat dissipation layer 509 includes a non-conductive material. For example, the non-conductive material containing carbon may be a non-conductive material with a carbon composition close to or equal to 100%, such as diamond or diamond-like carbon (DLC). . The self-radiating layer 509 may be formed on the transparent substrate 502a as a whole, or a plurality of stripe patterns 509Y may be formed by, for example, a lithographic etching method as shown in FIG. 5 (a), or as shown in FIG. As shown in 5 (b), a mesh pattern is formed, including a plurality of vertical stripe patterns 509Y and a plurality of horizontal stripe patterns 509X. Taking any of the first or second embodiments as an example, as shown in FIG. 5 (c), the electrode pins 503a and 503b are formed on the transparent substrate 502a, and the steps are sequentially completed as shown in the foregoing. As shown in Figure 5 (d). It should be noted that when the self-heat dissipation layer 509 is a conductive material, in order to avoid short circuit, an insulating layer 510 may be formed between the transparent substrate 502a and the LED die 501 to electrically isolate the self-heat dissipation layer 509 and the LED die 501. . Compared with the traditional packaging technology, thinking about solving the heat dissipation problem in the direction of lead frame, metal wire bonding, solid crystal materials, etc., but its effect may not be good. The self-heating layer structure of the present invention is combined with the transparent substrates of the foregoing embodiments to provide a large heat dissipation area of the light emitting diode element and a good heat dissipation mechanism (conduction and convection in contact with air), which has excellent heat dissipation benefits. In addition, when the self-radiating layer is a conductive material and forms a plurality of stripe patterns 509Y as shown in FIG. 5 (a), some of the line stripe patterns 509Y can also selectively contact the electrode pins 503a and 503b, providing another Heat dissipation path for heat dissipation through electrode pins 503a, 503b; when the self-heat-dissipating layer is a non-conductive material, such as diamond, there is no need to consider the short-circuit problem, regardless of the pattern of the self-heat-dissipating layer, the self-heat-dissipating layer can also selectively communicate with the electrode The pins 503a and 503b are in contact.

A fifth embodiment of the present invention is shown in FIG. 6 and can be applied in combination with the foregoing first to fourth embodiments. As shown in FIG. 6 (a), in the foregoing embodiments, the number of LED dies in each light-emitting diode element can be adjusted to include two or more LED dies. For example, the blue LED dies 601 and The red LED chip 601 'is in a light-emitting diode device, and a part of the blue LED chip 601 can be formed in the transparent substrates 602a and 602b (not shown in the figure) respectively as in the aforementioned second embodiment, and The yellow phosphor (not shown) is coated to achieve a light emitting diode element 60 with warm white light. In addition, as shown in FIG. 6 (b), an optical element may also be provided on the periphery of the transparent substrate of the light emitting diode element 600 (which is a light emitting diode element, such as the side view of the aforementioned second or third embodiment). 611 includes any one or both of an optical element 611a or an optical element 611b, where the optical elements 611a and 611b include opposite sides of a light-emitting diode element 600 sandwiched by a hemisphere to increase the light-emitting efficiency of the light-emitting diode element 600.

A sixth embodiment of the present invention is shown in FIG. 7. The method for forming a light-emitting diode element in this embodiment includes: as shown in FIG. 7 (a), providing a transparent substrate 702a including a transparent material. The choice of this transparent material may be As described in the transparent substrate 202a in the first embodiment; as shown in the left side of FIG. 7 (b), a self-heat-dissipating layer 709 is formed on the transparent substrate 702a, which contains a transparent and highly thermally conductive material and can also have high heat radiation. characteristic. Based on the consideration of avoiding short circuit, the self-radiating layer in this embodiment is a non-conductive material. For example, the non-conductive material containing carbon may be a non-conductive material with a carbon composition close to or equal to 100%, such as diamond or diamond-like carbon. ). Then, a plurality of electrode pins 703 are formed on the transparent substrate 702a on the self-radiating layer 709. Each group of electrode pins 703 includes two electrode pins 703a and 703b, respectively. A metal layer is formed by a method, and then a plurality of electrode pins 703 are formed by a lithography etching method. Then, as shown in the right side of FIG. 7 (b), a plurality of LED dies 701 are provided on a substrate 712. 712 is a blue tape in one embodiment. The transparent substrate 702a and the substrate 712 are bonded to each other, so that the two electrodes 701a, 701b of each LED die 701 are in contact with the two electrode pins 703b, 703a and fixed on the transparent substrate 702a, and the LED die 701 and The substrate 712 is separated. If the substrate 712 is a blue tape, the blue film can be heated to reduce its viscosity and be separated from the LED die 701. The result is shown in FIG. 7 (c); The transparent substrate 702a bonded to the particles 701 to form a plurality of light emitting diode elements 70, as shown in the left side of FIG. 7 (d), and finally encapsulated in a packaging material 708, such as epoxy or silicone. A light emitting diode element 700 is formed on the periphery of each element 70 as shown in the right side of FIG. 7 (d). A fluorescent powder (not shown) can also be selectively dispersed in the epoxy resin or the silicone. In addition, the transparent substrate 702a can also selectively form a recess (not shown) for the LED die 701 for each LED die 701, so that the LED die 701 is placed therein, even as shown in FIG. In the second embodiment of 3, the above phosphor powder can also be placed in the groove and the LED die 701 can be placed in the groove and located on the phosphor.

As shown in FIG. 7 (e), the light-emitting diode element 700 of this embodiment can be used in conjunction with a carrier 720. The carrier 720 includes a base 721 and two external power pins 722a and 722b fixed to the base 721. The base 721 includes a socket 723 for this embodiment. The light emitting diode element 700 is inserted and fixed. The two external power pins 722a and 722b respectively have an extension portion disposed in the groove 723 to form two power supply pads 722a 'and 722b'. When the light emitting diode element 700 is inserted into the groove 723, The two electrode pins 703a, 703b are in contact with the two power supply pads 722a ', 722b', respectively, so the external power can be supplied to the light emitting diodes by the two external power supply pins 722a, 722b through the two power supply pads 722a ', 722b'.体 Element700. In addition, the base 721 can also be designed as a heat sink containing a highly thermally conductive material, so as mentioned in the fourth embodiment of FIG. 5, in addition to the self-heat dissipation layer 709 on the transparent substrate 702a, it can provide In addition to a good heat dissipation path, since the self-heat dissipation layer 709 is in contact with the two electrode pins 703a, 703b, and the two electrode pins 703a, 703b are in contact with the two power supply pads 722a ', 722b', and the two power supply pads 722a ', 722b 'It is set in the groove 723 and is in contact with the base 721, so when the base 721 is designed as a heat sink, the above will form another heat dissipation path, which is helpful for heat dissipation. In design, the self-heat dissipating layer 709 can also directly contact the base 721 to form a heat dissipation path when inserted in the groove 723.

The light-emitting diode element 700 of this embodiment has vertical and plug-in characteristics, so in addition to the above-mentioned advantages, due to this vertical feature, that is, when the light-emitting diode element 700 is inserted into the groove 723, the LED die 701 is connected with The upper surface S of the carrier 720 is vertical, which provides a large heat dissipation area of the light emitting diode element 700 and a good heat dissipation mechanism (conduction and convection in contact with air), especially brought by the heat dissipation layer 709 provided on the transparent substrate 702a. Thermal benefits. In terms of general LED die, the light emitting diode system is composed of an active layer stack sandwiched between p-type and n-type semiconductor layers. The main light-emitting surface is a vertical to the p-type semiconductor layer, the active layer, and n. Plane of the direction of stacking of semiconductor-type semiconductor layers; or in terms of light output, the light output from the side of a general LED die is less than 20% of the total light output, so the light output of the main light emitting surface is greater than 80% of the total light output, or if For double-sided light output, it is greater than about 40% of the total light output, that is, the light output of the main light emitting surface is at least about 30% of the total light output of a light emitting diode. Therefore, in this embodiment, the main light-emitting surface of the LED die 701 (a plane perpendicular to the stacking direction of the p-type semiconductor layer, the active layer, and the n-type semiconductor layer), or the amount of light output is at least approximately greater than the total output of a light-emitting diode. 30% of the amount of light) is roughly perpendicular to the carrier 720 The surface S has a large contact area with the surrounding air, which helps to dissipate heat. The plug-in design eliminates the cost of bonding and makes the repair flexible.

Therefore, as shown in the right side of FIG. 7 (d), a light emitting diode element 700 according to the sixth embodiment may include: a transparent substrate 702a including a transparent material, such as glass, sapphire (Al2O3), CVD diamond, And aluminum nitride (AlN); a self-radiating layer 709 includes a transparent and highly thermally conductive material on a transparent substrate 702a; a set of electrode pins 703 on the self-radiating layer 709, and the electrode pins 703 include two electrode pins 703a, 703b An LED die 701 is placed on the transparent substrate 702a and is located on the self-radiating layer 709, the LED die 701 has two electrodes 701a, 701b correspondingly connected to the electrode pins 703b, 703a; and a packaging material 708, such as a ring An epoxy resin or silicone is packaged on the periphery of the element 70, and the packaging material 708 covers the LED die 701 and / or the transparent substrate 702a.

Compared with the traditional light source equipment, the vertical design of the present invention can effectively improve the light field in the horizontal direction and reduce the problem of volume or thickness in the application. Taking a backlight module (Backlight) applied to a display device as an example, FIG. 8 shows a conventional backlight module. Because the conventionally used light emitting diode element 800 is used, its package tends to bias the light field to vertical light, that is, there is relatively more light emitted in the vertical direction (the direction of the solid arrow in the figure). In order to make the lighting surface 821 have a more uniform light distribution, it is necessary to rely on the addition of an optical element 831 as shown in the figure to adjust the light field, so that part of the light is turned to the horizontal direction (as shown by the dotted arrow in the figure), resulting in a backlight. The overall thickness h of the module becomes thicker due to the optical element 831, and the volume increases. In contrast, when the light-emitting diode element of the present invention is applied to a light source device, as shown in the seventh embodiment of the present invention, the light-emitting diode element 700 of FIG. 7 is applied to, for example, a backlight module. At 900 hours, due to the design of the transparent substrate and vertical state, there is good light output in the horizontal direction. In FIG. 9, each light-emitting diode element 700 is vertically inserted into a groove 923 fixed on a carrier 920, and its light field is shown in the light field situation 930 in the figure. Due to the transparent substrate and vertical state design, Therefore, there is good light output in the horizontal direction, and no additional optical element is needed to have a uniform light distribution in the horizontal direction. Therefore, the overall thickness of the backlight module is roughly only the size of the crystal grains of h '. The design of the carrier 920 is roughly the carrier shown in Figure 7 (e) (carrier) 720, it is worth noting that the arrangement of the light-emitting diode elements 700 on the carrier 920 can be arranged in a staggered manner, such as a two-dimensional Cartesian coordinate system ), The plane S where the groove 923 on the carrier 920 is located can be a virtual x-coordinate and y-coordinate to describe the position of any point on it, namely (xi, yj), where i, j are real numbers. As shown in the figure, x1, x2, x3 ..., and y1, y2, y3, etc. can indicate the positions of the light-emitting diode elements 700 thereon. As shown in the figure, two light-emitting diodes on x1 (and x3) emit light. The diode element and the two light-emitting diode elements on x2 are located at the staggered y-axis position (that is, the two light-emitting diode elements on x1 (and x3) are on y1 and y3, and the two light-emitting diodes on x2 are light-emitting The diode elements are at y2 and y4), or in other words, there are three light-emitting diode elements at approximately (x1, y1), (x2, y2), (x3, y1), and approximately ( x2, y1) is not equipped with a light-emitting diode element, because as shown in the figure, the position of (x2, y1) can be emitted by the light-emitting diode element roughly located at (x2, y2) Complementing it, such a configuration can further make the light distribution in the horizontal direction more uniform.

Therefore, according to the seventh embodiment, a light source device can be formed, for example, a backlight module (Backlight) 900 includes: a first light emitting diode element; a second light emitting diode element; a third light emitting diode A carrier element 920 has a first surface S, the first light-emitting diode element, the second light-emitting diode element, and a third light-emitting diode element are all disposed on the first surface S and their arrangement is Arranged in a staggered manner, the first surface S includes a virtual x-coordinate and y-coordinate (xi, yj) in a two-dimensional Cartesian coordinate system, where i, j are real numbers To indicate the position of any point on it, the first, second, and third light-emitting diode elements are respectively approximately at (x1, y1), (x2, y2), (x3, y1), and approximately at (x2 , y1) is not provided with a light emitting diode element.

In the above-mentioned different embodiments, although the components having the same function have different icon numbers in each embodiment, they have physical, chemical, or electrical characteristics. The same or similar related features need not be described in detail in each embodiment.

The above-mentioned embodiments are merely illustrative for explaining the principle of the present invention and its effects, and are not intended to limit the present invention. Anyone with ordinary knowledge in the technical field to which the present invention pertains can do so without departing from the invention. In the case of technical principles and spirits, the above embodiments are modified and changed. Therefore, the scope of protection of the rights of the present invention is listed in the scope of patent application described below.

Claims (10)

A light source device includes: a carrier having a surface having an x-axis and a y-axis perpendicular to the x-axis; a first light-emitting diode element is disposed on the surface, and the first light-emitting diode element includes : A first main light emitting surface and a first LED die having two electrodes and a first surface, and the two electrodes are disposed on the first surface, wherein the first main light emitting surface is substantially perpendicular to The surface; a second light-emitting diode element is disposed on the surface; a third light-emitting diode element is disposed on the surface; and a fourth light-emitting diode element is disposed on the surface, wherein the first A light-emitting diode element and the second light-emitting diode element overlap in the x-axis direction, the third light-emitting diode element and the fourth light-emitting diode element overlap in the x-axis direction, and the The first light-emitting diode element, the second light-emitting diode element, the third light-emitting diode element, and the fourth light-emitting diode element do not overlap each other in the direction of the y-axis. The light-emitting module described in item 1 of the patent application scope further includes a first packaging material covering the first light-emitting diode element. The light-emitting module according to item 2 of the scope of patent application, wherein the first packaging material includes a fluorescent powder. The light-emitting module of the light-emitting diode element according to item 1 of the patent application scope, wherein the second light-emitting diode element includes a second main light-emitting surface and the second main light-emitting surface is substantially perpendicular to the surface. The light-emitting module according to item 1 of the scope of patent application, wherein the carrier includes a base and two external power pins are fixed on the base. The light-emitting module according to item 5 of the patent application scope, wherein the base includes a groove to provide insertion of the first light-emitting diode element. The light-emitting module according to item 1 of the patent application scope, wherein the first light-emitting diode element further includes two electrode pins in contact with the two electrodes, respectively. The light-emitting module according to item 1 of the patent application scope, wherein the first light-emitting diode element further includes a transparent substrate, and the first LED die is formed on the transparent substrate. The light emitting module according to item 8 of the scope of patent application, wherein the first light emitting diode element further includes a heat dissipation layer on the transparent substrate. The light-emitting module according to item 8 of the scope of patent application, wherein the first light-emitting diode element includes a fluorescent powder, the transparent substrate has a groove, and the fluorescent powder is located in the groove.