TW201926747A - Light-emitting device and manufacturing method thereof - Google Patents

Abstract

This application discloses a method for forming a light-emitting device, comprising: providing a transparent substrate; providing an LED die on the transparent substrate wherein the LED die comprises two electrodes; providing a second substrate; and bonding the transparent substrate to the second substrate to locate the LED die between the transparent substrate and the second substrate, and the LED die is enclosed by the transparent substrate and the second substrate, wherein two electrode pins are located between the transparent substrate and the second substrate, and the two electrodes of the LED die respectively connect to the two electrode pins without wire bonding process.

Description

Light-emitting diode element and method of manufacturing same

The invention relates to a light-emitting diode component of a package and a manufacturing method thereof

Light-Emitting Diode (LED) has good photoelectric properties such as low energy consumption, low heat generation, long operating life, shock resistance, small volume, fast response speed, and stable wavelength of output light, so it is suitable for various lighting applications. As the light-emitting diodes develop toward high power, the operating temperature of the LED integrated components will increase. The conventional package, as shown in FIG. 1A, is liable to cause a decrease in luminous efficiency in high-power applications due to poor heat dissipation. The LED element shown in FIG. 1B is disposed on a heat sink 102, and then electrically connected to the two electrode pins 103a, 103b via the metal wires 104a, 104b. This design relies on the heat dissipation of the heat sink 102 and the metal wire manufacturing process, resulting in considerable cost. In addition, the above design has a poor light field in the horizontal direction, and it is often necessary to add optical components to the LED components to improve the uniformity of the light field in the horizontal direction, resulting in cost and application volume or thickness.

The invention discloses a light emitting module comprising a carrier, a first light emitting diode element and a second light emitting diode element. The carrier has a surface, the first light emitting diode element is disposed on the surface and forms a first light field, the second light emitting diode element is disposed on the surface and forms a second light field, and the second light field and the second light field A light field overlaps. The first light emitting diode element includes an LED die and a first main light exiting surface, and the first main light emitting surface is substantially perpendicular to the surface.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

2 is a first embodiment of a light emitting diode device of the present invention, which comprises: as shown in FIG. 2(a), a transparent substrate 202a comprising a transparent material such as glass, sapphire (Al2O3), CVD Diamond, and aluminum nitride (AlN); forming complex array electrode pins 203 on a transparent substrate, each set of electrode pins 203 respectively comprising two electrode pins 203a, 203b; providing a plurality of LED dies 201 through a bonding The material is adhered to the transparent substrate 202a, wherein each LED die 201 has two electrodes 201a, 201b and is spaced apart from the corresponding two electrode pins 203a, 203b, as shown in Figure 2(b). Providing a plurality of metal wires 204, each of which includes two metal wires 204a, 204b correspondingly connecting the two electrodes 201a, 201b of each LED die 201 to the electrode pins 203a, 203b; 2(c), the transparent substrate 202a is cut to form a plurality of light emitting diode elements 20; finally, as shown in FIG. 2(d), an encapsulating material 205 such as epoxy (Epoxy) or silicone (silicone) is used. Covering each of the light-emitting diode elements 20, the package material 205 is selectively dispersed Light powder (not shown). The step of cutting may be performed after the encapsulating material 205 covers the LED component. In addition, a plurality of recesses (not shown) may be selectively formed on the transparent substrate 202a, each recess corresponding to the position of each LED die 201, and the LED die 201 is placed in the recess. Inside the slot.

2(d) is a light emitting diode device 200 formed according to a first embodiment of the present invention, comprising a transparent substrate 202a comprising a transparent material such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN). a set of electrode pins 203 on the transparent substrate 202a, comprising two electrode pins 203a, 203b; an LED die 201 is placed on the transparent substrate 202a, the LED die 201 is separated from the two electrode pins 203a, 203b Distance, and the LED die 201 has two electrodes 201a, 201b; a set of metal wires 204, comprising two metal wires 204a, 204b correspondingly connecting the two electrodes 201a, 201b of the LED die 201 to the electrode pins 203a, 203b; An encapsulating material 205, such as epoxy or silicone, is packaged on the periphery of the component 20, that is, the encapsulation material 205 is encapsulated on the transparent substrate 202a, the LED die 201, the two electrode pins 203a, 203b, and the two metal wires 204a. , 204b peripheral, and expose a part of the two electrode pins 203a, 203b. Fluorescent powder (not shown) may be selectively dispersed in the encapsulating material 205. In addition, the transparent substrate 202a can also selectively include a recess (not shown) for the LED die 201 to place the LED die 201 therein.

A second embodiment of the light-emitting diode element of the present invention is shown in Fig. 3, and this embodiment is a variation of the first embodiment. The method for forming the LED component of the present embodiment includes: as shown in FIG. 3(a), providing a transparent substrate 302a comprising a transparent material such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN). Forming a plurality of recesses 315; forming complex array electrode pins 303 on the transparent substrate, each set of electrode leads 303 respectively comprising two electrode leads 303a, 303b; forming a phosphor layer 307 on the transparent substrate 302a and The coating is applied to the groove 315 and the sidewall thereof, wherein the phosphor layer 307 can be mixed with phosphor powder in an epoxy resin (Epoxy) or silicone packaging material; a plurality of LED dies 301 are provided for transmission. A bonding material is adhered to the transparent substrate 302a, wherein each LED die 301 has two electrodes 301a, 301b and is spaced apart from the corresponding two electrode pins 303a, 303b, as shown in FIG. b) is shown; a plurality of metal lines 304 are provided, each set of metal lines 304 respectively comprising two metal lines 304a, 304b correspondingly connecting the two electrodes 301a, 301b of each LED die 301 to the electrode pins 303a, 303b; As shown in FIG. 3(c), the transparent substrate 302a is cut to form a plurality of light-emitting diodes Body element 30, and finally, as shown in FIG. 3(d), the LED die 301, the recess 315, and/or the transparent substrate 302a are covered by a package material 308, due to the transparent substrate 302a and the LED die 301. The phosphor layer 307 is provided first. Therefore, in an embodiment of the present invention, an encapsulating material 308 containing the same phosphor powder as the phosphor powder layer 307 may be coated on the exposed portion of the LED die 301. The LED die 301 is completely covered by the encapsulating material 308 containing the phosphor powder. In the present embodiment, the encapsulating material 308 completely covers the opening of the recess 315. Unlike the first embodiment described above, the encapsulating material 308 is substantially flatly attached to the transparent substrate 302a and covers the LED die 301, facilitating thinning of the component or subsequent convenience of applying the optical component thereon. The step of cutting may be performed after the encapsulating material 308 covers the LED component.

Therefore, the light emitting diode element 300 can be formed according to the second embodiment. The transparent substrate 302a comprises a transparent material such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN), and the transparent substrate 302a. Having a recess 315; a phosphor layer 307 on the transparent substrate 302a and coated on the recess 315 and its sidewall; a set of electrode pins 303 on the transparent substrate 302a, comprising two electrode pins 303a, 303b; The LED die 301 is placed on the transparent substrate 302a and located in the recess 315. The LED die 301 is spaced apart from the two electrode pins 303a, 303b, and the LED die 301 has two electrodes 301a, 301b; a group of metals The wire 304 includes two metal wires 304a, 304b correspondingly connecting the two electrodes 301a, 301b of the LED die 301 to the electrode pins 303a, 303b; and a packaging material 308 covering the LED die 301, the recess 315, and/or On the transparent substrate 302a. The encapsulating material 308 is, for example, epoxy (Epoxy) or silicone. Fluorescent powder (not shown) may be selectively dispersed in the encapsulating material 308, and the phosphor may be the same as the phosphor in the phosphor layer 307.

A third embodiment of the light-emitting diode element of the present invention is shown in Fig. 4. The method for forming the LED component of the present embodiment includes: as shown in FIG. 4(a), a first transparent substrate 402a is provided with a transparent material, such as glass, sapphire (Al2O3), CVD diamond. And aluminum nitride (AlN); providing a plurality of LED dies 401 and fixing them on the first transparent substrate 402a, each LED die 401 having two electrodes 401a, 401b; as shown in FIG. 4(b) Providing a second transparent substrate 402b comprising a transparent material, the transparent material being selected as the first transparent substrate 402a, and being the same as or different from the first transparent substrate 402a; forming the complex array electrode pins 403 in the second transparent On the substrate 402b, each set of electrode pins 403 respectively comprise two electrode pins 403a, 403b; then, as shown in FIG. 4(c), the first transparent substrate 402a is aligned with the second transparent substrate 402b, so that each Two electrodes 401a, 401b of an LED die 401 are respectively in contact with the two electrode pins 403b, 403a; the first transparent substrate 402a and the second transparent substrate 402b are cut and joined to form a plurality of light emitting diode elements 40. Finally, As shown in FIG. 4(d), an encapsulation material 405 is used, for example An epoxy resin or a silicone is encapsulated on the periphery of each of the components 40, that is, the first transparent substrate 402a and the second transparent substrate 402b are covered by the encapsulation material 405, and the two electrode pins 403a, 403b are exposed. Fluorescent powder (not shown) may be selectively dispersed in the epoxy resin or silicone resin. In addition, the first transparent substrate 402a can also selectively form a recess (not shown) for the LED die 401 for each LED die 401 to place the LED die 401 therein.

Therefore, the light emitting diode element 400 can be formed according to the third embodiment. The first transparent substrate 402a comprises a transparent material such as glass, sapphire (Al 2 O 3 ), CVD diamond, and aluminum nitride (AlN); The second transparent substrate 402b comprises a transparent material such as glass, sapphire (Al2O3), CVD diamond, and aluminum nitride (AlN), the second transparent substrate 402b is connected to the first transparent substrate 402a; and one set of electrode pins 403 includes two Electrode pins 403a, 403b between the first transparent substrate and the second transparent substrate; and an LED die 401 having two electrodes 401a, 401b disposed on the first transparent substrate 402a and the second transparent substrate 402b Between the two electrodes 401a, 401b of the LED die 401 are correspondingly connected to the two electrode pins 403a, 403b.

A fourth embodiment of the light-emitting diode device of the present invention, as shown in FIG. 5, includes a "self-heat dissipating" design. This embodiment can be combined with the self-heat dissipation layer structure of the embodiment to improve the heat dissipation efficiency of the light emitting diode element based on any of the foregoing first to third embodiments. The method for forming the LED component of the present embodiment includes: as shown in FIG. 5(a), a transparent substrate 502a is provided with a transparent material, and the transparent substrate 502a may be, for example, the transparent substrate 202a in the foregoing embodiments, and transparent. Any one of the substrate 302a, the first transparent substrate 402a, and the second transparent substrate 402b, and a self-heating layer 509 formed on the transparent substrate 502a comprises a transparent high thermal conductive material (for example, thermal conductivity > 100 W/mK). This material combines the characteristics of high heat radiation. The self-heat dissipation layer 509 is formed on the transparent substrate 502a to improve the heat dissipation efficiency of the light-emitting element. The self-heating layer 509 may be a conductive material such as a thin metal or alloy or a carbon-containing conductive material. Tin (Sn), aluminum (Al), gold (Au), platinum (Pt), zinc (Zn), silver (Ag), titanium (Ti), tin (Pb), copper (Cu) can be selected for thin metals or alloys. , nickel (Ni), or an alloy of the above metals. The carbon-containing conductive material may be a conductive material containing a carbon composition close to or equal to 100%, such as graphene. In an embodiment, the self-heating layer 509 comprises a non-conductive material. For example, the carbon-containing non-conductive material may be a non-conductive material having a carbon composition close to or equal to 100%, such as diamond or diamond-like carbon (DLC). . The self-heat dissipation layer 509 may be formed on the transparent substrate 502a as a whole layer, or as shown in FIG. 5(a), forming a plurality of stripe patterns 509Y by, for example, a photolithography etching method, or as shown in FIG. 5(b). A mesh pattern is formed, including a plurality of vertical stripe patterns 509Y and a plurality of horizontal stripe patterns 509X. Taking any of the first or second embodiment as an example, as shown in FIG. 5(c), the electrode pins 503a, 503b are formed on the transparent substrate 502a, and the steps are sequentially completed as shown above. As shown in Figure 5 (d). It should be noted that when the self-heating layer 509 is a conductive material, an insulating layer 510 may be formed between the transparent substrate 502a and the LED die 501 to electrically isolate the self-heating layer 509 and the LED die 501 to avoid short circuit. . Compared with the traditional packaging technology, the heat dissipation problem is solved in the direction of the lead frame, the metal wire, the solid crystal material, etc., but the effect is not necessarily good. The self-heat dissipation layer structure of the invention is combined with the transparent substrate of the foregoing embodiments to provide a large heat dissipation area of the light-emitting diode component and a good heat dissipation mechanism (conduction and convection in contact with air), and has excellent heat dissipation efficiency. In addition, when the self-heat dissipation layer is a conductive material and forms a plurality of stripe patterns 509Y as shown in FIG. 5(a), a portion of the line stripe pattern 509Y may also selectively contact the electrode pins 503a, 503b to provide another The heat dissipation path of the heat dissipation through the electrode pins 503a, 503b; when the self-heat dissipation layer is a non-conductive material, such as a diamond, since the self-heating layer is not required to be considered, the self-heating layer can be selectively connected to the electrode. Pins 503a, 503b are in contact.

The fifth embodiment of the present invention is shown in Fig. 6, and can be applied to the aforementioned first to fourth embodiments in combination. As shown in FIG. 6( a ), the foregoing embodiments can adjust the number of LED dies in each of the illuminating diode elements to include two or more LED dies, for example, simultaneously setting the blue LED dies 601 and The red LED 601' is in a light emitting diode element, wherein a portion of the blue LED die 601 can form a recess (not shown) in the transparent substrate 602a, 602b, respectively, as in the second embodiment described above. A yellow phosphor (not shown) is applied to achieve a warm white light-emitting diode element 60. In addition, as shown in FIG. 6(b), the optical element may be further disposed on the periphery of the transparent substrate of the light-emitting diode element 600 (which is a light-emitting diode element, for example, the side view of the second or third embodiment). 611, comprising either or both of optical element 611a or optical element 611b, wherein optical elements 611a and 611b comprise opposite sides of the hemispherical sandwiched light emitting diode element 600, increasing the light extraction efficiency of the light emitting diode element 600.

The sixth embodiment of the present invention is as shown in FIG. 7. The method for forming the LED component of the present embodiment includes: as shown in FIG. 7(a), a transparent substrate 702a is provided with a transparent material, and the transparent material is selected. As shown in the transparent substrate 202a in the first embodiment; as shown on the left side of FIG. 7(b), a self-heat-dissipating layer 709 is formed on the transparent substrate 702a, and comprises a transparent high thermal conductive material, and can have both high heat radiation. characteristic. The self-heating layer of the present embodiment is a non-conductive material based on the consideration of avoiding short circuit. For example, the carbon-containing non-conductive material may be a non-conductive material having a carbon composition close to or equal to 100%, such as diamond or diamond-like carbon (Diamond-like Carbon). ). Then, a plurality of electrode pins 703 are formed on the transparent substrate 702a on the self-heat dissipation layer 709, and each of the electrode pins 703 includes two electrode pins 703a, 703b. The complex array electrode pins 703 can be, for example, evaporated. The method comprises forming a metal layer, and forming a complex array electrode pin 703 by a photolithography etching method. Next, as shown in FIG. 7(b), a plurality of LED dies 701 are disposed on a substrate 712. 712 is a blue tape in one embodiment. The transparent substrate 702a is aligned with the substrate 712 such that the two electrodes 701a, 701b of each LED die 701 are in contact with the two electrode pins 703b, 703a and fixed on the transparent substrate 702a, respectively, and the LED die 701 is The substrate 712 is separated, wherein the substrate 712 is a blue tape, and the blue film can be heated to reduce the viscosity and separate from the LED die 701. The result is shown in FIG. 7(c); then the chip and the LED crystal are cut. The transparent substrate 702a joined by the particles 701 to form a plurality of light emitting diode elements 70, as shown on the left side of FIG. 7(d), and finally encapsulated in an encapsulating material 708, such as epoxy (epoxy) or silicone. On the periphery of each of the elements 70, a light-emitting diode element 700 as shown on the right side of FIG. 7(d) is formed, and a phosphor powder (not shown) may be selectively dispersed in the epoxy resin or the silicone. In addition, the transparent substrate 702a may also selectively form a recess (not shown) for the LED die 701 for each LED die 701, so that the LED die 701 is placed therein, even as shown in FIG. In the second embodiment of the third embodiment, the phosphor powder may be disposed in the recess and the LED die 701 is placed in the recess and located on the phosphor powder.

As shown in FIG. 7(e), the LED component 700 of the present embodiment can be used in conjunction with a carrier 720. The carrier 720 includes a base 721, and two external power pins 722a and 722b are fixed to the base 721. The base 721 includes a socket 723 for the light emitting diode component of the embodiment. 700 is inserted and fixed. The two external power pins 722a, 722b respectively have an extension portion disposed in the recess 723 to form two power supply pads 722a', 722b'. When the LED component 700 is inserted into the recess 723, The two electrode pins 703a, 703b are respectively in contact with the two power supply pads 722a', 722b', so that the external power source can be supplied to the light emitting diodes via the two external power supply pins 722a, 722b via the two power supply pads 722a', 722b'. Body element 700. In addition, the pedestal 721 can also be designed such that a heat sink comprises a highly thermally conductive material, so as mentioned in the fourth embodiment of FIG. 5, in addition to the self-heating layer 709 on the transparent substrate 702a, Outside the good heat dissipation path, since the self-heat dissipation layer 709 is in contact with the two electrode pins 703a, 703b, the two electrode pins 703a, 703b are in contact with the two power supply pads 722a', 722b', and the two power supply pads 722a', 722b 'Set in the groove 723 and contact with the base 721, so when the base 721 is designed as a heat sink, the above will form another heat dissipation path to help dissipate heat. In the design, the self-heating layer 709 can also be directly contacted with the base 721 to form a heat dissipation path when inserted into the groove 723.

The LED component 700 of the present embodiment has the characteristics of vertical and plug-in type. Therefore, in addition to the above advantages, due to the vertical feature, the LED die 701 is inserted into the recess 723. The upper surface S of the carrier 720 is vertical, providing a large heat dissipation area of the light-emitting diode element 700 and a good heat dissipation mechanism (conduction and convection in contact with air), in particular, the self-heat dissipation layer 709 is disposed on the transparent substrate 702a. Cooling benefits. In the case of a general LED die, the light-emitting diode system is composed of a stack of active layers sandwiched between p-type and n-type semiconductor layers, and the main light-emitting surface is perpendicular to the p-type semiconductor layer, the active layer, and n. The plane of the semiconductor layer stacking direction; or in terms of the amount of light emitted, the amount of light emitted from the side of the general LED die is less than about 20% of the total amount of light emitted, so that the amount of light emitted from the main light emitting surface is greater than about 80% of the total light output, or For double-sided light emission, it is about 40% of the total light output, that is, the light-emitting surface of the main light-emitting surface is at least about 30% larger than the total light-emitting amount of one light-emitting diode. Therefore, in the embodiment, the main light emitting surface of the LED die 701 (perpendicular to the plane of the p-type semiconductor layer, the active layer, and the n-type semiconductor layer stacking direction, or the amount of light emitted is at least about greater than the total output of the light emitting diode) The plane of 30% of the light amount is substantially perpendicular to the upper surface S of the carrier 720, and has a large contact area with the surrounding air to contribute to heat dissipation. The plug-in design eliminates the cost of bonding and makes the repair flexible.

Therefore, as shown in the right side of FIG. 7(d), a light-emitting diode element 700 can be formed according to the sixth embodiment. The transparent substrate 702a comprises a transparent material such as glass, sapphire (Al2O3), CVD diamond, And aluminum nitride (AlN); a self-heating layer 709 comprises a transparent high thermal conductive material on the transparent substrate 702a; a set of electrode pins 703 on the self-heating layer 709, and electrode pins 703 comprising two electrode pins 703a, 703b An LED die 701 is disposed on the transparent substrate 702a and located on the self-heat dissipation layer 709. The LED die 701 has two electrodes 701a, 701b correspondingly connected to the electrode pins 703b, 703a; and an encapsulation material 708, such as a ring. An epoxy resin or silicone is encapsulated on the periphery of the component 70, and the encapsulation material 708 encapsulates the LED die 701 and/or the transparent substrate 702a.

Compared with the conventional light source device, the vertical design of the present invention can effectively improve the horizontal light field and reduce the problem of volume or thickness in application. Taking a backlight module (Backlight) applied to a display device as an example, FIG. 8 shows a conventional backlight module. Since the conventional light-emitting diode element 800 is used, the package tends to bias the light field to be perpendicular to the light, i.e., there is relatively more light in the vertical direction (in the direction of the solid arrow in the figure). In order to make the illumination surface 821 have a relatively uniform light distribution, it is necessary to add an optical element 831 as shown in the figure to adjust the light field, so that part of the light is turned into a horizontal direction (as indicated by a dotted arrow in the figure), and the backlight is caused. The overall thickness h of the module is thickened by the optical element 831 and the volume is increased. In contrast, when the light emitting diode device of the present invention is applied to a light source device, as shown in the seventh embodiment of the present invention, the light emitting diode device 700 of FIG. 7 is applied to, for example, a backlight module (Backlight). At 900 o'clock, due to the design of the transparent substrate and the vertical state, there is good light emission in the horizontal direction. In FIG. 9, each of the light emitting diode elements 700 is vertically inserted into a recess 923 fixed to a carrier 920, and its light field is as shown in the light field case 930 in the figure, due to the transparent substrate and the vertical state design, Therefore, there is good light emission in the horizontal direction, and there is no need to add any optical components to have a uniform light distribution in the horizontal direction. Therefore, the overall thickness of the backlight module is substantially only the size of the crystal grain of h'. The design of the carrier 920 is generally as shown by the carrier 720 of FIG. 7(e). It is noted that the configuration of the LED component 700 on the carrier 920 can be configured in an interleaved manner, such as In a two-dimensional Cartesian coordinate system, the plane S where the groove 923 is located on the carrier 920 can have a virtual x coordinate and a y coordinate to indicate the position of any point above it. , ie (xi, yj), where i, j are real numbers. As shown, x1, x2, x3... and y1, y2, y3, etc. may indicate the position of each of the light-emitting diode elements 700 thereon, as shown, two light-emitting lights on x1 (and x3) The diode element and the two LED components on x2 are located at the interlaced y-axis position (ie, the two LED components on x1 (and x3) are at y1 and y3, and the two illuminations on x2 The diode elements are at y2 and y4), or in other words, three light-emitting diode elements are located substantially at (x1, y1), (x2, y2), (x3, y1), and substantially at ( The position of x2, y1) is not equipped with a light-emitting diode element, because as shown, the position of (x2, y1) can be emitted by the light-emitting diode element substantially at the position of (x2, y2). Complementing it, this configuration can further make the light distribution in the horizontal direction more uniform.

Therefore, a light source device can be formed according to the seventh embodiment. For example, a backlight module 900 includes: a first light emitting diode element; a second light emitting diode element; and a third light emitting diode. The body element 920 has a first surface S, and the first light emitting diode element, the second light emitting diode element, and the third light emitting diode element are all disposed on the first surface S and configured Arranged in a staggered manner, the first surface S comprises a virtual x-coordinate and a y-coordinate (xi, yj) in a two-dimensional Cartesian coordinate system, where i, j are real numbers To indicate the position of any of the above points, the first, second, and third light emitting diode elements are respectively at (x1, y1), (x2, y2), (x3, y1), and substantially at (x2). , y1) is not equipped with a light-emitting diode element.

In the various embodiments described above, elements having the same function have different reference numerals in the embodiments, and have physical, chemical, or electrical characteristics, and unless otherwise specified in the respective embodiments, The same or similar related features are not required to be repeated in the embodiments.

The above embodiments are merely illustrative of the principles of the invention and its advantages, and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is as set forth in the appended claims.

101‧‧‧LED dies

102‧‧‧ radiator

103a, 103b‧‧‧electrode pins

104a, 104b‧‧‧metal wire

20,200‧‧‧Lighting diode components

201‧‧‧ LED dies

201a, 201b‧‧‧ electrodes

202a‧‧‧Transparent substrate

203a, 203b‧‧‧electrode pins

204a, 204b‧‧‧metal wire

30,300‧‧‧Lighting diode components

301‧‧‧LED dies

301a, 301b‧‧‧ electrodes

302a‧‧‧Transparent substrate

303a, 303b‧‧‧electrode pins

304a, 304b‧‧‧ Metal wire

307‧‧‧Flame powder layer

308‧‧‧Packaging materials

315‧‧‧ Groove

40,400‧‧‧Lighting diode components

401‧‧‧LED dies

401a, 401b‧‧‧ electrodes

402a‧‧‧First transparent substrate

402b‧‧‧Second transparent substrate

403a, 403b‧‧‧electrode pins

405‧‧‧Packaging materials

501‧‧‧LED dies

502a‧‧‧Transparent substrate

503a, 503b‧‧‧electrode pins

509, 509X, 509Y‧‧‧ self-heating layer

510‧‧‧Insulation

60‧‧‧Lighting diode components

601‧‧‧Blue crystal

601'‧‧‧Red LED dies

611,611a,611b‧‧‧Optical components

70,700‧‧‧Lighting diode components

701‧‧‧LED dies

701a, 701b‧‧‧ electrodes

702a‧‧‧Transparent basal layer

703a, 703b‧‧‧electrode pins

708‧‧‧Packaging materials

709‧‧‧self-heating layer

712‧‧‧Substrate

720‧‧‧ Carrier

721‧‧‧Base

722a, 722b‧‧‧ external power pin

722a’, 722b’‧‧‧ power supply mat

723‧‧‧ Groove

800‧‧‧Lighting diode components

821‧‧‧Lighting surface

831‧‧‧Optical components

900‧‧‧Backlight module

920‧‧‧ Carrier

923‧‧‧ Groove

930‧‧‧Light field situation

Figure 1A shows the package of a conventional light-emitting diode.

Figure 1B shows a conventional LED component with a heat sink design.

Fig. 2 shows a first embodiment of the light-emitting diode element of the present invention.

Fig. 3 shows a second embodiment of the light-emitting diode element of the present invention.

Fig. 4 shows a third embodiment of the light-emitting diode element of the present invention.

Fig. 5 shows a fourth embodiment of the light-emitting diode element of the present invention.

Fig. 6 shows a fifth embodiment of the light-emitting diode element of the present invention.

Fig. 7 shows a sixth embodiment of the light-emitting diode element of the present invention.

Figure 8 shows a conventional backlight module.

Fig. 9 is a view showing a seventh embodiment of the present invention, illustrating a case where a backlight module is constructed using the light-emitting diode elements of the embodiment of the present invention.

Claims (10)

A lighting module comprising: a carrier having a surface; a first light emitting diode element disposed on the surface and forming a first light field, the first light emitting diode element comprising: An LED die, and a first main light exit surface, and the first main light exit surface is substantially perpendicular to the surface; A second light emitting diode element is disposed on the surface and forms a second light field, the second light field overlapping the first light field. The lighting module of claim 1, further comprising a packaging material covering the first LED component. The light emitting module of claim 2, wherein the first encapsulating material comprises phosphor powder. The illuminating module of claim 1, wherein the second illuminating diode element comprises a second main illuminating surface, and the second main illuminating surface is substantially perpendicular to the surface. The lighting module of claim 1, wherein the carrier comprises a base, and the base comprises a recess. The illuminating module of claim 1, wherein the first illuminating diode further comprises a first transparent substrate and a second transparent substrate, wherein the LED dies are disposed on the first transparent substrate Between the second transparent substrates. The illuminating module of claim 1, wherein the first illuminating diode component further comprises an electrode lead electrically connected to the LED dies. The illuminating module of claim 1, wherein the first illuminating diode element further comprises a transparent substrate, and the first LED dies are formed on the transparent substrate. The illuminating module of claim 8, wherein the first illuminating diode element further comprises a heat dissipating layer on the transparent substrate. The light-emitting module of claim 8, wherein the first light-emitting diode element comprises a phosphor powder, the transparent substrate has a groove and the phosphor powder is located in the groove.