KR20120069999A - Light emitting diode package - Google Patents

Light emitting diode package Download PDF

Info

Publication number
KR20120069999A
KR20120069999A KR1020100131370A KR20100131370A KR20120069999A KR 20120069999 A KR20120069999 A KR 20120069999A KR 1020100131370 A KR1020100131370 A KR 1020100131370A KR 20100131370 A KR20100131370 A KR 20100131370A KR 20120069999 A KR20120069999 A KR 20120069999A
Authority
KR
South Korea
Prior art keywords
light emitting
emitting diode
chip
heat sink
circuit board
Prior art date
Application number
KR1020100131370A
Other languages
Korean (ko)
Inventor
임준성
Original Assignee
주식회사 루셈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 루셈 filed Critical 주식회사 루셈
Priority to KR1020100131370A priority Critical patent/KR20120069999A/en
Publication of KR20120069999A publication Critical patent/KR20120069999A/en

Links

Images

Classifications

    • H01L33/20—
    • H01L33/641—
    • H01L33/642—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Abstract

PURPOSE: A light emitting diode package is provided to reduce a mounting height of a chip by arranging a light emitting diode in a trench. CONSTITUTION: A chip arrangement area is opened on a printed circuit board(20). A heat sink(40) is attached to the lower side of the printed circuit board. A heat sink includes a trench(44) in a partial area corresponding to a chip arrangement area. A light emitting diode chip(10) is mounted in the trench exposed through the chip arrangement area. A light emitting diode chip is electrically connected to a circuit pattern layer(24) through a bonding wire(12).

Description

Light Emitting Diode Package

The present invention relates to a light emitting diode package, and more particularly, to a light emitting diode package having a heat sink attached to a lower portion of a printed circuit board.

In general, a light emitting diode (hereinafter referred to as "LED") refers to a light emitting device in which electrons and grains meet and emit light at a P-N junction by application of a current. The LED device may be mounted on a printed circuit board and manufactured in a package form to emit light by applying a current. Such LEDs have recently been used as backlights for lighting, liquid crystal displays (LCDs), etc., and in particular, their use is gradually increasing due to their excellent efficiency and light emission characteristics compared to other light emitting devices.

On the other hand, as LEDs are gradually miniaturized, some important problems are emerging, among which heat dissipation is a big problem. Heat generated from the LED chip in the LED package has a direct impact on the light emitting performance and lifetime. The reason is that if heat generated in the LED chip is sustained, dislocations, mismatches, etc. occur in the crystal structure of the semiconductor constituting the LED chip. Moreover, high power LED packages have recently been developed, which operate in a high voltage environment, and such high voltages generate more heat in the LED chips.

As a method for improving heat dissipation characteristics in an LED package, a structure for dissipating heat by attaching a plate-shaped heat sink using a predetermined metal plate to a rear surface of a printed circuit board on which an LED chip is mounted has been conventionally proposed. In this structure, the heat generated from the LED chip is discharged through the heat sink through the printed circuit board, that is, the heat generated from the LED chip heat exchanges with the printed circuit board, and heat exchange between the printed circuit board and the heat sink is performed again. Proceed. Such a heat exchange method is complicated in its process, and in particular, its heat dissipation efficiency is not sufficient for use in a high power LED package or a large LED module.

The present invention has been made to solve the above-mentioned problems of the prior art, and heats the LED chip by forming an opening in the printed circuit board in the region where the LED chip is to be mounted and forming a trench in the heat sink attached to the bottom of the LED chip. An object of the present invention is to provide a light emitting diode package capable of dissipating heat more effectively than in the related art through a structure attached to a trench of a sink.

In addition, another object of the present invention is to provide a light emitting diode package which is advantageous for thinning the package by reducing the mounting height of the light emitting diode chip.

The light emitting diode package according to the present invention includes a printed circuit board having a chip arrangement region in which a light emitting diode chip is to be opened, a heat sink having a trench formed in a lower portion of the printed circuit board and at least partially corresponding to the chip arrangement region; And a light emitting diode chip mounted inside the trench of the heat sink exposed through the chip arrangement region.

The printed circuit board may be a flexible printed circuit board including a base layer, a circuit pattern layer, and a cover layer protecting the circuit pattern layer, wherein the light emitting diode chip may be electrically connected to the circuit pattern layer through a bonding wire. have.

The light emitting diode chip may be attached to the bottom surface of the trench exposed by the chip arrangement region with a thermally conductive adhesive layer, wherein the thermally conductive adhesive layer may use at least one of silver (Ag), solder cream, silicon, and thermal compound. . In addition, a plurality of grooves may be formed on the rear surface of the heat sink.

In the light emitting diode package according to the present invention, a predetermined region of the printed circuit board on which the light emitting diode chip is to be mounted is opened, and the light emitting diode chip can be directly attached to the heat sink through the opening. Therefore, in dissipating heat generated in the light emitting diode chip by the heat sink, its efficiency can be greatly increased. In particular, since a trench is formed in a predetermined region of the heat sink in which the light emitting diode chip is mounted, heat generated in the light emitting diode chip can be more effectively radiated by the heat sink, and the light emitting diode is disposed inside the trench of the heat sink. Therefore, the mounting height of the chip can be reduced, which is advantageous for thinning the package. In addition, since a plurality of grooves are formed on the rear surface of the heat sink, heat dissipation efficiency of the heat sink can be improved by increasing the area where the heat sink contacts the atmosphere due to the grooves.

1 is a cross-sectional view schematically showing the structure of a light emitting diode package according to the present invention.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of a light emitting diode package according to the present invention will be described in detail.

The light emitting diode package according to the present invention includes a printed circuit board 20 having a chip arrangement area A on which a light emitting diode chip is to be opened, a heat sink 40 attached to a bottom surface of the printed circuit board 20, The light emitting diode chip 10 is mounted on the heat sink 40 exposed through the chip arrangement region A.

Referring to Figure 1, the detailed configuration of the LED package according to the present invention, the printed circuit board 20, for example, the base layer 22 made of polyimide, the circuit pattern layer 24 made of metal such as copper And a flexible printed circuit board composed of a cover layer 26 protecting the circuit pattern layer 24. In addition, a heat sink 40 is attached to a lower portion of the printed circuit board 20 through a predetermined insulating layer 30. The heat sink 40 may be formed of a material having excellent thermal conductivity, for example, a metal such as silver, copper, aluminum, or an alloy thereof. Here, the chip arrangement region A is formed in the substrate 20 in which the region where the light emitting diode chip 10 is to be opened is formed, and the heat sink 40 has a trench in the region corresponding to the chip arrangement region A. 44 is formed. The light emitting diode chip 10 may be directly attached to the bottom of the trench 44.

In particular, an N-electrode pad (not shown) and a P-electrode pad (not shown) may be formed in the light emitting diode chip 10, and the N-electrode pad and the P-electrode pad may be formed by the bonding wire 12. Each of the circuit pattern layers 24 of the substrate 20 may be electrically connected to each other. In addition, when the light emitting diode chip 10 is attached to the heat sink 40, the light emitting diode chip 10 may be attached using, for example, the thermal conductive adhesive layer 16. Here, at least one of silver (Ag), solder cream, silicon, and thermal compound may be used as the thermal conductive adhesive layer 16. After the light emitting diode chip 10 is attached to the heat sink 40, a predetermined lens 14 may be formed on the light emitting diode chip 10, and the substrate on which the light emitting diode chip 10 is mounted. Peripheral elements 18, such as passive elements such as resistors and capacitors, and active elements such as IC chips, may be mounted together in the peripheral area of 20.

Meanwhile. As shown in FIG. 1, in the heat sink 40 of the LED package according to the present invention, the trench 42 is formed to a predetermined depth in a region (chip arrangement region A) in which the LED chip 10 is to be mounted. It features. In the LED package having such a structure, since the LED chip 10 directly contacts the heat sink 40, heat generated in the LED chip 10 may be directly radiated through the heat sink 40. Furthermore, the trench 44 formed in the chip arrangement region A may minimize the heat transfer path in which heat generated from the light emitting diode chip 10 is radiated through the heat sink 40. The heat dissipation effect can be further improved.

In addition, as shown in FIG. 1, a plurality of grooves 42 may be formed on the rear surface of the heat sink 40. Due to the grooves 42, the area where the rear surface of the heat sink 40 contacts the air is increased, so that heat dissipation efficiency is increased when heat generated from the light emitting diode chip 10 is radiated through the heat sink 40. Can be further improved. 1, the groove 42 is not formed in the chip arrangement region A in which the trench 44 is formed, but the heat sink 40 in which the trench 44 is formed in the chip arrangement region A is illustrated. One of ordinary skill in the art to which the present invention pertains may readily understand that the grooves 42 may be formed on the rear surface opposite to the one surface.

Although a preferred embodiment of the present invention has been described so far, those skilled in the art will be able to implement in a modified form without departing from the essential characteristics of the present invention. Therefore, the embodiments of the present invention described herein are to be considered in descriptive sense only and not for purposes of limitation, and the scope of the present invention is shown in the appended claims rather than the foregoing description, and all differences within the equivalent scope of the present invention Should be interpreted as being included in.

10: light emitting diode chip 12: bonding wire
14 lens 16 adhesive layer
20: printed circuit board 22: base layer
24: circuit pattern layer 26: cover layer
30: insulating layer 40: heat sink
42: home 44: trench

Claims (5)

A printed circuit board having a chip arrangement region in which a light emitting diode chip is to be disposed;
A heat sink attached to a bottom surface of the printed circuit board and having a trench formed in at least a partial region corresponding to the chip arrangement region; And
And a light emitting diode chip mounted in the trench of the heat sink exposed through the chip arrangement region.
The method of claim 1,
The printed circuit board is a flexible printed circuit board including a base layer, a circuit pattern layer, and a cover layer protecting the circuit pattern layer, and the light emitting diode chip is electrically connected to the circuit pattern layer through a bonding wire. LED package.
The method of claim 1,
The light emitting diode chip is a light emitting diode package, characterized in that attached to the bottom surface of the trench exposed by the chip arrangement region with a thermally conductive adhesive layer.
The method of claim 3,
The thermally conductive adhesive layer is a light emitting diode package, characterized in that made of at least one of silver (Ag), solder cream, silicon and thermal compound.
The method of claim 1,
A light emitting diode package, characterized in that a plurality of grooves are formed on the back of the heat sink.
KR1020100131370A 2010-12-21 2010-12-21 Light emitting diode package KR20120069999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020100131370A KR20120069999A (en) 2010-12-21 2010-12-21 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100131370A KR20120069999A (en) 2010-12-21 2010-12-21 Light emitting diode package

Publications (1)

Publication Number Publication Date
KR20120069999A true KR20120069999A (en) 2012-06-29

Family

ID=46687960

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100131370A KR20120069999A (en) 2010-12-21 2010-12-21 Light emitting diode package

Country Status (1)

Country Link
KR (1) KR20120069999A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118016782A (en) * 2024-04-10 2024-05-10 山西中科潞安紫外光电科技有限公司 Deep ultraviolet LED device and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118016782A (en) * 2024-04-10 2024-05-10 山西中科潞安紫外光电科技有限公司 Deep ultraviolet LED device and preparation method thereof

Similar Documents

Publication Publication Date Title
JP5043832B2 (en) Semiconductor light emitting device and manufacturing method thereof
US8513530B2 (en) Package carrier and manufacturing method thereof
US7586126B2 (en) Light emitting diode lighting module with improved heat dissipation structure
TWI645580B (en) Light emitting diode crystal grain and display using the same
US7939919B2 (en) LED-packaging arrangement and light bar employing the same
JP2011233801A (en) Light-emitting element module
KR101320514B1 (en) Light emitting diode package by chip on board
US9801274B2 (en) Light emitting device
KR101051488B1 (en) Method for manufacturing light emitting diode unit, and light emitting diode unit manufactured by this method
JP5038355B2 (en) Optical semiconductor device module
US20100102354A1 (en) Light emitting diode package
KR101166066B1 (en) Light Emitting Diode Package
JP5496975B2 (en) Semiconductor device module
JP6210720B2 (en) LED package
US10784423B2 (en) Light emitting device
TW201407748A (en) LED light bar
KR20120069999A (en) Light emitting diode package
JP2012253073A (en) Semiconductor device
KR20110080548A (en) Light emitting device
KR100979971B1 (en) Method of manufacturing light emitting diode unit and light emitting diode unit manufactured by the method
KR101381947B1 (en) Led module with thermoelectric semiconductor
TW201119102A (en) High heat dissipation chip-on-chip/flip-chip LED
KR101248607B1 (en) Led array module having heat sink structure using heat well
KR101259876B1 (en) Led package having a thermoelectric element and method for manufacturin thereof
KR101180378B1 (en) LED device improved radient heat efficiency and fabricating method thereof

Legal Events

Date Code Title Description
A201 Request for examination
E601 Decision to refuse application