TWM356367U - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
TWM356367U
TWM356367U TW97222748U TW97222748U TWM356367U TW M356367 U TWM356367 U TW M356367U TW 97222748 U TW97222748 U TW 97222748U TW 97222748 U TW97222748 U TW 97222748U TW M356367 U TWM356367 U TW M356367U
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TW
Taiwan
Prior art keywords
heat
plate
heat sink
item
slot
Prior art date
Application number
TW97222748U
Other languages
Chinese (zh)
Inventor
Iv George A Meyer
jian-hong Sun
jie-ping Chen
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Celsia Technologies Taiwan Inc
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Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Priority to TW97222748U priority Critical patent/TWM356367U/en
Publication of TWM356367U publication Critical patent/TWM356367U/en

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Description

M356367 五、新型說明: 【新型所屬之技術領域】 本創作係有關於一種散熱器,尤指—種用於電子器物 的散熱器。 ° 【先前技術】 傳統散熱器通常係包括一導熱座以及複數散熱鰭片, 導熱座係貼接於電子發熱元件以傳遞電子發熱元件所產生 的廢熱’散熱鰭片則設於導熱座之另一端面,且相互間隔 ^列而於各散熱Μ之間形成有氣流通道,以使廢熱可被 "經散熱鰭片的氣流帶走以發揮散熱的作用;而通常亦合 於散熱器的-側設置有對散熱器吹送氣流的: 以提升散熱效能。 欣”'、風扇 然而’此種散熱器在實際使用上仍具有問題點存在, 由,散熱籍片通常係呈平面狀,所以散熱韓片之間所形成 線ί之通道,因此,造成氣流流經氣流 片與氣流兩者的 全吸收廢熱就從氣流通道流出 ^的&w還未完 平面狀的細片之熱接觸:換效率較差;另外, 換效率無法提升的因素之—積#父小,此點亦是造成熱交 是以,如何改善前述之朋 究的課題。 之問相,即成為本創作人所研 3 M356367 【新型内容】 本創作之一目的,在於蔣也 _ ^ ^ 、扶供一種散熱器,藉由散埶κ 之形狀而增加熱接觸面積及廣、、ώ 双…片 及風w滯留在散熱體内的時門 以提高散熱效能。 崎間’ 為了達成上述之目的,本創作係提供一種散敎器,勺 括-導熱板及-散熱體以及—散熱體,里中,敎匕 多數散熱片所組合而成,該散執 έ ^ '、、、體由 =、下端分別成型有一折板,在該折板上成型有-:: ::設:一卡槽’任二相鄰之該散熱片的該扣二 等散熱片之間形成有多數氣流通: 該下鈿折板係連接於該導熱板。 本創作相較於先前技術所達成的功效在於 散熱鰭片呈平面狀造成熱交換 、解决傳統 的乳抓通道呈直線狀造成熱交換時 ^ 交換的面積同時延==呈彎折的形狀,增加熱 最佳的散献效能,^u之間的時間’達到 槿成型於散熱片的卡槽、扣片之级 ==放熱片更緊密地貼合,增加散 : 傳熱效率;再者,剎田认、w 1 h U Κ Μ及 進整個散熱器之散熱效能’Γ反作升傳熱迷率’進而增 【實施方式】 配合圖式說明如 並非用來對本創 有關本創作之詳細說明及技術内容 下然而所附圖式僅提供參考與說明用 4 M356367 作加以限制者。 凊參閱第一至三圖,係分別為本創作散熱片之立體分 解圖、散熱片之立體組合圖以及本創作之立體分解圖,本 創作係提供一種散熱器i,包括一導熱板1〇以及―散孰體 20,其中: … 導熱板10,係為熱傳導性佳的金屬材質所製成,導熱 板10係呈一矩形,而導熱板10底部之端面延伸有一凸塊 .11 ’凸塊11之尺寸係小於導熱㈣之尺寸,而凸_係具 |有與發熱兀件(圖未示)接觸的一接觸面m,·而接觸面 111之真平度要求係鬲於導熱板1〇其他之端面,如此,才 能始導熱板10完全與發熱元件(圖未示)貼接而不降低傳 熱效率。 散熱體20由多數散熱片21所組合而成,散熱片21係為 熱傳導性良好的金屬材質且散熱片21呈連續彎折狀,並於 其上、下端分別成型有一折板2丨1 ,在折板211上成型有 .-扣片2111及開設有一卡槽2112 ’任二相鄰之散熱片以的 扣片2111及卡槽2112係相互卡接,並於該等散熱片21之間 =成有多數氣流通道b,而下端折板211丨係連接於導熱板 進一步說明,下端折板2111係以焊接的方式與導熱板 ίο連接,但不以此為限;另外,散熱片21包含複數橫板 212及與各橫板212呈垂直連接的複數縱板Mg,且位於 散熱片21上、下側的該等縱板213係分別與該等折板211 相互連接,但散熱片21之形狀不以此為限,散熱片21還可 5 M356367 呈波浪狀、鋸齒狀以及三角形波狀等;另外,。 請參閱第四及五圖’係分別為本創作之立體組合圖以 圖沿剖面線5-5之剖視圖,從圖中可看出,由於散 片21之形狀,使得氣流通道5之周圍四邊皆有散數片 減片僅位於氣流通道之兩側的型態相、比之 創作散熱㈣所形成的氣流通^之熱接觸面積較 種形狀亦能對吹送進散熱片21之氣流造成一定程度 I效I,延長亂流停留於散熱體20内的時間,提高熱交換 請參閱第六及七圖,係分别盔 體組合圖以及第山圖⑽而/ 創作另一實施例之立 中,今埶_7之剖視圖’本實施例 二②丨係包括—均溫板3。以及—散熱㈣ _3係設於容2 = ::=間:::-容腔C,毛細 ::厂_之下_下二= 溫Loll的:接觸面321,其真平度之要求同樣高於均 可提含料=面,以均溫板3G取代—般的金屬導熱板, 效能^幫1之熱傳導速度,對於散熱器1的整體散熱 新穎當知本創作之散熱器已具有產業利用性、 公開使帛^ ’又本創作之構造亦未曾見於同類產品及 ^使用’完全符合新型專射請要件,差依專利法提出 6 M356367 【圖式簡單說明】 =圖係本創作散熱片之立體分解圖。 ,圖係本創作散熱片之立體組合圖。 第一圖係本創作之立體分解圖。 第四圖係、本創作之立體組合圖。 第j圖係第四圖沿剖面線5_5之剖視圖。 f八圖係、本創作另一實施例之立體組合圖 第七圖係第六圖沿剖面線7-7之剖視圖。 【主要元件符號說明】 1 散熱器 10 導熱板 11 凸塊 111 接觸面 20 散熱體 21 散熱片 211 折板 2111 扣片 2112 卡槽 2113 貫通槽 2114 凸片 212 橫板 213 縱板 30 均溫板 31 上板 32 下板 33 毛細結構 34 工作流 321 接觸面 ,M356367 b 氣流通道 c 容腔M356367 V. New description: [New technical field] This creation is about a radiator, especially a radiator for electronic objects. [Prior Art] A conventional heat sink usually includes a heat conducting seat and a plurality of heat radiating fins, and the heat conducting seat is attached to the electronic heating element to transfer the waste heat generated by the electronic heating element. The heat radiating fin is disposed on the heat conducting seat. The end faces are spaced apart from each other to form an air flow passage between the heat dissipating fins, so that the waste heat can be taken away by the airflow of the fins to perform heat dissipation; and generally also on the side of the heat sink It is provided with a blowing airflow to the radiator: to improve the heat dissipation performance. Xin "', fan, however, this type of heat sink still has problems in practical use. The heat-dissipating film is usually flat, so the channel formed by the heat-dissipating Korean film, thus causing airflow The total absorption waste heat from both the gas flow piece and the gas flow flows out from the gas flow path and the thermal contact of the flat piece is not completed: the conversion efficiency is poor; in addition, the factor that the conversion efficiency cannot be improved is - the father #小小This point is also the cause of how to improve the above-mentioned issues. It is the creator of this research. 3 M356367 [New content] One of the purposes of this creation is that Jiang also _ ^ ^, Supporting a kind of radiator, increasing the thermal contact area by widening the shape of the κ, and the time gates of the wide, ώ, and the wind w staying in the heat sink to improve the heat dissipation performance. The creation system provides a diffuser, which comprises a heat-conducting plate and a heat-dissipating body and a heat-dissipating body, and a plurality of heat-dissipating fins are combined in the middle, the loose body ' ^ ', , body body =, lower end Forming a flap Forming a -:: :: in the folding plate: a card slot 'any two adjacent heat sinks of the heat sink are formed with a plurality of airflow passages: the lower jaw plate is connected to the The heat-conducting plate. Compared with the prior art, the effect of the creation is that the heat-dissipating fins are flat in shape to cause heat exchange, and the conventional milk-carrying channel is linearly caused to cause heat exchange. The area exchanged is simultaneously delayed == bent. Shape, increase the best heat dissipation performance, the time between ^u 'reaches the card slot formed on the heat sink, the level of the buckle == the heat release sheet fits more closely, increasing the dispersion: heat transfer efficiency; ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Detailed description and technical content However, the drawings are only for reference and description, and are limited by 4 M356367. 凊 Refer to the first to third figures, which are the three-dimensional exploded view of the heat sink and the three-dimensional combination of the heat sink. And the three-dimensional exploded view of this creation, this The heat sink i includes a heat conducting plate 1 and a heat dissipating body 20, wherein: the heat conducting plate 10 is made of a metal material with good thermal conductivity, and the heat conducting plate 10 has a rectangular shape and heat conduction. The end surface of the bottom of the plate 10 extends with a bump. 11 'the size of the bump 11 is smaller than the size of the heat conduction (4), and the convex_clamp has a contact surface m which is in contact with the heat generating element (not shown), and is in contact with The true flatness of the surface 111 is required to be attached to the other end faces of the heat conducting plate 1 so that the heat conducting plate 10 can be completely attached to the heat generating component (not shown) without lowering the heat transfer efficiency. The heat sink 20 is composed of a plurality of heat sinks 21 The fins 21 are made of a metal material having good thermal conductivity, and the fins 21 are continuously bent, and a folded plate 2丨1 is formed on the upper and lower ends thereof, and is formed on the folded plate 211. The cleat 2111 and the clasp 2111 and the card slot 2112 of the two adjacent fins are respectively engaged with each other, and between the fins 21, a plurality of airflow passages b are formed, and the lower end is formed. Folding plate 211 is connected to the heat conducting plate for further explanation, and the lower end flap 2111 The heat sink 21 includes a plurality of horizontal plates 212 and a plurality of vertical plates Mg vertically connected to the horizontal plates 212, and is located on the heat sink 21, and is not limited thereto. The longitudinal plates 213 of the lower side are respectively connected to the folding plates 211, but the shape of the heat sink 21 is not limited thereto, and the heat sink 21 may also have a wave shape, a zigzag shape, a triangular wave shape, and the like; In addition, Please refer to the fourth and fifth figures respectively. The three-dimensional combination diagrams of the original creation are taken along the section line 5-5. It can be seen from the figure that due to the shape of the fragment 21, the four sides of the airflow passage 5 are The type of phase with the smear of the smear is only located on both sides of the airflow channel, and the thermal contact area formed by the airflow formed by the heat dissipation (4) can also cause a certain degree of airflow into the heat sink 21. I effect I, prolong the time that the turbulent flow stays in the heat sink 20, and improve the heat exchange, please refer to the sixth and seventh figures, respectively, the helmet combination diagram and the mountain diagram (10) / create another embodiment of the present, today A cross-sectional view of 埶_7 'This embodiment 2 丨 includes a temperature equalizing plate 3. And - heat dissipation (four) _3 is set in the capacity 2 = ::= between::: - cavity C, capillary: factory _ lower _ lower two = temperature Loll: contact surface 321, its true flatness requirements are also higher than Can add material = surface, replace the metal heat conduction plate with the uniform temperature plate 3G, the heat conduction speed of the efficiency ^1, the novel heat dissipation of the radiator 1 is known as the radiator of the creation has industrial utilization, Publicly made 帛^ 'and the structure of this creation has not been seen in similar products and ^ use 'completely meet the new special requirements, the difference is based on the patent law proposed 6 M356367 [simple description of the figure] = the stereo decomposition of the creation of the heat sink Figure. The figure is a three-dimensional combination of the creation of the heat sink. The first picture is a three-dimensional exploded view of the creation. The fourth picture is a three-dimensional combination of the creation. Figure j is a cross-sectional view of the fourth figure along section line 5-5. f Eight Diagrams, a three-dimensional combination diagram of another embodiment of the present creation The seventh diagram is a sectional view of the sixth diagram along section line 7-7. [Main component symbol description] 1 Heat sink 10 Thermal plate 11 Bump 111 Contact surface 20 Heat sink 21 Heat sink 211 Folding plate 2111 Clasp 2112 Card slot 2113 Through groove 2114 Tab 212 Cross plate 213 Vertical plate 30 Temperature plate 31 Upper plate 32 lower plate 33 capillary structure 34 working flow 321 contact surface, M356367 b air flow channel c cavity

Claims (1)

M356367 六、申請專利範 種散熱器,包括: 一導熱板;以及 連« =體/多數散熱片所組合而成,該散熱片係呈 板上成型有一i於其上、下端分別成型有一折板,在該折 的及開設有一卡槽,任二相鄰之該散熱片 ==係相互卡接,並於該等散熱片之間形成 有夕數“通道’該下端折板係連接於該導熱板。 虫。月求項第i項所述散熱器,其 :=及與各該橫板呈垂直連接的複數縱=2 接。 下側的5縛縱板係分職該等折板相互連 開設:二::項:1項所述散熱器,其中,該扣片周緣 嵌接的-凸片。曰’該卡槽周緣成型有與該貫通槽相互配合 其中,該導熱板遠 其中,該導熱板係 其中,該導熱板係 4 第1項所述散熱器 離該等繼之端面延伸有一凸塊。 5、如清求項第1項所述散熱器 為導熱性良好的—金屬板。 6如明求項第1項所述散熱器.开r,节道 為一均溫板’該均溫板包括相互接合的_:上板=熱 :細結構以及-工作流體,該上板與該下板間;::、一 r該毛細結構係設於該容腔之内周緣面:-容 填注於該容腔内。 Μ 作流體係 9M356367 VI. Applying for a patented radiator, including: a heat-conducting plate; and a combination of «=body/most heat sinks, the heat sink is formed on the plate and has a fold plate formed on the upper and lower ends thereof respectively. In the folding and opening a card slot, any two adjacent heat sinks == are mutually engaged, and a plurality of "channels" are formed between the heat sinks. The lower end flaps are connected to the heat conduction. In the case of the worm, the heat sink described in item i of the month, which: = and the vertical connection with each of the horizontal plates is vertical = 2 connection. The lower side of the 5 binding vertical plate is divided into the folds of the other Opening: 2:: Item: The heat sink of the first aspect, wherein the peripheral edge of the buckle is engaged with the tab. The circumference of the slot is formed to cooperate with the through slot, and the heat conducting plate is far away. The heat conducting plate is characterized in that the heat sink of the heat transfer plate 4 has a bump extending from the end faces of the first item. 5. The heat sink according to item 1 of the invention is a metal plate having good thermal conductivity. 6If the heat sink mentioned in Item 1 of the item is opened, the node is a uniform temperature plate. Inter-joined_: upper plate = heat: fine structure and - working fluid, between the upper plate and the lower plate;::, r The capillary structure is disposed on the inner peripheral surface of the cavity: Within the cavity. Μ Flow system 9
TW97222748U 2008-12-18 2008-12-18 Heat dissipation device TWM356367U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW97222748U TWM356367U (en) 2008-12-18 2008-12-18 Heat dissipation device

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Application Number Priority Date Filing Date Title
TW97222748U TWM356367U (en) 2008-12-18 2008-12-18 Heat dissipation device

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TWM356367U true TWM356367U (en) 2009-05-01

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