M339771 八、新型說明： 【新型所屬之技術領域】 本創作係有關於一種「散熱器模組之鰭片結構(二)」，尤指一種可 使導熱管與散熱基座達到更緊密結合之散熱器模組之鰭片結構。 【先前技術】 按，隨著半導體技術的進步，積體電路的體積亦逐漸縮小，而為了 使積體電路能處理更多的資料，相同體積下的積體電路，已經可以容 •納比以往多上數倍以上的元件，當積體電路内的元件數量越來越多 時，元件工作時所產生的熱能亦越來越大，以常見的中央處理器為例， 在高滿載的工作量時，中央處理器的散發出的熱度，足以使中央處理 器整個燒毀’因此，積體電路的散熱裝置變成為重要的課題。 而一般的散熱器大多透過高導熱係數的金屬材質來製造，同時為了 提高散熱效果，除了將加裝風扇來排熱之外，大多設置為鰭片組的型 態來配合散熱，更進一步透過熱導管來加速排除熱能，以防止積體電 ⑩，路產品燒燬。 • 請參閱第1圖所示，習用散熱器之立體分解圖，由圖中可清楚看出， 習用之散熱器1為具有散熱座Η，散熱座Π上設有管狀槽丨丨丨，而散 熱片組13底部設有摺邊與弧形缺口 132。 散熱器1在組裝時，散熱管12裝設在散熱座11的管狀槽111，續 將散熱片組13放置在散熱座u上，而散熱片組13底部的弧形缺口 132可肷合政熱管12，且散熱片組13之摺邊131將抵壓在散熱座I) 的上方，經由上述方式，散熱座11與散熱管12在傳導熱能時，藉由 5 M339771 散熱片組13之摺邊&、、， 將…、月b傳導到散熱片組13之各散埶月 提高散熱的效率。 ΛΛ; 際生產製造時，為具有下列缺失： "H ’金屬與金屬之間的結合，大多是透過焊接的方式來進 灯’因此’散熱座11與散熱片組13透過焊接的方式組合時，必須將 散熱片組13之各散熱片的摺邊⑶焊固於散熱座η上，再將導熱其 12穿設於管狀槽111中’但由於導熱管12有可能不是那麼的筆直、，吕 可能有部分彎曲’致使在與管狀槽出之結合搭配上，產 緊密結合、產生細細題，導致繼u與 的導熱效率降低。 W之間 故習知具有下列之缺點： 1·散熱元件間空隙過大； 2·易產生熱阻現象； 3·結合度甚差。 是=，,要如何解決上述習用之問題與缺失，即為本案之創作 從事此行業之相贿商職欲研纽善之方向所在者。 “ 【新型内容】 曰故’創作人錄於上述缺失，乃搜集相關資料，經由多方評估及 考量，並峨事於此行業累積之多年經驗，經林斷試作及修改，始 設計出此種散熱器模組之鰭片結構(二)之新型專利者。 σ 爰此，為解決上述習知技術之缺點，本創作之主要目的，係提供 一種可使導熱管與散熱基座更為緊密結合之散熱鰭片。、’、 M339771 —為達上述之目的，本創作係提供—種散熱器模組之鰭片結構 j )术“曰片上之弧狀缺口周沿上係向外延伸並向下傾斜設有-延伸 \田放熱_組結合後’藉由該鰭片上所設置之延伸部對導熱管施以 下射’ ϋ延伸部係呈—弧狀並解齡上賴合，故縣管所受之 :1力壬均飾恶並且更為平均受力，使導熱管與散絲座結合 更為緊後、結合並有更佳之結合效果。 故本創作具有下列之優點 ι不需增加額外成本； 2·不需改變散熱模組之製程； 3·元件間無間隙結合性較佳； 4·無熱阻之情事產生。 本創作之上述目的及其結構與功能上的特性，將依據所附圖式之 較佳實施例予以說明。 【實施方式】 ，本創作倾供—種「散熱賴組之鰭片結構㈡」，_係為本創 .作較佳實施例，請參 2、3、4圖，如圖所示散熱模組Α係由一散 熱鰭片組4、一導熱管3、一散熱基座2所組成’該散熱基座2上係設 有-弧狀溝槽21並且可供導鮮3容置於該弧狀韻21中；該散熱 鰭片組4係由減片散熱鰭片41彼此堆疊所組成，該散熱籍片41侧 邊係設有-擅邊4Η ’並於散熱鰭片41上另開設有—弧狀缺口 412， 於該弧狀缺α 412周沿上係向外延伸並向下傾斜設有—錄形之延伸 部413，該延伸部413與摺邊411間係具有一缺口 414，使該延伸部 M339771 散熱基座2 孤狀溝槽21 導熱管3 散熱鰭片組4 散熱鰭片41 摺邊411 ~孤狀缺口 412 延伸部413 缺口 414M339771 VIII. New Description: [New Technology Field] This creation is about a "finor structure of a heat sink module (2)", especially a heat sink that allows the heat pipe to be more closely integrated with the heat sink base. The fin structure of the module. [Prior Art] According to the advancement of semiconductor technology, the volume of the integrated circuit is gradually reduced, and in order to enable the integrated circuit to process more data, the integrated circuit of the same volume can be accommodated. More than a few times more components, when the number of components in the integrated circuit is increasing, the thermal energy generated by the component is also getting larger and larger, taking the common central processor as an example, the workload at high full load At the time, the heat generated by the central processing unit is enough to cause the central processing unit to burn out completely. Therefore, the heat sink of the integrated circuit becomes an important issue. The general heat sinks are mostly made of metal materials with high thermal conductivity. In order to improve the heat dissipation effect, in addition to adding a fan to dissipate heat, most of them are set to the fin group type to match heat dissipation, and further heat is transmitted. The conduit is used to accelerate the removal of thermal energy to prevent the build-up of electricity and the burning of the road products. • Please refer to the exploded view of the conventional heat sink shown in Figure 1. It can be clearly seen from the figure that the conventional heat sink 1 has a heat sink seat, and the heat sink seat is provided with a tubular groove and heat dissipation. The bottom of the set 13 is provided with a folded edge and an arcuate notch 132. When the heat sink 1 is assembled, the heat pipe 12 is installed in the tubular groove 111 of the heat sink 11, and the heat sink group 13 is continuously placed on the heat sink seat u, and the arcuate notch 132 at the bottom of the heat sink group 13 can be combined with the heat pipe. 12, and the flange 131 of the heat sink group 13 will be pressed against the heat sink I). In the above manner, when the heat sink 11 and the heat pipe 12 conduct heat, the 5 M339771 heat sink group 13 is folded &;,,, ..., the monthly b is transmitted to the heat sink group 13 to improve the efficiency of heat dissipation. ΛΛ; In the case of production, there are the following defects: "H' metal-to-metal bonding, mostly by soldering into the lamp 'so the heat sink 11 and the heat sink group 13 are welded together The flanges (3) of the fins of the heat sink group 13 must be welded to the heat sink η, and then the heat conduction 12 is passed through the tubular groove 111. However, since the heat pipe 12 may not be so straight, Lu There may be partial bending, which results in a close combination with the tubular groove, which produces a tight bond and produces fine problems, resulting in a decrease in thermal conductivity following u. The conventional knowledge between W has the following disadvantages: 1. The gap between the heat dissipating components is too large; 2. The thermal resistance is easy to occur; 3. The degree of bonding is very poor. Yes =,, how to solve the above problems and lack of use, that is, the creation of this case. "[New Content] 曰故's creators recorded the above-mentioned deficiencies, collected relevant information, through multi-party evaluation and consideration, and accumulated many years of experience accumulated in this industry, through the forest trial and modification, began to design such heat dissipation The novel patent of the fin structure of the module (2) σ 爰 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Heat sink fins, ', M339771 - for the above purpose, this creation provides a fin structure of the radiator module j) "The arc-shaped notch on the cymbal extends outward and slopes downwards With - extension \ field heat release _ group combination 'by the extension provided on the fin to apply the following to the heat pipe ϋ ϋ extension system is - arc and solution age, so the county management : 1 force 饰 饰 饰 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰 饰Therefore, this creation has the following advantages: ι does not need to add extra cost; 2) does not need to change the process of the heat dissipation module; 3) no gap between components is better; 4) no heat resistance. The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings. [Embodiment], this creation is provided as a kind of "Fixed structure of the heat dissipation group (2)", which is a preferred embodiment. Please refer to Figures 2, 3 and 4, as shown in the figure. The crucible is composed of a heat dissipating fin set 4, a heat conducting tube 3, and a heat dissipating base 2. The heat dissipating base 2 is provided with an arcuate groove 21 and is accommodated in the arc. In the rhyme 21, the heat dissipating fin set 4 is composed of the finned fins 41 stacked on each other, and the side of the heat dissipating fin 41 is provided with an arm edge 4′′ and is further provided on the heat dissipating fin 41. The notch 412 is outwardly extended on the circumference of the arc-shaped a 412 and is inclined downwardly to provide a protrusion 413. The extension 413 and the flange 411 have a notch 414 for the extension. M339771 Heat sink base 2 Solitary groove 21 Heat pipe 3 Heat sink fin set 4 Heat sink fin 41 Fold 411 ~ Solitary notch 412 Extension 413 Notch 414