M337563 八、新型說明: 【新型所屬之技術領域】 本創作有關於基板取出裝置,特別有關於一次取出一片 積載之基板的基板取出裝置。 v 【先前技術】 習知從積載之片狀構件中每次供給最上位置之一片構 件的裝置,必須防止同時供給2片以上。如圖19所示, 以上述方式積載之片狀構件,例如為用以組裝半導體裝置 等電子零件之印刷電路基板等基板s。基板s形成有通孔 TH (圖中塗黑之區域)或縫隙SL (圖中之斜線區域)等貫通 表面/背面的多個孔。在從積載有此種基板s之基板供給 部,藉由例如全面真空吸著而撿拾載置在最上位置之基^ • S時,對於第2片以下之基板s亦可能產生強吸著力。 ,例如,如圖20A和圖20B所示,說明送風機吸著方式, 使積載在基板盒5〇2内之基板s由吸著台5〇1之吸著面真 φ工吸著。另外,圖2〇a和圖2〇β以剖面圖表示送風機吸著 方式之概略裝置構造。在吸著台5〇1之吸著面形成有多個 吸引孔。夕個吸引孔受送風機(圖中未顯示)吸引,當吸著 σ 1之吸著面配置在基板盒502之開口部附近時,在基 板盒502之内部產生負壓。然後’最上位置之基板s,藉 '由來自吸著台501之吸引力受吸著面真空吸著而從基板 、盒502撿拾。 仁是如圖20A所示,因為在基板s形成有通孔TH或 缝隙SL彡貫通表面/背面之多個孔,所以來自吸著台501 5 M337563 之吸引力,亦輾轉作用於第2片以後之基板s。例如,當 最上位置和由最上位置起第2片基板s相互間密著而沒有 間隙’且第3片基板s麵曲時,吸引力明顯作用於該第2 片基板s。亦即,最上位置之基板8和吸著台5〇1之間, 由於送風機之吸引而成為負壓,第2片和第3片基板$之 間隙則造成正壓(大氣壓),所以最上位置和第2片之基板 s容易浮上。另外,即使最上位置之基板s和第2片之基 板s產生偏移時,形成在最上位置基板s之通孔th或縫· 隙SL,產生與吸著台5〇1之吸引孔同樣的作用,使第2 · 片之基板S容易浮上。因此,如圖2〇β所示,造成吸著台 501之吸著面同時真空吸著最上位置和第2片之基板$而 檢拾之。 . 此種從最上位置分離第2片以下構件之方法,揭示在例 •如曰本專利特開2005 —335843號公報(以下稱為專利文獻 1)中使用黏著構件之基板取出裝置。如圖21A和圖21B ⑩所示,上述基板取出裝置對於積載在升降台5〇5上之基板 以黏著構件504露出到下方之狀態,使黏著構件臂5〇3 犬出到該基板S上。然後,使配置在積載之最上位置的基· 板S之上面和黏著構件5〇4相接觸(圖21 a之狀態)。然 後,使升降台505下降,在最上位置基板s和其他基板s 之間形成間隙(圖21B之狀態)。然後,使夾入構件等插入 到該間隙,從上部吸引基板s而只吸引最上位置之基板 S。上述基板取出裝置不只在最上位置之基板S和第2片 之基板S重疊為一致之情況,在最上位置之基板s和第2 M337563 片之基板產生偏移之情況,亦可以只取出最上位置之基板 _ 但是,上述專利文獻1所揭示之基板取出装置的問題在 i於,黏著構件5〇4所具有黏著力會降低。例如,基板8本 i身會從其端部等產生纖維屑等異物,該異物黏著在黏著構 件504上,使黏著構件之黏著力降低。當此種黏著力 持續降低後,無法達成只黏著最上位置之基板3而從其他 之基板s分離的功能,所以黏著構件5〇4可連續使用之次 數受到限制。因此,對於上述基板取出裝置,需要維護黏 著構件504,更具體而言,當黏著構件5〇4之黏著力降低 時,需要恢復(refresh)其黏著力之作業。 另外可考慮藉由吸著面積較小之吸著襯墊等真空吸著 •於基板S之-部份而檢拾的方式。但是,在此種方式中, •因為需要使未形成有通孔TH或縫隙SL之部位與吸著槪塾 相接觸,所以需要依照供給之基板s的形狀調整吸著概塾 籲之位置。因此,料每-種基板皆必須進行該調整所需要 之作業。另外,因為真空吸著於基板3之一部份,所以在 基板S上施加集中之應力,成為基板s變形或污損之原 因。另外,因基板S之形狀而異,可能沒有未具貫通孔之 適當部位可抵接於吸著襯墊’有可能無法撿拾。 【新型内容】 可以極度減 而只取出積 因此’本創作之目的是提供基板取出裝置 少瓜置之維護作業’同時可以防止取出2片 載在最上位置之基板。 M337563 為達成上述目的,本創作1古 別邗具有以下所述之特徵。 „是一種基板取出裝置’用來從積載之基板中取 出土板。基板取出裝置具備有吸著單元和升 單元至少具備有第i吸著部,以1 再及者 ί仏里七甘』, 八及者面只吸者積載於最 上位置之基板的上面端部附近。升降機構使吸著單 降。升降機構將吸著單元下降到使第i吸著部之吸 近最上位置基板之上面端部附近的位置。第卜 吸!面吸著在最上位置之基板的上面端部附近。升降:構 在弟1吸著部之吸著面吸著在最上位置基板之上面 附近的狀態下,使吸著單元上升。 ,在第1吸著部之吸著 用以吸引外部之氣體的 第2態樣是在上述第1態樣甲 面,以格子陣列或交錯陣列形成有 多個吸引孔。 第3態樣是在上述第2態樣中,使基板具有多個貫通 孔。形成在第1吸著部之吸著面的吸引孔之總面積,大於 形成在該吸著面所吸著之部位的基板貫通孔之總面積。、 第4態樣是在上述第2態樣中,使基板具有多個貫通 孔。吸引孔全部形成在第i吸著部之吸著面所含部份區域 内。形成在第1吸著部之吸著面的吸引孔之總面積,大於 形成在與具有吸引孔之區域相抵接之部位的基板貫通孔 之總面積。 第5態樣是在上述第2態樣中,將第丨吸著部之吸著面 分割成為多個區域,在該多個區域中分別以不同之孔數密 度形成吸引孔。 M337563 第j態樣是在上述第丨態樣中,使吸著單元更包含有第 2_吸f ’對於最上位置基板之上面,以其吸著面吸著不 同於第1及著部所吸著之區域的區域。第2吸著部依照升 降機構之上升動作,當在最上位置之基板和其他基板之間 形成有間隙時’使其吸著面吸著在最上位置基板之上面。 第7態樣是在上述第6態樣中,更具備有搖動機構。搖 動機構以第1吸著部之吸著面的長軸方向作為中心,搖動 吸著單元。 •第8態樣是在上述第7態樣中,使吸著單元更包含有後 而抵接=件’自第i吸著部之吸著面吸著在最上位置基板 之上面前端部附近時,抵接於該基板之後端。 第態樣是在上述第6態樣中,更具備有吸著壓力控制 .部。吸著壓力控制部㈣供給到f 1吸著部和第2吸著部 • 弓I [力1著壓力控制部纟帛1吸著部吸著最上位置 基板之上面端部附近時,將第丨吸引壓力供給到該第1吸 籲著部’依照升降機構之上升動作,當在最上位置之基板和 其他基板之間形成有間隙時,將比第1吸引壓力更強U 2吸引壓力供給到第丨吸著部和第2吸著部。 依照上述第1態樣,在積載之基板中,只吸著最上位置 基板之端部附近而將其提起。將該基板提起之力量為吸著 力,所以不會老化’不需要如習知使用黏著構件等技術所 必要之維護。另外,經由只吸著最上位置基板之端部附近 而將其提起,可以容易地只剝離最上位置之基板,即使= 形成有貫通表面/背面之多個孔的基板,在積载之多個基 M337563 板中,亦可以防止取出2片,可以只取出載置在最上位置 之基板。 •依照上述第2態樣,因為在第卜及著部之吸著面設有多 個吸引孔,所以在取出形成有貫通表面/背面之多個孔的 基板時,作用於從最上位置起第2片之基板的吸引力,大 於作用在最上位置之基板的吸引力。 依…、上述第3悲樣’因為吸引孔之總面積大於吸著面所 面對之基板的貫通孔總面積,所以可提高防止取出2片之 效果。 —依妝上述第4悲樣,因為形成有吸引孔之區域集中在吸 著面之-部份,所以當吸著尺寸較小之基板時,該區域和 遠基板相吸著’即使對於尺寸較小之基板,亦可以穩定地 ^ 取出基板。 '依照上述第5態樣’依照成為取出對象之基板的尺寸, 5周整與該基板相吸著之吸著面的區域,可以穩定地取出各 _種尺寸之基板。 y依照上述第6態樣,在最上位置之基板和其他基板之間 形成間隙後,因為利用多個吸著部吸著且固定基板,所以 可以穩定地保持基板。 立依照上述第7態樣,因為吸著單元可搖動,在第丨吸著 P之吸著面吸著在最上位置基板之上面端部附近的狀態 下搖動吸著單元,可以將最上位置基板之一方端部提 升所以在最上位置之基板和其他基板之間容易形成間 隙。 M337563 依照上述第8態樣,在第1吸著部之吸著面吸著在最上 位置基板之上面端部附近的狀態下,經由使該基板之後端 與後端抵接構件相抵接,同時搖動吸著單元,可以用來按 壓最上位置基板之另外一方端部,同時只提升一方之端 部,所以在最上位置之基板和其他基板之間更容易形成間 隙。 依照上述第9態樣,在最上位置之基板和其他基板之間 形成間隙前,降低供給到第丨吸著部之壓力,可以降低施 加在伙敢上位置起弟2片之基板的吸引力之絕對值,可以 提高防止取出2片之效果。 本創作之該等和其他目的、特徵、態樣和效果,經由對 照附圖,從以下之詳細說明可以更進一層地明白。 ^【實施方式】 . 參照圖1〜圖5說明搭載有本創作一實施形態之基板取 出裝置的基板檢查裝置。其中,圖前視圖,表示該基 鲁板檢查裝置之概略構造。圖2是前視圖,表示該基板檢查 裝置之概略構造。圖3是前視圖,表示氣缸伸長狀態下基 板檢查裝置之概略構造。圖4概略地表示該基板檢查裝置 之空壓機構。圖5是後視圖,表示該基板檢查裝置中,用 以驅動旋轉構件使其旋轉之機構的構造。另外,為使各個 構造部之位置關係明確,基板檢查裝置丨之構造並未全部 顯示於圖1〜圖5中,特此說明。 —在圖1和圖2中,基板檢查裝置i具備有第i檢查站2、 第2檢查站3、A面檢查頭4、B面檢查頭5、框架6、基 11 M337563 板供給部7、基板儲存部8、第1基板搬運輸送帶1〇、第 2基板搬運輸送帶u、和控制部(圖中未顯示)。另外,基 •板供給部7相當於本創作之基板取出裝置之-實例。在I 處基板檢查裝置丨之被檢查體之—實例是印刷基板等基 板S,用來組裝半導體裝置等電子零件,如先前技術所說 明之方式,形成有通孔TH或縫隙SL等貫通表面/背面之 多個孔。另外,上述基板5例如為需要檢查其兩面之外觀 癱的兩面基板。又,以被檢查體之基板S—方之主面作為A 面,另外一方之主面作為β面。 第1檢查站2具有第丨旋轉構件21、A面檢查吸著台 22、氣缸23、和第!旋轉軸24。第}旋轉構件以且有: 致長方體之形狀,可以以第1旋轉軸24為中心,在圖示 *之A方向旋轉。在與第1旋轉軸24平行之第丨旋轉構件 .21的4個側面,分別經由氣缸23a〜23d而設有4個A面 檢查吸著台22a〜22d。在圖1中,第!旋轉轴24配置成 φ垂直於紙面,經由3個氣缸23a(在圖1中只顯示2個氣 缸23a)而設置a面檢查吸著台22a,其位於第i旋轉軸 之上方、、二由3個氣缸23b(在圖1中只顯示2個之 氣缸23b)而設置A面檢查吸著台22b,其位於第丨旋轉軸 4之左方、’’二由3個氣缸23c(在圖1中只顯示2個之氣 ,缸23c)而設置A面檢查吸著台22c,其位於第}旋轉軸 ' 24之下方,A面檢查吸著台22a和22c配置成互相平行。 另外,經由3個氣缸23d(在圖1中只顯示2個氣缸23d), 設置A面檢查吸著台22d,其位於第丨旋轉軸24之右方, 12 M337563 A面檢查吸著台22b和22d配置成互相平行。 第2檢查站3設置成與第1檢查站2並排。第2檢查站 3具有第2旋轉構件31、B面檢查吸著台32、氣缸33、 和第2旋轉軸34。第2旋轉構件31具有與第丨旋轉構件 21同樣之大致長方體形狀,可以以與第1旋轉軸24平行 之第2旋轉軸34作為中心在圖示之B方向旋轉。在與第 2旋轉軸34平行之第2旋轉構件31的4個侧面,分別經 由氣缸33a〜33d而設置4個β面檢查吸著台32a〜32d。在 圖1中,第2旋轉軸34配置成垂直於紙面,經由3個氣 缸33a(在圖1中只顯示2個氣缸33a)而設置B面檢查吸 著台32a ’其位於第2旋轉軸34之正上方。經由3個氣 缸33b(在圖1中只顯示2個氣缸33b)而設置B面檢查吸 .著台32b,其位於第2旋轉軸34之左方,B面檢查吸著台 .321)和A面檢查吸著台22d配置成互相面對面。經由3個 氣缸33c(在圖1中只顯示2個氣缸33c)而設置B面檢查 φ吸著台32c,其位於第2旋轉轴34之下方,β面檢查吸著 台32a和32c配置成互相平行。另外,經由3個氣缸33d(在 圖1中只顯示2個氣缸33d)而設置β面檢查吸著台32c, 其位於第2旋轉軸34之右方,B面檢查吸著台32b和32d 配置成互相平行。 如圖1和圖2所示,大致上框架β由檢查頭樑6丨、3個 線性軸承62a〜62c、本體基座63、抵接構件64、和螺栓 65構成。本體基座63由既定之支持柱固定於平面而位於 第1檢查站2和第2檢查站3之上部。線性軸承62a〜62c 13 M337563 = 道和滑動塊、軸和軸承或套筒、導引執道和導 引时寻。種組合而構成,其一實例是使 3個線性軸承62a〜62c分 月動塊 R90U1 刀刟匕3軌道621a〜621c,滑動塊 Γ1ΛΓ ' 622b2' "σ 622c} iiLit 621-621c 本肢基座63之上面(另外,在圖2中,設在檢查頭樑61 下部之執遏621和滑動塊622以虛線表示)。軌道 621a〜621c設置成互相隔開既定之間隔而平行並排 道_作為中心,在其兩侧配置有轨道_和仙。 另外,在軌道621a和621b之間的下部空間配置有第i檢 查站2 ’在執道62lb和621c之間的下部空間配置有第2 檢查站3。另外,在本體基座63,於軌道““之上部空 間設有與軌道621b平行之螺栓65,#由線性馬達651驅 動而旋轉。在此處線性馬達651之驅動由上述控制部所控 制。另外,在圖1和圖2中,支持轨道621a〜621c之本體 基座63顯示為互相分離,但是如此顯示僅為說明其與其 他構造部之關係,實則各個本體基座63至少在第丨檢查 站2和第2檢查站3之上部空間分別形成有開口部,互相 連結而固定設置。另外,多個抵接構件64(例如,對於上 述開口部分別設有3個)分別配置在同一平面上,朝向上 述開口部突出,而固定設置在本體基座63。 檢查頭樑61架設在固定於本體基座63之上面的執道 621 a〜621c之間。在檢查頭樑61之下部設有滑動塊622a、 622bl、622b2和622c。另外,滑動塊622a卡合成可以沿 著執道621a移動,滑動塊622bl和622b2卡合成可以沿 14 M337563 著執道621b移動,滑動塊622c卡合成可以沿著執道621c 移動。另外’檢查頭樑61在滑動塊622bl和622b2之上 部與螺栓65螺合。因此,當線性馬達651驅動時,螺栓 65旋轉’檢查頭樑61沿並排設置有執道621a〜621c之方 向(圖示之C方向),在本體基座63上移動。 在杈查頭樑61配置有 頭 。A面檢查頭4和B面檢查頭5分別具備有CCD攝影 機等攝影裝置(圖中未顯示),攝影裝置經由朝向下部開口 之縫隙41和51(圖2之虛線所示)分別對檢查頭樑61之 下部空間攝影。A面檢查頭4配置在滑動塊6仏和滑動 塊622M和622b2之間的檢查頭樑61上。具體而言由 ,述可以明白,當第1檢查站2之a面檢查吸著台固 定在與抵接構件64相抵接之位置時,檢查頭樑Η在圖示 Q向移動,使A面檢查頭4配置在A面檢查頭4之攝影 褒置可以對吸著在該A面檢查吸著台22之基板s攝影的 =置另外’ B面檢查頭5配置在滑動塊62加和⑽匕2 人滑動塊622c之間的檢查頭樑61上。具體而言, 查吸著台32固定在與抵接構件二抵 :置^查頭樑61在圖示c方向移動,使B面檢 查頭5配置在檢查頭5之攝縣置可㈣ 面檢查吸著台32之基板s攝影的位置。 在以 給部7配置在第1檢查站2之下部空對第i 欢—站2供給積載在第!基板搬運輸送帶上之 由後述可以明白,基板供給部7 土板s 八備有吸著單元7〇、搖 15 M337563 動機構η、升降支持構件72、升降機構73、搬運板74 和搬運板移動機構75。另外,在圖1中只顯示基板供仏 部7之搬運板74和搬運板移動機構75,省略其他構成元 件之圖示。 如圖2所示,在第1基板搬運輸送帶1G上,區分種類 而積載受基板檢查震置i檢查前之基板s,在吸著單元7〇 之正下空間配置任-種之基板s。然後,吸著單元根 據上,制部之控制,從積載在其下部之基板s中提起載 置在最上部之基板st ’將基板St載置在搬運板74上。 另外’搬運板74亦為藉由上述控制部之控制,隨搬運板 移動機構75之驅動,而可在圖示之〇方向移動的結構。 另外,搬運板74隨搬運板移動機構75之驅動,將載置在 •其上面之基板St搬運到a面檢查吸著台22之正下位置。 -另外,基板供給部7供給之檢查前基板S積載在第丨基板 搬運輸送帶10上,分別成為一方主面之A面向下。另外, φ由後述可以明白,當第i檢查站2之A面檢查吸著台Μ 降下到下方時,該A面檢查吸著台22之吸著面配置在載 置於搬運板74上之基板St附近。 基板收納部8具備有3個基板盒81a〜81c、3個升降台 8 2a〜82c、轉盤83、第1搬出輸送帶84、和一對第2搬出 輸达帶85。升降台82a〜82c分別設在基板盒81 a〜81C之 内部,在升降台82a〜82c上之基板盒81a〜81c内積載基板 檢查裝置1檢查後之基板S。另外,升降台82a〜82c分別 根據上述控制部之控制上下移動,例如控制成使載置在最 16 M337563 上部之基板s在上下方向的位置為一定。例如,在基板盒 81a〜81c内,順序重疊基板檢查裝置J所檢查出A面和^ .或B面不合格的基板Snge該等基板盒81a〜8ic配置在轉 盤83之旋轉平面上。轉盤83在圖示D方向上之旋轉和停 ‘止位置由上述控制部所控制,將基板盒81a~8ic之任一個 配置在第2檢查站3正下之空間。另外,由基板收納部8 收納之檢查後基板Sng,分別積载在基板盒8ia〜8lc内成 癱為A面向上。例如,當第2檢查站3之B面檢查吸著台 32吸著固定基板Sng,降下到下方,解除該吸著時,在: 置於該B面檢查吸著台32之正下的基板盒心七c内, 堆積該基板Sng。 第1搬出輸送帶84為藉由上述控制部之控制而可以在 j不之Η方向移動的結構…對第2搬出輸送帶85配置 •在第2基板搬運輸送帶U之上部,成為藉由上述控制部 之控制而可以分別在圖示之U向移動的結構。例如,第 籲^輸送帶84和第2搬出輸送帶⑼將由基板檢查裝置 於^為Α面和β面合格之基板SQk搬出到第2基板搬運 輸迗帶11。 田弟2檢查站3之6面檢查吸著台32吸著且固定基板 降下到下方時,第i搬出輸送帶84朝向圖示之Μ ^吸,°亥β面檢查吸著台32之正下位置(亦即,β面檢 者σ 32和基板盒81 a〜81c任何一個之間)。鋏後,當 =查吸著台32解除基板sok之吸著時,基板s〇k載 弟1搬出輸送帶84上。然:後,第!搬出輸送帶以成 17 M337563 當第1搬Μ 2 土板搬運輪送帶11附近之位置。 列之狀㈣輪送帶85配置成排為一 :才—在使基板S〇k朝向第2搬出輸送帶85上移 • Η…•弟\搬出輸送帶84和第2搬出輸送帶85之皮 ::5°上疋日士,。_然Λ’當基板sok完全移動到第2搬出輸送 ^ 寸’―對第2搬出輸送帶85在圖示之I方向移動 =^離二藉此’第2搬出輸送帶85上之基板糾落 乂、在弟2基板搬運輸送帶u上或第2基板搬運輪 达f 上之其他基板Sok上而堆積。 其次,參照圖1〜圖3說明第i檢查站2和第2檢查站3 所刀另J具備之氣缸2 3和3 3的伸縮動作。 •如上,之方式,在帛1旋轉構件21設有分別支持A面 檢查吸著台22a〜22d之氣紅23a〜23d。氣缸23a〜23d構建 成依照上述控制部之控制可以伸縮,利用伸縮動作而改變 鲁其所分別支持之A面檢查吸著台22a〜22d和第1旋轉軸 24的距離。圖!是氣缸23a〜23d壓縮之狀態,A面檢查吸 著台22a~22d分別配置在第丨旋轉構件21之側面附近。 另外,圖3是氣缸23a〜23d伸長之狀態,A面檢查吸著台 22a〜22d分別配置在遠離第1旋轉構件21之位置。 如圖2和圖3所示,配置在第1旋轉軸24正上方之A 面檢查吸著台22a,在氣缸23a伸長時,其外緣部之上面 (對弟1旋轉軸24成為外侧之面)被定位成與抵接構件64 相抵接。以下將被定位成與該抵接構件64相抵接之a面 18 M337563 k查及著Ό 22的位置稱為a面檢查位置。另外,如圖2 所不,在本實施例中,為將A面檢查吸著台…穩定地定 位在A面檢查位置,所以設定成設置抵接構件64之位置 (3個位置)包含氣缸23a支持a面檢查吸著台22a之位置 (3個位置)。 另外,如圖3所示,配置在第i旋轉軸24下方之人面 檢查吸著台22c,在氣缸23c伸長時,該a面檢查吸著台 22c之吸著面配置在載置於搬運板74上之基板^的上部 響附近。 另外,如圖3所示,配置在第}旋轉軸24右方之A面 檢查吸著台22d的吸著面,在氣缸23d伸長時,同樣地與 氣缸33b伸長之B面檢查吸著台321)之吸著面相抵接。以 ^下,將A面檢查吸著台22之吸著面和B面檢查吸著台32 之吸著面的抵接位置稱為基板交接位置。 另外,在第2旋轉構件31設有分別支持β面檢查吸著 φ台32a〜32d之氣缸Ma〜33d。氣缸Ma〜3如構建成依照上 述控制部之控制而可以伸縮,利用伸縮動作改變其所分別 支持之B面檢查吸著台32a〜32d和第2旋轉軸34的距離。 圖1是氣缸33a〜33d壓縮之狀態,B面檢查吸著台32a〜32d 分別配置在苐2旋轉構件31之侧面附近。另外,圖3是 氣缸33a〜33d伸長之狀態,B面檢查吸著台32a〜32d分別 配置在遠離第2旋轉構件31之位置。 如圖2和圖3所示,配置在第2旋轉軸34正上方之β 面檢查吸者台32a’在氣缸3 3 a伸長時,其外緣部之上面 M337563 (對第2旋轉軸34成為外侧之面)被定位成與抵接構件64 相抵接。以下將被定位成與抵接構件64相抵接之B面檢 查吸著台32的位置稱為B面檢查位置。另外,如圖2所 示,在本實施例中,為將B面檢查吸著台32a穩定地定位 在B面檢查位置,所以設定成設置抵接構件64之位置(3 個位置)包含氣缸33a支持B面檢查吸著台32a之位置(3 個位置)。 另外,如圖3所示,配置在第2旋轉轴34下方之B面 檢查吸著台32c,在氣缸33c伸長時,該B面檢查吸著台 32c之吸著面配置在第丨搬出輸送帶84之上部附近或基 板盒81開口部之上方位置。以下將該B面檢查吸著台犯 之位置稱為基板排出位置。 、 另外,如圖3所示,配置在第2旋轉軸34左方之β面 •檢查吸著台32b之吸著面,在氣缸33b伸長時,同樣地與 氣缸23d伸長之A面檢查吸著台22d的吸著面相抵接。 • 其次,參照圖4說明基板檢查裝置1之空壓機構。另外, 在圖4中只顯示基板供給部7和第1檢查站2侧之空壓機 構’但是第2檢查站3侧亦與第1檢查站2側同樣地構成, 以下’以基板供給部7和第1檢查站2侧之空壓機構作為 代表而說明。另外,圖4用以說明第1檢查站2侧之空壓 故構’將弟1檢查站2之構造的一部份省略,以剖面表示 A面檢查吸著台22。另外,在圖4中,對於基板供給部7, 以方塊圖只表示該等構成元件中有關於空壓機構之構成 元件。 20 M337563 在圖4中’有關於基板檢查裝置i中第(檢查站2之办 壓機構具備有送風機90、壓縮機95、主配管91&、主二 管91b、空壓切換部92、吸著配管93、心缸配;9主4配 第1旋轉軸24在第"走轉構件21之内部支持空壓切換部 92。空壓切換部92具有多個切換閥’由上述控制部控 其開閉’在第1旋轉軸24形成有中空路徑(以圖4之虛線 表不),從其一方之端部貫通各個切換閥。另外,在第1 旋轉軸24另外一方之端部固定有正時皮帶輪25。主配管 91a通過第1旋轉轴24之中空路徑而連接送風機9〇和二 壓切換部92,經由空壓切換部92將送風機㈧所產生= 空壓供給到A面檢查吸著台22a〜22d。同樣地,主配管91b 通過第1旋轉軸24《中空路徑而連接壓縮機犯和空壓切 換部92,經由空壓切換部92將壓縮機95所產生之2壓 供給到氣缸23a〜23d。 在A面檢查吸著台22a〜22d之吸著面AF,分別形成有 鲁多個吸著孔(在圖4中只顯示A面檢查吸著台22&和 22c)。另外,在a面檢查吸著台22a〜22d和空壓切換部 92的切換閥之間連接有分別隨氣缸23&〜23d之伸縮動作 而伸縮的吸著配管93a〜93d(在圖4中只顯示吸著配管93a 和93c)。在此處吸著配管93a〜93d分別與別的切換閥連 接。另外,從吸著配管93a〜93d供給到A面檢查吸著台 22a〜22d之空壓(負壓),分別從形成在a面檢查吸著台 22a〜22d之吸著孔開放到外部。亦即,根據上述控制部之 控制,在經由吸著配管93a〜93d將負壓供給到人面檢查吸 21 M337563 著台22a〜22d時’在各個吸著孔產生負壓’可以使用吸著 面AF進行真空吸著。 另外’在氣缸23a〜23d和空壓切換部92的切換閥之間,M337563 VIII. New description: [Technical field to which the new type belongs] This creation relates to a substrate take-out device, and in particular to a substrate take-out device for taking out a stacked substrate at a time. v [Prior Art] It is known that it is necessary to prevent the supply of two or more sheets at the same time from the one of the stacked sheet members to the one piece member at the uppermost position. As shown in Fig. 19, the sheet member stacked in the above manner is, for example, a substrate s such as a printed circuit board on which electronic components such as semiconductor devices are assembled. The substrate s is formed with a plurality of holes penetrating the front surface/back surface such as a through hole TH (blackened area in the drawing) or a slit SL (hatched area in the drawing). When the substrate supply portion on which the substrate s is loaded is picked up by, for example, full vacuum suction, the substrate s placed on the uppermost position may have a strong absorbing force. For example, as shown in Figs. 20A and 20B, the blower suction mode will be described so that the substrate s stowed in the substrate cassette 5〇2 is sucked by the suction surface of the suction stage 5〇1. Further, Fig. 2A and Fig. 2A show the schematic device structure of the blower suction mode in a sectional view. A plurality of suction holes are formed in the suction surface of the suction table 5〇1. The suction holes are attracted by a blower (not shown), and when the suction surface of the suction σ 1 is disposed near the opening of the substrate cassette 502, a negative pressure is generated inside the substrate case 502. Then, the substrate s at the uppermost position is picked up from the substrate and the cassette 502 by vacuum suction by the suction surface from the suction stage 501. As shown in FIG. 20A, since the substrate s is formed with a plurality of holes penetrating through the surface/back surface through the through hole TH or the slit SL, the attraction force from the absorbing table 5015 M337563 is also applied to the second sheet. Substrate s. For example, when the uppermost position and the second substrate s are adhered to each other without the gap ′ from the uppermost position and the third substrate s is curved, the attractive force acts significantly on the second substrate s. That is, between the substrate 8 and the absorbing table 5〇1 at the uppermost position, the negative pressure is caused by the suction of the blower, and the gap between the second sheet and the third substrate is positive pressure (atmospheric pressure), so the uppermost position and The substrate s of the second sheet easily floats. Further, even when the substrate s at the uppermost position and the substrate s of the second sheet are displaced, the through holes th or the slits SL formed in the uppermost position substrate s have the same effect as the suction holes of the absorbing table 5〇1. The substrate S of the second sheet is easily floated. Therefore, as shown in Fig. 2A, the suction surface of the sorption table 501 is simultaneously vacuumed by sucking the uppermost position and the substrate of the second sheet and picking up it. A method of separating a member of the second member from the uppermost position is disclosed in the Japanese Patent Application Publication No. 2005-335843 (hereinafter referred to as Patent Document 1). As shown in Fig. 21A and Fig. 21B, the substrate take-out device exposes the adhesive member 504 to the substrate S with the adhesive member 504 exposed to the lower surface of the substrate stacked on the lift table 5〇5. Then, the upper surface of the base plate S disposed at the uppermost position of the stowage is brought into contact with the adhesive member 5〇4 (the state of Fig. 21a). Then, the elevating table 505 is lowered, and a gap is formed between the uppermost substrate s and the other substrate s (the state of Fig. 21B). Then, the sandwiching member or the like is inserted into the gap, and the substrate s is attracted from the upper portion to attract only the substrate S at the uppermost position. The substrate extracting device may not only overlap the substrate S of the uppermost position but also the substrate S of the second sheet, and may shift out only the uppermost position when the substrate of the uppermost position s and the substrate of the second M337563 are offset. Substrate_ However, the problem of the substrate take-out device disclosed in Patent Document 1 is that the adhesive force of the adhesive member 5〇4 is lowered. For example, the substrate 8 may generate foreign matter such as lint from its end portion or the like, and the foreign matter adheres to the adhesive member 504 to lower the adhesive force of the adhesive member. When such adhesive force is continuously lowered, the function of separating only the substrate 3 at the uppermost position and separating from the other substrate s cannot be achieved, so that the number of times the adhesive member 5〇4 can be continuously used is limited. Therefore, with the above substrate take-out device, it is necessary to maintain the adhesive member 504, and more specifically, when the adhesive force of the adhesive member 5〇4 is lowered, it is necessary to restore the adhesive force. Further, it is conceivable to pick up a portion of the substrate S by vacuum suction of a suction pad having a small suction area. However, in this embodiment, since it is necessary to bring the portion where the through hole TH or the slit SL is not formed into contact with the sucking jaw, it is necessary to adjust the position of the suction in accordance with the shape of the supplied substrate s. Therefore, it is necessary for each substrate to perform the operations required for this adjustment. Further, since the vacuum is sucked on one portion of the substrate 3, a concentrated stress is applied to the substrate S, which causes deformation or contamination of the substrate s. Further, depending on the shape of the substrate S, there may be no suitable portion where the through hole is not provided to be in contact with the absorbing pad. [New content] It is possible to remove only the product from the extreme. Therefore, the purpose of this creation is to provide a substrate removal device for maintenance work, and to prevent the removal of two substrates placed at the uppermost position. M337563 In order to achieve the above objectives, this creation has the following characteristics. „ is a substrate take-up device' for taking out the soil plate from the stowed substrate. The substrate take-up device is provided with a absorbing unit and a liter unit having at least an i-th absorbing portion, and 1 and 仏 仏 七 七 甘 、, The occupant only accumulates in the vicinity of the upper end of the substrate at the uppermost position. The lifting mechanism lowers the suction unit. The lifting mechanism lowers the absorbing unit to the upper end of the substrate where the ith absorbing portion is attracted to the uppermost position. The position near the part. The surface of the bottom of the substrate is sucked in the vicinity of the upper end of the substrate at the uppermost position. The lifting: the suction surface of the suction portion of the younger brother 1 is sucked near the upper surface of the uppermost substrate, so that The absorbing unit is raised. The second aspect of absorbing the gas for attracting the outside of the first absorbing portion is a plurality of suction holes formed in a lattice array or a staggered array on the first surface of the first aspect. In the third aspect, in the second aspect, the substrate has a plurality of through holes, and the total area of the suction holes formed in the suction surface of the first absorbing portion is larger than the portion formed on the absorbing surface. The total area of the through-hole of the substrate. The fourth aspect is In the second aspect, the substrate has a plurality of through holes, and all of the suction holes are formed in a partial region included in the absorbing surface of the i-th absorbing portion. The suction hole is formed in the absorbing surface of the first absorbing portion. The total area is larger than the total area of the substrate through-hole formed in the portion that is in contact with the region having the suction hole. In the fifth aspect, the suction surface of the second suction portion is divided into the second aspect. a plurality of regions in which the suction holes are formed with different hole number densities. M337563 The jth aspect is that in the above-described first aspect, the absorbing unit further includes the second _ suction f' for the uppermost The upper surface of the position substrate absorbs a region different from the region where the first portion and the first portion are attracted by the absorbing surface. The second absorbing portion moves between the substrate at the uppermost position and the other substrate in accordance with the rising operation of the elevating mechanism. When a gap is formed, the suction surface is attracted to the uppermost substrate. The seventh aspect is that the sixth aspect further includes a rocking mechanism. The rocking mechanism is the suction surface of the first suction portion. The long axis direction is the center, and the absorbing unit is shaken. • The eighth aspect In the seventh aspect, the absorbing unit further includes a rear contact and the member affixes to the vicinity of the upper end portion of the uppermost substrate by the absorbing surface of the ith absorbing portion. The second aspect of the substrate is a suction pressure control unit (four) supplied to the f 1 absorbing portion and the second absorbing portion. (1) When the pressure control unit 纟帛1 sucks the vicinity of the upper end portion of the uppermost substrate, the third suction pressure is supplied to the first suction portion' in accordance with the upward movement of the lifting mechanism, and is in the uppermost position. When a gap is formed between the substrate and the other substrate, the U 2 suction pressure is supplied to the second absorbing portion and the second absorbing portion more strongly than the first suction pressure. According to the first aspect, in the stacked substrate, Only the vicinity of the end portion of the uppermost substrate is sucked and lifted. The force for lifting the substrate is the absorbing force, so that it does not deteriorate. It is not necessary to perform maintenance necessary for a technique such as an adhesive member. Further, by sucking only the vicinity of the end portion of the uppermost substrate, it is possible to easily peel only the substrate at the uppermost position, and even if a substrate having a plurality of holes penetrating the front surface/back surface is formed, a plurality of substrates are stacked. In the M337563 board, it is also possible to prevent two sheets from being taken out, and it is possible to take out only the substrate placed at the uppermost position. According to the second aspect described above, since the plurality of suction holes are provided in the suction surface of the first and the second portions, when the substrate having the plurality of holes penetrating the front surface and the back surface is taken out, the uppermost position is applied. The attractive force of the two substrates is greater than the attractive force of the substrate acting at the uppermost position. According to the third sad case described above, since the total area of the suction holes is larger than the total area of the through holes of the substrate facing the suction surface, the effect of preventing the removal of the two sheets can be improved. - According to the fourth sadness of the above makeup, since the region where the suction hole is formed is concentrated on the portion of the suction surface, when the substrate having a small size is sucked, the region and the far substrate are sucked 'even for the size The small substrate can also be used to take out the substrate stably. According to the fifth aspect of the invention, the substrate of each of the sizes can be stably taken out in accordance with the size of the substrate to be taken out, and the area of the suction surface that is sucked by the substrate for five weeks. y According to the sixth aspect described above, after the gap is formed between the substrate at the uppermost position and the other substrate, since the substrate is sucked and fixed by the plurality of absorbing portions, the substrate can be stably held. According to the seventh aspect described above, since the absorbing unit can be shaken, the absorbing unit can be shaken in a state where the absorbing surface of the absorbing absorbing P is sucked near the upper end portion of the uppermost substrate, and the uppermost substrate can be placed. When one end is raised, a gap is easily formed between the substrate at the uppermost position and the other substrate. M337563, in the state in which the suction surface of the first absorbing portion is attracted to the vicinity of the upper end portion of the uppermost substrate, in a state in which the rear end of the substrate is in contact with the rear end abutting member, and shakes at the same time. The absorbing unit can be used to press the other end of the uppermost substrate while raising only one end, so that a gap can be more easily formed between the uppermost substrate and the other substrate. According to the ninth aspect described above, before the gap is formed between the substrate at the uppermost position and the other substrate, the pressure supplied to the second absorbing portion is lowered, and the attractive force of the substrate applied to the two gangs can be reduced. The absolute value can improve the effect of preventing the removal of 2 pieces. These and other objects, features, aspects and advantages of the present invention will become apparent from the accompanying drawings. [Embodiment] A substrate inspection apparatus equipped with a substrate taking-out device according to an embodiment of the present invention will be described with reference to Figs. 1 to 5 . Here, the front view of the figure shows the schematic structure of the base plate inspection device. Fig. 2 is a front view showing the schematic configuration of the substrate inspection apparatus. Fig. 3 is a front elevational view showing the schematic configuration of the substrate inspecting device in the state in which the cylinder is extended. Fig. 4 is a view schematically showing a pneumatic mechanism of the substrate inspection apparatus. Fig. 5 is a rear elevational view showing the structure of a mechanism for driving a rotating member to rotate the substrate inspecting device. Further, in order to clarify the positional relationship of the respective structural portions, the structures of the substrate inspection device 并未 are not all shown in Figs. 1 to 5, and will be described here. - In FIG. 1 and FIG. 2, the substrate inspection apparatus i includes an i-th inspection station 2, a second inspection station 3, an A-face inspection head 4, a B-face inspection head 5, a frame 6, and a base 11 M337563 board supply unit 7, The substrate storage unit 8, the first substrate conveyance belt 1〇, the second substrate conveyance belt u, and a control unit (not shown). Further, the base plate supply unit 7 corresponds to an example of the substrate take-out device of the present invention. An example of the object to be inspected by the substrate inspection apparatus at I is a substrate S such as a printed substrate for assembling electronic parts such as a semiconductor device, and a through surface such as a through hole TH or a slit SL is formed as described in the prior art. Multiple holes on the back. Further, the substrate 5 is, for example, a double-sided substrate which is required to inspect the appearance of both surfaces thereof. Further, the main surface of the substrate S of the object to be inspected is referred to as the A surface, and the other main surface is referred to as the β surface. The first inspection station 2 has a second rotation member 21, an A-side inspection suction table 22, an air cylinder 23, and a first! Rotating shaft 24. The first rotating member has a shape of a rectangular parallelepiped, and is rotatable in the A direction of the figure * around the first rotating shaft 24. On the four side faces of the second rotating member .21 which is parallel to the first rotating shaft 24, four A-side inspection suction stages 22a to 22d are provided via the cylinders 23a to 23d, respectively. In Figure 1, the first! The rotating shaft 24 is disposed such that φ is perpendicular to the paper surface, and the a-side inspection absorbing table 22a is disposed above the ith rotating shaft via the three cylinders 23a (only two cylinders 23a are shown in FIG. 1). Each of the cylinders 23b (only two cylinders 23b are shown in Fig. 1) is provided with an A-side inspection absorbing table 22b which is located to the left of the second rotation shaft 4, and ''two by three cylinders 23c (in Fig. 1) Only the two gas cylinders 23c) are provided, and the A-side inspection sorption table 22c is disposed below the ninth rotation axis '24, and the A-side inspection sorption tables 22a and 22c are disposed in parallel with each other. Further, via the three cylinders 23d (only two cylinders 23d are shown in Fig. 1), an A-side inspection suction table 22d is provided, which is located to the right of the second rotation shaft 24, and the 12 M337563 A surface inspection suction table 22b and 22d is configured to be parallel to each other. The second inspection station 3 is arranged in parallel with the first inspection station 2. The second inspection station 3 includes a second rotating member 31, a B-side inspection absorbing table 32, an air cylinder 33, and a second rotating shaft 34. The second rotating member 31 has a substantially rectangular parallelepiped shape similar to that of the second rotating member 21, and can be rotated in the B direction shown as a center with the second rotating shaft 34 parallel to the first rotating shaft 24. On the four side faces of the second rotating member 31 parallel to the second rotating shaft 34, four β-face inspection absorbing tables 32a to 32d are provided via the cylinders 33a to 33d, respectively. In FIG. 1, the second rotating shaft 34 is disposed perpendicular to the paper surface, and the B-side inspection absorbing table 32a is disposed via the three cylinders 33a (only two cylinders 33a are shown in FIG. 1). The second rotating shaft 34 is disposed on the second rotating shaft 34. Just above it. The B-side inspection suction table 32b is provided via the three cylinders 33b (only two cylinders 33b are shown in Fig. 1), and is located on the left side of the second rotation shaft 34, and the B surface is inspected by the suction stage. 321) and A. The face inspection suction table 22d is configured to face each other. The B-plane inspection φ sorption table 32c is provided below the second rotation shaft 34 via the three cylinders 33c (only two cylinders 33c are shown in Fig. 1), and the β-face inspection sorption tables 32a and 32c are disposed to each other. parallel. Further, the β-face inspection sorption table 32c is provided via the three cylinders 33d (only two cylinders 33d are shown in Fig. 1), which are located to the right of the second rotation shaft 34, and the B-side inspection sorption tables 32b and 32d are disposed. In parallel with each other. As shown in Figs. 1 and 2, the substantially upper frame β is composed of an inspection head beam 6A, three linear bearings 62a to 62c, a body base 63, an abutting member 64, and a bolt 65. The body base 63 is fixed to the plane by a predetermined support column and is located above the first inspection station 2 and the second inspection station 3. Linear bearings 62a~62c 13 M337563 = Track and slide blocks, shafts and bearings or sleeves, guides and guides. One combination is an example in which three linear bearings 62a to 62c are divided into a moving block R90U1, a knives 3 orbits 621a to 621c, and a sliding block Γ1ΛΓ ' 622b2' "σ 622c} iiLit 621-621c The upper side of 63 (in addition, in Fig. 2, the restraint 621 and the slide block 622 provided at the lower portion of the inspection head beam 61 are indicated by broken lines). The rails 621a to 621c are disposed so as to be spaced apart from each other by a predetermined interval and arranged as a center, and rails and cents are disposed on both sides thereof. Further, in the lower space between the rails 621a and 621b, the i-th inspection station 2' is disposed in the lower space between the lanes 62lb and 621c, and the second inspection station 3 is disposed. Further, in the main body base 63, a bolt 65 which is parallel to the rail 621b is provided in the upper portion of the rail "", and # is driven by the linear motor 651 to rotate. Here, the driving of the linear motor 651 is controlled by the above control unit. In addition, in FIGS. 1 and 2, the body bases 63 of the support rails 621a to 621c are shown as being separated from each other, but the display is only for explaining the relationship with the other structural portions, and in fact, the respective body bases 63 are inspected at least in the third step. Openings are formed in the upper space of the station 2 and the second inspection station 3, respectively, and are connected to each other and fixed. Further, a plurality of abutting members 64 (for example, three for each of the openings) are disposed on the same plane, protrude toward the opening, and are fixed to the body base 63. The inspection head beam 61 is placed between the lanes 621a to 621c fixed to the upper surface of the body base 63. Slide blocks 622a, 622b1, 622b2, and 622c are provided at the lower portion of the inspection head beam 61. In addition, the slider 622a card can be moved along the way 621a, the sliders 622bl and 622b2 can be combined to move along the 14 M337563 trajectory 621b, and the slider 622c can be combined to move along the ruling 621c. Further, the inspection head beam 61 is screwed to the bolt 65 at the upper portion of the sliders 622b1 and 622b2. Therefore, when the linear motor 651 is driven, the bolts 65 are rotated. The inspection head beam 61 is moved in the direction in which the lanes 621a to 621c are arranged side by side (the C direction shown), and is moved on the body base 63. There is a head in the head beam 61. Each of the A-face inspection head 4 and the B-face inspection head 5 includes a photographing device (not shown) such as a CCD camera, and the photographing device respectively inspects the head beam via the slits 41 and 51 (shown by broken lines in Fig. 2) facing the lower opening. Space photography under 61. The A face inspection head 4 is disposed on the inspection head beam 61 between the slide block 6A and the slide blocks 622M and 622b2. Specifically, it can be understood that when the a-surface inspection suction table of the first inspection station 2 is fixed at a position abutting against the contact member 64, the inspection head beam 移动 moves in the direction of the figure Q, and the A-side inspection is performed. The photographing device in which the head 4 is disposed on the A-face inspection head 4 can be placed on the substrate s which is inspected on the A-side inspection sorption table 22, and the other B-side inspection head 5 is disposed on the slider block 62 (10) 匕 2 The inspection head beam 61 between the human sliding blocks 622c. Specifically, the chucking table 32 is fixed to the abutting member: the head beam 61 is moved in the direction of the figure c, and the B-face inspecting head 5 is disposed in the photographing head of the inspecting head 5 (4). The position of the substrate s of the susceptor 32 is photographed. In the lower part of the first inspection station 2, the supply unit 7 is placed in the lower part of the first inspection station 2; As will be described later on the substrate conveyance belt, the substrate supply unit 7 is provided with a suction unit 7A, a rocking 15 M337563 moving mechanism η, a lifting support member 72, a lifting mechanism 73, a conveyance plate 74, and a conveyance plate. Agency 75. Further, in Fig. 1, only the conveyance plate 74 of the substrate supply unit 7 and the conveyance plate moving mechanism 75 are shown, and illustration of other constituent elements is omitted. As shown in Fig. 2, in the first substrate transfer conveyor 1G, the substrate s before the substrate inspection shake i inspection is stacked, and any substrate s is placed in the space below the suction unit 7A. Then, the absorbing unit pushes the substrate St on the carrier plate 74 by lifting the substrate st ’ placed on the uppermost portion from the substrate s stacked on the lower portion thereof under the control of the upper portion. Further, the transporting plate 74 is also configured to be movable in the direction of the figure in the direction indicated by the control of the control unit, in accordance with the driving of the transporting plate moving mechanism 75. Further, the conveyance plate 74 is conveyed by the conveyance plate moving mechanism 75, and the substrate St placed on the upper surface is conveyed to the front side of the a-side inspection suction table 22. Further, the pre-inspection substrate S supplied from the substrate supply unit 7 is placed on the second substrate conveyance belt 10, and the A side of one main surface faces downward. Further, as will be described later, when the A-side inspection suction table of the i-th inspection station 2 is lowered downward, the suction surface of the A-side inspection suction table 22 is placed on the substrate placed on the conveyance plate 74. Near St. The substrate housing portion 8 includes three substrate cassettes 81a to 81c, three lifting tables 8 2a to 82c, a turntable 83, a first carry-out conveyor 84, and a pair of second carry-out belts 85. The lifting tables 82a to 82c are provided inside the substrate cassettes 81a to 81C, respectively, and the substrate S after inspection by the substrate inspection device 1 is stacked in the substrate cassettes 81a to 81c on the lifting tables 82a to 82c. Further, the elevating tables 82a to 82c are vertically moved in accordance with the control of the control unit, and are controlled, for example, such that the position of the substrate s placed on the uppermost portion of the M16563 is constant in the vertical direction. For example, in the substrate cassettes 81a to 81c, the substrate inspection apparatus J detects the A surface and the substrate Sn which are defective in the B surface, and the substrate cassettes 81a to 8ic are disposed on the rotation plane of the rotary disk 83. The rotation and stop position of the turntable 83 in the direction of the drawing D are controlled by the control unit, and any one of the substrate cassettes 81a to 8ic is placed in a space immediately below the second inspection station 3. Further, the inspected substrate Sng accommodated in the substrate housing portion 8 is stacked in the substrate cassettes 8a to 8lc so that the surface A faces upward. For example, when the B-side inspection absorbing table 32 of the second inspection station 3 sucks the fixed substrate Sng and lowers it to the lower side to release the suction, the substrate cassette placed under the B-side inspection sorption table 32 is placed on the B-side. In the heart seven c, the substrate Sng is stacked. The first carry-out conveyor 84 is configured to be movable in the direction of j by the control of the control unit. The second carry-out belt 85 is disposed on the upper portion of the second substrate transport belt U. The control unit can control the movement in the U direction shown in the figure. For example, the first transfer conveyor belt 84 and the second carry-out conveyor belt (9) carry out the substrate SQk which has passed through the substrate inspection device and is qualified for the kneading surface and the beta surface to the second substrate conveyance belt 11. When the dialysis table 32 is sucked and the fixed substrate is lowered to the lower side, the ith carry-out conveyor 84 is directed toward the drawing, and the lower side of the absorbing table 32 is inspected. The position (that is, between the beta panel σ 32 and any one of the substrate cassettes 81 a to 81 c). After that, when the suction table 32 releases the suction of the substrate sok, the substrate s〇k carrier 1 is carried out of the conveyor belt 84. Of course: After, the first! Move the conveyor belt to the position of 17 M337563 when the first moving 2 soil moving conveyance belt 11 is near. The shape of the column (4) is arranged in a row of one of the belts 85: the substrate S〇k is moved toward the second carry-out belt 85. • The younger one is carrying out the transport belt 84 and the second carry-out belt 85. ::5°上疋日士,. _ Then, when the substrate sok is completely moved to the second carry-out transport, the second carry-out transport belt 85 is moved in the direction I shown in the figure, and the substrate is tilted on the second carry-out conveyor 85.堆积, the second substrate transport conveyor belt u or the other substrate Sok on the second substrate transport wheel f is deposited. Next, the expansion and contraction operation of the cylinders 2 3 and 3 provided in the i-th inspection station 2 and the second inspection station 3 will be described with reference to Figs. 1 to 3 . In the above manner, the 帛1 rotating member 21 is provided with gas red 23a to 23d which respectively support the A-side inspection absorbing tables 22a to 22d. The cylinders 23a to 23d are configured to be expandable and contractible in accordance with the control of the control unit, and to change the distance between the A-side inspection suction stages 22a to 22d and the first rotation shaft 24 which are respectively supported by the expansion and contraction operation. Figure! The cylinders 23a to 23d are in a compressed state, and the A-side inspection suction stages 22a to 22d are disposed in the vicinity of the side surface of the second rotation member 21, respectively. Further, Fig. 3 shows a state in which the air cylinders 23a to 23d are extended, and the A-side inspection suction stages 22a to 22d are disposed apart from the first rotating member 21. As shown in Fig. 2 and Fig. 3, the A-side inspection absorbing table 22a disposed directly above the first rotating shaft 24, and the upper surface of the outer edge portion when the cylinder 23a is extended (the opposite side of the rotating shaft 24 of the first pair 1) ) is positioned to abut against the abutment member 64. Hereinafter, the a surface to be abutted against the abutting member 64 18 M337563 k The position at which the Ό 22 is found is referred to as an a-plane inspection position. Further, as shown in Fig. 2, in the present embodiment, in order to stably position the A-side inspection absorbing table... at the A-side inspection position, the position (three positions) at which the contact member 64 is provided is set to include the cylinder 23a. The position of the suction table 22a (three positions) is checked on the a side. Further, as shown in FIG. 3, the human face inspection absorbing table 22c disposed below the i-th rotating shaft 24, when the air cylinder 23c is extended, the suction surface of the a-side inspection absorbing table 22c is placed on the carrier plate. The upper part of the substrate ^ on the 74 is nearby. Further, as shown in Fig. 3, the suction surface of the suction table 22d is inspected on the A side of the right side of the rotary shaft 24, and when the cylinder 23d is extended, the suction surface 321 is inspected in the same manner as the B surface of the cylinder 33b. ) The suction surface meets. The contact position of the suction surface of the A-side inspection sorption table 22 and the suction surface of the B-side inspection sorption table 32 is referred to as a substrate transfer position. Further, the second rotating member 31 is provided with cylinders Ma to 33d which respectively support the β-face inspection suction φ stages 32a to 32d. The cylinders Ma to 3 are configured to be expandable and contractible in accordance with the control of the above-described control unit, and the distance between the B-surface inspection suction stages 32a to 32d and the second rotation shaft 34 supported by the respective expansion units is changed by the expansion and contraction operation. 1 is a state in which the cylinders 33a to 33d are compressed, and the B-side inspection suction stages 32a to 32d are disposed in the vicinity of the side faces of the 苐2 rotating member 31, respectively. Further, Fig. 3 shows a state in which the air cylinders 33a to 33d are extended, and the B-side inspection suction stages 32a to 32d are disposed apart from the second rotating member 31. As shown in Fig. 2 and Fig. 3, the β-face inspection absorber 32a' disposed directly above the second rotating shaft 34 is extended to the upper surface M337563 of the outer edge portion when the cylinder 33a is extended (to the second rotating shaft 34 The outer side surface is positioned to abut the abutment member 64. Hereinafter, the position of the B-surface inspection sorption table 32 that is positioned to abut against the abutment member 64 is referred to as a B-face inspection position. Further, as shown in Fig. 2, in the present embodiment, in order to stably position the B-side inspection sorption table 32a at the B-face inspection position, the position (three positions) at which the abutment member 64 is provided is set to include the cylinder 33a. Support the B side to check the position of the suction table 32a (3 positions). Further, as shown in FIG. 3, the B-surface inspection sorption table 32c is disposed below the second rotation shaft 34, and when the cylinder 33c is extended, the suction surface of the B-side inspection sorption table 32c is disposed on the 丨 carry-out conveyor. The position near the upper portion of 84 or the upper portion of the opening of the substrate cassette 81. Hereinafter, the position at which the B-side inspection suction table is made is referred to as a substrate discharge position. Further, as shown in Fig. 3, the suction surface on the left side of the second rotating shaft 34 and the inspection suction table 32b are arranged, and when the air cylinder 33b is extended, the A side inspection of the cylinder 23d is similarly sucked. The suction surface of the table 22d abuts. • Next, the air pressure mechanism of the substrate inspection apparatus 1 will be described with reference to Fig. 4 . In addition, in FIG. 4, only the substrate supply unit 7 and the air pressure mechanism 'on the first inspection station 2 side are shown, but the second inspection station 3 side is also configured similarly to the first inspection station 2 side, and the following 'substrate supply unit 7' The air pressure mechanism on the side of the first inspection station 2 will be described as a representative. In addition, Fig. 4 is a view for explaining a part of the structure of the first inspection station 2, and the A side inspection suction stage 22 is shown in cross section. Further, in Fig. 4, with respect to the substrate supply portion 7, only the constituent elements of the constituent elements relating to the air compressor are shown in a block diagram. 20 M337563 In the case of the substrate inspection device i (the inspection mechanism of the inspection station 2 is provided with the blower 90, the compressor 95, the main pipe 91 & the main second pipe 91b, the air pressure switching unit 92, and the suction The piping 93 and the cylinder are arranged; the main shaft 4 is equipped with the first rotating shaft 24 to support the air pressure switching unit 92 inside the "rotating member 21. The air pressure switching unit 92 has a plurality of switching valves' controlled by the above control unit Opening and closing 'a hollow path is formed in the first rotating shaft 24 (not shown by a broken line in Fig. 4), and each of the switching valves is passed through one end portion thereof. Further, the timing is fixed at the other end of the first rotating shaft 24 The pulleys 25. The main pipe 91a is connected to the blower 9A and the two-pressure switching unit 92 via the hollow path of the first rotating shaft 24, and supplies the air blower (8) to the A-side inspection absorbing table 22a via the air pressure switching unit 92. In the same manner, the main pipe 91b is connected to the compressor and the air pressure switching unit 92 via the first rotating shaft 24, and the second pressure generated by the compressor 95 is supplied to the cylinder 23a via the air pressure switching unit 92. 23d. Check the suction surface AF of the suction tables 22a to 22d on the A side, respectively. A plurality of suction holes (only the A-side inspection suction tables 22 & and 22c are shown in Fig. 4), and a connection between the a-side inspection suction tables 22a to 22d and the switching valve of the air pressure switching portion 92 is connected. The suction pipes 93a to 93d (only the suction pipes 93a and 93c are shown in Fig. 4) are respectively expanded and contracted by the expansion and contraction of the cylinders 23 & 23d. Here, the suction pipes 93a to 93d are respectively connected to other switching valves. In addition, the air pressure (negative pressure) supplied from the suction pipes 93a to 93d to the A-side inspection suction tables 22a to 22d is opened to the outside from the suction holes formed in the a-surface inspection suction tables 22a to 22d. In other words, according to the control of the control unit, when the negative pressure is supplied to the face inspection suction 21 M337563 stages 22a to 22d via the suction pipes 93a to 93d, the suction surface can be used to generate a negative pressure in each suction hole. The AF is vacuum-sucked. Further, 'between the cylinders 23a to 23d and the switching valve of the air pressure switching unit 92,
分別連接有氣缸配管94a〜94d(在圖4中只顯示氣缸配管 94a和94c)。另外,根據上述控制部之控制從上述壓縮機 95將空壓(正壓)供給到氣缸配管94a~g4d,可以進行氣缸 23a〜23d之伸縮動作。另外第2檢查站3侧之空壓機構因 為亦與第1檢查站2相同,所以其詳細之說明加以省略。 另外,在第2檢查站3的第2旋轉轴34另外一方之端部 β又有正日π皮▼輪35 (苓照圖5)。另外,在上述實施形態 中,以空壓切換部92切換送風機9〇和壓縮機95等之系 統之空壓,但是亦可以分別具備有個別的切換部。 •另外,,基板供給部7之吸著單元70包含有第1吸著部 702、第2吸著部703、第3吸著部704、第4吸著部705。 另外,關於基板供給部7之空壓機構,具備有送風機9〇 鲁和吸著壓力控制部7G7。吸著壓力控制部m根據上述控 制部之控制,將送風機9〇所產生之空壓(負壓)供給到^ 著單元70。例如’吸著壓力控制部7〇7由依上述控制部 之控制而控制其動作之多個電磁線圈闕等構成,用以控制 分別供給到第!吸著部7〇2、第2吸著部7〇3、第3吸著 部704、和第4吸著部m之負愿的有無及其麼力。 其次’參照圖5,說明基板檢查裝置!中用以驅動第i 旋轉構件21和第2旋轉構件31使其旋轉之機構。另外, 圖5是表示基板檢查裝置!之一部份的後視圖,與圖㈠口 22 M337563 圖3所示第1檢查站2和第2檢查站3之位置關係及旋轉 方向為左右相反。 在圖5中,驅動第1旋轉構件21和第2旋轉構件31使 其旋轉之機構具有旋轉驅動馬達1〇1、正時皮帶1〇3、張 力輪104和105。在旋轉驅動馬達ιοί之旋轉轴設有皮帶 輪102,旋轉驅動馬達1〇1根據上述控制部之控制,驅動 皮帶輪102而旋轉既定之角度。正時皮帶1〇3經由張力輪 104和105張掛成可以藉由皮帶輪1〇2和正時皮帶輪25 和35而轉動。張力輪1〇4和1〇5用以控制張掛正時皮帶 103之張力。旋轉驅動馬達1〇1之驅動力經由正時皮帶 使正日守皮π輪25和35同步,以相同之旋轉角度旋轉。另 外’分別固定正時皮帶輪25和35之第1旋轉軸24和第 2旋轉軸34亦旋轉,隨第1旋轉軸24和第2旋轉軸34 之旋轉’第1旋轉構件21和第2旋轉構件31 ,亦分別在圖 不之A方向和b方向旋轉。另外,在本實施例中 述控制之旋轉指示 …、t 31分別在圖示之二方^1旋轉構件21和第2旋轉構件 ^ ^ 万向和B方向每次旋轉90。。 其次,參照圖6釦同。 另外,圖6以剖面/說明基板供給部7之詳細構造。 示基板供” 7 著單元7G和搖動機構71,為表 之底視圖。財構造之侧視圖。圖7是吸著單元7〇 構71、升降支持才 運板移動機構:7 5 7具備有吸著單元70、搖動機 升降機構73、搬運板74、和搬 23 M337563 在圖6和圖7中,吸荖7nA人_*_ ,7Λ1Κ外 者早70 70包含有一對支持構件701a m :弟1吸著部7〇2、第2吸著部7〇3、第3吸著部 7〇4、弟4吸著部7G5、和後端抵接構件觸。第 吸者部702〜705分別由棒狀之中空角柱 ^ 持,第1〜第4吸著部7(32,在積 ^弟1基板搬運輸送帶1G上的檢查前基板3 己 置成分別橫跨於同一方向。 第1吸著部702在與積载之基板3相面對的下面(盘長 =向平行之中空角柱的側面;以下稱為吸著面),形成: 有夕個吸引孔ha。例如’吸引孔“在第1吸著部7〇2之 :面’對於設定在支持構件7〇la側之既定區域(例如,幅 t大約10瞧長度大約140職),以中心間間距1.5随形成 直徑〇.-之孔而成為矩陣狀。亦即,成為形成有吸引孔 ^怨樣的一實例,關於形成有吸引孔ha之區域或其他 ^樣將於後面說明。另外,對第卜及著部702之中空内部, 供給由吸㈣力㈣部m(參照圖4)所㈣之負壓,第 1吸著部702下方之外部氣體從吸引孔匕受吸引。另外, 第卜及著部702之兩端支持在支持構件7〇la和鳩之一 方端部附近(以下稱為吸著單元7()之前端側),可以以其 ^轴(圖示之0轴)作為中心,朝向圖示之I方向旋轉。詳 二之f 1吸著部702 ’獨立於後述之吸著單元7〇的搖 而且在4個吸著部之中,只有第!吸著部單獨地 破支持成可以以〇轴為中心旋轉。利用此種方式,第卜及 24 M337563 著部702可以柔軟地吸著基板,且一旦被吸著之基板不容 易剝離。Cylinder pipes 94a to 94d are connected (only cylinder pipes 94a and 94c are shown in Fig. 4). Further, the air pressure (positive pressure) is supplied from the compressor 95 to the cylinder pipes 94a to g4d by the control of the control unit, whereby the air cylinders 23a to 23d can be expanded and contracted. Further, since the air pressure mechanism on the side of the second inspection station 3 is also the same as that of the first inspection station 2, detailed description thereof will be omitted. Further, in the other end portion β of the second rotating shaft 34 of the second inspection station 3, there is a positive day π skin ▼ wheel 35 (see Fig. 5). Further, in the above-described embodiment, the air pressure switching unit 92 switches the air pressure of the system such as the blower 9〇 and the compressor 95, but may be provided with individual switching units. Further, the absorbing unit 70 of the substrate supply unit 7 includes a first absorbing unit 702, a second absorbing unit 703, a third absorbing unit 704, and a fourth absorbing unit 705. Further, the air compressor of the substrate supply unit 7 includes a blower 9 and a suction pressure control unit 7G7. The suction pressure control unit m supplies the air pressure (negative pressure) generated by the blower 9 to the control unit 70 in accordance with the control of the control unit. For example, the suction pressure control unit 7〇7 is configured by a plurality of electromagnetic coils or the like that control the operation of the control unit, and is controlled to be supplied to the first! The presence or absence of the suction of the absorbing portion 7〇2, the second absorbing portion 7〇3, the third absorbing portion 704, and the fourth absorbing portion m. Next, the substrate inspection device will be described with reference to Fig. 5! A mechanism for driving the i-th rotating member 21 and the second rotating member 31 to rotate. In addition, FIG. 5 shows a substrate inspection device! The rear view of one of the parts is shown in Fig. 3. The positional relationship between the first checkpoint 2 and the second checkpoint 3 shown in Fig. 3 and the direction of rotation are opposite to each other. In Fig. 5, a mechanism for driving the first rotating member 21 and the second rotating member 31 to rotate is provided with a rotary drive motor 1〇1, a timing belt 1〇3, and tension rollers 104 and 105. A pulley 102 is provided on a rotary shaft of the rotary drive motor ιοί, and the rotary drive motor 101 drives the pulley 102 to rotate by a predetermined angle in accordance with the control of the control unit. The timing belt 1〇3 is suspended by the tension pulleys 104 and 105 so as to be rotatable by the pulley 1〇2 and the timing pulleys 25 and 35. The tension pulleys 1〇4 and 1〇5 are used to control the tension of the tensioning timing belt 103. The driving force of the rotary drive motor 101 is synchronized with the timing π wheels 25 and 35 via the timing belt, and is rotated at the same rotation angle. Further, the first rotating shaft 24 and the second rotating shaft 34 of the respective fixed timing pulleys 25 and 35 are also rotated, and the first rotating member 21 and the second rotating member are rotated with the rotation of the first rotating shaft 24 and the second rotating shaft 34. 31, also rotate in the A direction and the b direction respectively. Further, in the present embodiment, the rotation instruction ..., t 31 of the control are rotated 90 each time in the two directions of the rotating member 21 and the second rotating member. . Next, the same is attached with reference to FIG. In addition, FIG. 6 illustrates the detailed structure of the substrate supply unit 7 in a cross section. The substrate is provided with a unit 7G and a rocking mechanism 71, which is a bottom view of the watch. A side view of the financial structure. Fig. 7 is a suction unit 7 structure 71, a lifting support board moving mechanism: 7 5 7 is provided with suction The unit 70, the rocker lifting mechanism 73, the conveying plate 74, and the carrying 23 M337563 are shown in Figs. 6 and 7, sucking 7nA people _*_, 7Λ1Κ outside the person 70 70 including a pair of supporting members 701a m: brother 1 The absorbing portion 7〇2, the second absorbing portion 7〇3, the third absorbing portion 7〇4, the buddy portion 7G5, and the rear end abutting member are touched. The first absorbing members 702 to 705 are respectively made of a rod. The first to fourth suction portions 7 (32, the pre-inspection substrates 3 on the substrate 1 transport conveyance belt 1G are placed in the same direction. The first suction portion) 702 is formed on the lower surface facing the stacked substrate 3 (the disk length = the side surface of the parallel hollow column; hereinafter referred to as the suction surface), and is formed with: a suction hole ha. For example, the 'suction hole' is at the first The absorbing portion 7〇2: the surface 'for a predetermined area set on the side of the supporting member 7〇la (for example, the width t is about 10 瞧 and the length is about 140 positions), and the diameter between the centers is 1.5 with the diameter 〇. The hole is formed into a matrix shape, that is, an example in which a suction hole is formed, and an area in which the suction hole ha is formed or other samples will be described later. In the hollow interior, the negative pressure of (4) force (four) portion m (see Fig. 4) is supplied, and the outside air under the first absorbing portion 702 is sucked from the suction hole 。. It is supported in the vicinity of one end portion of the support member 7〇1a and the ( (hereinafter referred to as the front end side of the absorbing unit 7), and can be oriented in the direction of the figure I with the axis (the 0-axis shown) as the center. Rotating. The second f 1 absorbing portion 702 'is independent of the absorbing unit 7 后 described later and among the four absorbing portions, only the absorbing portion is separately supported to be centered on the 〇 axis Rotating. In this manner, the second and second M337563 portions 702 can softly absorb the substrate and are not easily peeled off once the substrate being sorbed.
第2吸著部703在與積載之基板s相面對的下面(吸著 面)形成有多個吸引孔hb。例如,吸引孔hb在第2吸著 部703之下面,對於設定在支持構件7〇la側之既定區域 (例如’兔度大約1 〇mmx長度大約5〇_),以中心間間距 2.0mm形成直徑i.0mm之孔而成為矩陣狀,對於在支持構 件701b側鄰接於該既定區域之另一既定區域(例如,寬度 大約lOmmx長度大約80mm),以中心間間距8· 〇_形成直 徑1 · Omm之孔而成為矩陣狀。另外,該吸引孔hb在與基 板S相面對之位置形成有多個時,亦可以以其他之態樣形 成。另外,在第2吸著部703之中空内部供給由吸著壓力 控制部707所控制之負壓,第2吸著部703下方之外部氣 體從吸引孔hb受吸引。另外,第2吸著部703在相對於 第1吸著部702而為支持構件701a和701b另外一方之端 •侧(以下稱為吸著單元70之後端側),設置其兩端。 第3吸著部704在與積載之基板S相面對的下面(吸著 面),形成有與第2吸著部703同樣之多個吸引孔hb。另 外’在第3吸著部704之中空内部供給有由吸著壓力控制 部707所控制之負壓,第3吸著部704下方之外部氣體從 ,吸引孔hb受吸引。另外,第3吸著部7〇4在相對於第2 •吸著部703而為支持構件7〇ia和701b在吸著單元7〇之 更後端側,設置其兩端。 第4吸著部705在與積載之基板s相面對的下面(吸著 25 M337563 面)形成有多個吸引孔he。例如,吸引孔hc在第4吸著 部705之下面,對於設定在支持構件7〇la侧之既定區域 (例如,覓度大約1 Ommx長度大約8〇mm),以中心間間距 8. 0mm形成直徑l.〇mm之孔而成為矩陣狀,對於在支持構 件701b側鄰接於該既定區域之另一既定區域(例如,寬度 大約lOmmx長度大約50mm),以中心間間距2 〇_形成直 徑1· Omni之孔而成為矩陣狀。另外,該吸引孔hc在與基 板S相面對之位置形成有多個時,亦可以以其他之形態形 成。另外,在第4吸著部705之中空内部供給由吸著壓力 控制部707所控制之負壓,第4吸著部7〇5下方之外部氣 體從吸引孔he受吸引。另外,第4吸著部7〇5在相對於 第3吸著部704而成為支持構件701&和7〇lb在吸著單元 _ 70之更後端侧之另外一端附近,設置其兩端。 後端抵接構件706配置在吸著單元70之最後端侧,例 如,設置在第4吸著部705之上述後端侧。 •吸著單元70由升降支持構件72所支持,可以以設在其 月ίι端側之旋轉軸為中心搖動。上述旋轉軸與第卜第4吸 著部702〜705之架設方向平行,例如,成為圖示之〇軸。 另外,在吸著單元70之後端侧(例如,第3吸著部7〇4和 第4吸著部705附近),設有搖動機構71。搖動機構以 用以連結吸著單元70之後端側和升降支持構件72。另 外,在搖動機構71之内部設有由上述控制部控制其旋轉 角度之搖動凸輪。另外,依照上述控制部之控制使搖動凸 輪轉動,使吸著單元7〇之後端侧和升降支持構件72之距 26 M337563 離增減,以上述旋轉轴作為中心、使吸著單元70在圖示之 E方向搖動。另外,使吸著單元7{)搖動之機構亦可以使 :其他之形態。例如,亦可以設置氣缸等實現上下驅動之 ,構另外,亦可以設置以上述旋轉軸為中心直接使吸著 單元70旋轉之馬達等旋轉機構。 升降機構73依照上述控制部之控制,使升降支持構件 72在圖不之1?方向升降。另外,基板供給部7具有高度 • f測器(圖中未顯示),用來檢測作為供給對象之基板s : 積載高度(基板S之剩餘量),將該高度資訊輸出到上述广 制部。利用此種方式,吸著單元7〇可以在基板吸著㈣ 位置(第1〜第4吸著部7G2~m之吸著面分別面對且接近 積载在第1基板搬運輸送帶1〇上最上位置所載置之基板 • t的方主面之位置),和基板吸引解除位置(圖6所示 之位置;將第卜第4吸著部7〇2〜705之吸著面所吸著之 另外,在開始依照後述之流程圖而動作之前,作為供給 對象之基板S積載在第丨基板搬運輸送帶1〇上,配置在 成為吸著單元70之下部空間的既定位置。在此處既定位 置是指吸著單元70朝向積載之基板S而下降時,可使第 1吸著部702之吸著面接近於基板s長軸方向之上面前端 部附近,且至少第2吸著部7〇3之吸著面接近異於該基板 s之其他上面區域的位置,亦即,該既定位置是使基板S 之短軸方向和第1〜第4吸著部702〜7〇5之架設方向互 平行的位置。 基板St交接給搬運板74之位置)之間進行升降動作。 27 M337563 參照圖8 ’以供給對象十尺寸最大之基板Smax和尺寸 最小之基板Smin作為一實例,說明第1吸著部702接近 而以吸引孔ha吸引之範圍。另外,目8是對於配置在上 述既疋位置的基板Smax和如之上面,第1吸著部 所吸引的範圍之一實例。 在圖8中,畜吸著單元70朝向積載在上述既定位置之 基板SmaX而下降時,第1吸著部702之吸著面接近基板 Smax長軸方向之上面端部附近。然後,經由從第i吸著 部702之多個吸引孔ha吸引,在基板s·之上面端部附 近,成為吸引寬度W而長度l之區域。例如,在上述吸引 孔ha之一貫例中,大約i〇_,L=大約14〇_。另外一 方面,如上述之方式因為在第1吸著部702上偏向支持構 件701&侧之既定區域中,形成有多個吸引孔ha,所以就 •最大尺寸之基板Smax而言,於上面前端部附近,偏向左 右任何一側之區域即為第i吸著部7〇2所吸引的範圍,最 參好將該吸引範圍設在從該一侧起,到基板Smax短軸方向 寬度之大約2/3的範圍。亦即,在以相同之第}吸著邙 702吸引最小尺寸之基板Smin時,要考慮到第丨吸著部 702之吸引範圍會超過基板smin短軸方向之寬度。具體 而言,在以基板Smax短軸方向整體寬度作為第i吸著部 702之吸引範圍時,對基板Smin吸引之洩漏變多,因此 必須提高吸引壓力。為儘量避免此種吸引壓力之調整,對 於最大尺寸之基板Smax,最好在上面前端部附近偏向左 右任何一侧之區域中,設定第1吸著部7〇2之吸引範圍 28 M337563 另外’第1吸著部702之吸著面配置成在基板Smax和Smin 之上面别端附近’使該吸著面抵接於各個短轴方向之整體 寬度。 回到圖6,搬運板移動機構75依照上述控制部之控制, 使搬運板74在圖示之G方向水平移動。依照此種方式, 當吸著單元70吸著且支持基板St,而配置在上述基板吸 引解除位置時,搬運板74配置在該基板St之下方位置(圖 6中虛線所示之位置)。然後,當解除吸著單元對基板 St之吸著支持時,基板St被載置在搬運板μ之上面。 然後,搬運板74在其上面載置有基板st之狀態下,移動 到A面檢查吸著台22之正下位置。 /、二人,簽舨圖9〜圖15,說明基板供給部7之動作。另 外,圖9是流程圖,用來表示從基板供給部7將基板w 給到A面檢查吸著台22&〜22(1之任一個之動作。圖ι〇〜圖 15是概略圖,分別根據圖9所示流程圖之動作 地表示基板供給部7動作之狀態。 又二 在圖9中,基板檢查裝置丨之控制部驅 在第1基板搬運輸送帶1。上而作為之 二’將升降支持構件72下降到使载置於最 基板St和吸著單元70之吸著面 置之 開始位置)(步驟_。例如,基板檢查裝置著 使用從上述高度感測器輪出之高度資訊 , 給對象之基板s的積载高度(基板S之剩餘量),:現在供 ^度決定使吸著單元7G下降之基板吸著開n 29 M337563 後,如圖l 〇所示,基板檢查裝置1之控制部驅動升降機 構73,在圖示之E1方向使升降支持構件72下降,而將 及著單元7 0配置於基板吸著開始位置。利用此種方式, 第1吸著部702之吸著面接近於積載在最上位置之基板The second absorbing portion 703 is formed with a plurality of suction holes hb on the lower surface (the absorbing surface) facing the stacked substrate s. For example, the suction hole hb is formed below the second absorbing portion 703, and is formed at a predetermined area (for example, 'rabbit degree of about 1 〇mmx length of about 5 〇 _) set on the support member 7〇la side, with a center-to-center spacing of 2.0 mm. A hole having a diameter of 1.0 mm is formed into a matrix shape, and a predetermined area (for example, a width of about 10 mm x a length of about 80 mm) adjacent to the predetermined region on the support member 701b side is formed with a center-to-center spacing of 8·〇_. Omm holes form a matrix. Further, when the plurality of suction holes hb are formed at positions facing the substrate S, they may be formed in other aspects. Further, the negative pressure controlled by the suction pressure control unit 707 is supplied to the hollow interior of the second suction portion 703, and the external air below the second suction portion 703 is sucked from the suction hole hb. Further, the second absorbing portion 703 is provided on the other end side (hereinafter referred to as the rear end side of the absorbing unit 70) of the support members 701a and 701b with respect to the first absorbing portion 702. The third absorbing portion 704 is formed with a plurality of suction holes hb similar to those of the second absorbing portion 703 on the lower surface (the absorbing surface) facing the stacked substrate S. Further, the negative pressure controlled by the suction pressure control unit 707 is supplied to the hollow interior of the third suction portion 704, and the outside air under the third suction portion 704 is sucked from the suction hole hb. Further, the third absorbing portion 7〇4 is provided at both rear end sides of the absorbing unit 7〇 with respect to the second absorbing portion 703, and the supporting members 7〇ia and 701b. The fourth absorbing portion 705 is formed with a plurality of suction holes he on the lower surface (the surface of the suction 25 M337563) facing the stacked substrate s. For example, the suction hole hc is formed under the fourth absorbing portion 705, and is formed at a predetermined area (for example, a twist of about 1 Ommx and a length of about 8 〇mm) set at a side of the support member 7〇la, with a center-to-center spacing of 8. 0 mm. The hole having a diameter of 〇mm is formed into a matrix shape, and for another predetermined region adjacent to the predetermined region on the support member 701b side (for example, a width of about 10 mm × a length of about 50 mm), a diameter 1 is formed with a center-to-center spacing of 2 〇. The holes of Omni become matrix. Further, when the plurality of suction holes hc are formed at positions facing the substrate S, they may be formed in other forms. Further, the negative pressure controlled by the suction pressure control unit 707 is supplied to the hollow interior of the fourth suction portion 705, and the external air below the fourth suction portion 7〇5 is sucked from the suction hole he. Further, the fourth absorbing portion 7〇5 is provided at both ends of the support member 701& and 7〇1b on the other rear end side of the absorbing unit _70 with respect to the third absorbing portion 704. The rear end abutment member 706 is disposed on the rearmost end side of the absorbing unit 70, for example, on the rear end side of the fourth absorbing portion 705. The absorbing unit 70 is supported by the elevating support member 72, and can be rocked around the rotation axis provided on the end side of the month. The rotation axis is parallel to the erecting direction of the fourth absorbing portions 702 to 705, and is, for example, the imaginary axis shown. Further, a rocking mechanism 71 is provided on the rear end side of the absorbing unit 70 (for example, in the vicinity of the third absorbing portion 7〇4 and the fourth absorbing portion 705). The rocking mechanism is used to connect the rear end side of the absorbing unit 70 and the lifting support member 72. Further, inside the rocking mechanism 71, a rocking cam whose rotation angle is controlled by the above-described control portion is provided. Further, in accordance with the control of the control unit, the rocking cam is rotated to increase or decrease the distance between the rear end side of the absorbing unit 7〇 and the elevating support member 72 by 26 M337 563, and the absorbing unit 70 is shown as the center of the rotating shaft. Shake in the E direction. In addition, the mechanism for shaking the absorbing unit 7{) can also be used in other forms. For example, a cylinder or the like may be provided to drive up and down. Alternatively, a rotating mechanism such as a motor that directly rotates the absorbing unit 70 around the rotating shaft may be provided. The elevating mechanism 73 raises and lowers the elevating support member 72 in the direction indicated by the control unit in accordance with the control of the control unit. Further, the substrate supply unit 7 has a height measuring device (not shown) for detecting the substrate s to be supplied: the stowage height (the remaining amount of the substrate S), and outputs the height information to the wide portion. In this manner, the absorbing unit 7 can be placed at the substrate suction (4) position (the absorbing surfaces of the first to fourth absorbing portions 7G2 to m face and are close to each other on the first substrate transporting belt 1). The substrate placed on the uppermost position • the position of the main surface of t), and the substrate suction release position (the position shown in Fig. 6; the suction surface of the fourth suction portion 7〇2 to 705 is sucked In addition, the substrate S to be supplied is placed on the second substrate conveyance belt 1〇, and is placed at a predetermined position in the lower space of the absorbing unit 70, before the operation is performed in accordance with the flowchart described later. When the suction unit 70 is lowered toward the stacked substrate S, the suction surface of the first suction portion 702 can be brought close to the vicinity of the upper end portion in the longitudinal direction of the substrate s, and at least the second suction portion 7〇 The absorbing surface of 3 is close to a position different from the other upper region of the substrate s, that is, the predetermined position is such that the short axis direction of the substrate S and the erecting directions of the first to fourth absorbing portions 702 to 7 〇 5 are mutually The parallel position is raised and lowered between the substrate St and the position of the transfer plate 74. 27 M337563 Referring to Fig. 8', the substrate Smax having the largest size of the supply target and the substrate Smin having the smallest size are taken as an example, and the range in which the first absorbing portion 702 approaches and is attracted by the suction hole ha will be described. Further, the item 8 is an example of a range in which the first absorbing portion is attracted to the substrate Smax disposed at the above-described 疋 position and above. In Fig. 8, when the animal sucking unit 70 is lowered toward the substrate SmaX stowed at the predetermined position, the suction surface of the first suction portion 702 approaches the vicinity of the upper end portion in the longitudinal direction of the substrate Smax. Then, it is attracted to the plurality of suction holes ha of the i-th absorbing portion 702, and is a region having a width W and a length l near the upper end portion of the substrate s·. For example, in the conventional example of the above-mentioned suction hole ha, about i 〇 _, L = about 14 〇 _. On the other hand, in the above-described manner, since the plurality of suction holes ha are formed in the predetermined region on the support member 701 & side in the first absorbing portion 702, the maximum size of the substrate Smax is at the upper end. In the vicinity of the portion, the region that is biased to the right or left is the range that the i-th suction portion 7〇2 attracts, and the suction range is set to be about 2 from the side to the short-axis width of the substrate Smax. The range of /3. That is, when the substrate Smin of the smallest size is attracted by the same absorbing member 702, it is considered that the suction range of the second absorbing portion 702 exceeds the width in the short-axis direction of the substrate smin. Specifically, when the entire width in the short-axis direction of the substrate Smax is used as the suction range of the i-th absorbing portion 702, the leakage of the suction to the substrate Smin is increased, and therefore the suction pressure must be increased. In order to avoid such adjustment of the suction pressure as much as possible, it is preferable to set the suction range of the first absorbing portion 7 〇 2 to the area of the left and right sides of the substrate Smax of the largest size in the vicinity of the front end portion. 1 The absorbing surface of the absorbing portion 702 is disposed so as to abut the entire width of each of the short axis directions at the vicinity of the upper ends of the upper surfaces of the substrates Smax and Smin. Referring back to Fig. 6, the conveyance board moving mechanism 75 horizontally moves the conveyance plate 74 in the G direction shown in the figure in accordance with the control of the control unit. In this manner, when the absorbing unit 70 sucks and supports the substrate St and is disposed at the substrate absorbing release position, the transfer plate 74 is disposed at a position below the substrate St (the position indicated by a broken line in Fig. 6). Then, when the suction support of the absorbing unit to the substrate St is released, the substrate St is placed on the upper surface of the conveyance plate μ. Then, the conveyance plate 74 is moved to the front side of the A-side inspection absorbing table 22 with the substrate st placed thereon. /, two persons, the operation of the substrate supply unit 7 will be described with reference to Figs. 9 to 15 . In addition, FIG. 9 is a flowchart for showing the operation of feeding the substrate w from the substrate supply unit 7 to the A-side inspection sorption table 22 & 22 (1). FIG. 1 to FIG. 15 are schematic views, respectively. The operation of the substrate supply unit 7 is shown in the operation of the flowchart shown in Fig. 9. In Fig. 9, the control unit of the substrate inspection device 驱 is driven by the first substrate transporting belt 1 as the second The lifting support member 72 is lowered to a position where the suction surface of the most substrate St and the absorbing unit 70 is placed (step _. For example, the substrate inspection device uses the height information rotated from the height sensor, The stowage height of the substrate s of the object (the remaining amount of the substrate S): the substrate is now sucked by the substrate of the absorbing unit 7G by n 29 M337563, as shown in FIG. The control unit drives the elevating mechanism 73 to lower the elevating support member 72 in the direction E1 shown in the figure, and arranges the unit 70 in the substrate suction start position. In this manner, the first absorbing portion 702 is sucked. The surface is close to the substrate stowed in the uppermost position
St長軸方向之端部附近。這時,從後述步驟之動作可以 明白,搖動機構71動作而使吸著單元7〇之吸著面成為水 平,因此該吸著面和最上位置之基板St的主 狀態下相接近。 干仃之 •其次,基板檢查裝置1之控制部控制送風機9Q之驅動 和吸著壓力控制部707之動作,對第丨吸著部7〇2供給負 壓。利用此種方式,最上位置之基板St之端部被吸引向 第1吸著部702之吸著面中所形成的多個吸引孔ha(參照 •圖1 2,第1吸著部702之吸著面和基板St之上面前端部 相抵接(步驟S51 ;參照圖8)。利用此種方式,第2〜第4 吸著部703〜705之吸著面和後端抵接構件7〇6與基板St 春之上面成為相接觸之狀態。此時,基板檢查裝置i之控制 部控制吸著壓力控制部707,將第i吸著壓力之負壓供給 到第1吸著部702。第1吸著壓力是可以提起1片基板 的端部之程度的負壓,為比後述第2吸著壓力更弱之負 1 例如’對於厚度1· 6mm、大小95mmxl30mm、重量45g 之基板St,以90mm之寬度吸著,在可將其端部提起之情 况’第1吸著壓力為3〜5mmHg。另外,在圖中,產生 2 有第1吸著壓力之狀態以第1吸著部7〇2内部之實線箭頭 表示。 M337563 其次,基板檢查裝置丨之控制部使搖動機 凸輪旋轉,成兔嘛益0 - % π ^ 丹U之搖動 針方向L 下方(圖10中為反時 —α )搖動至既定角度之狀態(步驟S52)。此時,因為 Z ^ ^取上位置之基板st的上面為接觸狀態,所以吸 者單=70維持與基板st同樣之水平狀態(圖1〇之狀態)。 其次,基板檢查裝置丨之控制部驅動升降機構73了使 升降支持構件72上升(步驟S53)。例如,如圖n所示, 基板檢查裝置1之控制部驅動升降機構73,在圖示之E2 方向使升降支持構件72上升。隨該升降支持構件72之上 升’積載在最上位置之基板St的前端部,以由第丨吸著 P 7 0 2吸著之狀態被提起。另外一方面,利用吸著單元 專之本身重里,使该吸者单元在上述向下方向(圖 不之F1方向)搖動至成為上述即定角度,所以基板st之 後端成為與積載之其他基板S相接觸的狀態。亦即,僅基 板St之前端從其他基板S提起,在該基板St和其他基板 S之間形成間隙(圖11之狀態)。 其次’基板檢查裝置1之控制部控制吸著壓力控制部 707之動作,對第2〜第4吸著部7〇3〜7〇5供給負壓(步驟 S54)。利用此種方式,最上位置基板st之端部被吸引向 弟2弟4吸者部703〜705之吸著面上所形成的多個吸引 孔hb或hc(參照圖7),利用第丨〜第4吸著部702〜705可 以確實地吸著且固定基板St(圖12之狀態)。此時,基板 檢查裝置1之控制部控制吸著壓力控制部707,將第2吸 31 M337563 著廢力之負壓供給到第2〜第4吸著部 二力:可以確實吸著且固定基板st而將其整體提 麼,為比上述第1吸著廢力更強之負壓。例如,對於厚产 u:、Y、95mmxl3m45g^wm9: 之見度吸者而將其整體提起之情況,帛2吸著 崎以上。另外’在圖12中,產生有第2吸著壓力: 狀悲以第2〜第4吸著部703〜705内部之白色箭頭表示。 在此處之基板St ’如同先前技術所說明之方式 有通孔TH或縫隙SL #貫通表面/#面之多個孔。但是, 因為在最上位置之基板st和從最上位置起第2片之基板 s之間形成有間隙,所以基板st和第2片之基板s不互 相密著,吸引力只對該最上位置之基板st發生強大的作 用0 • 其次,基板檢查裝置1之控制部控制吸著壓力控制部 707之動作,將對第i吸著部7〇2供給之壓力從第i吸著 修壓力變更成為第2吸著壓力(步驟S55)。然後,基板檢查 f置1之控制部使搖動機構71之搖動凸輪旋轉,以使吸 著單π 70搖動至水平狀態(步驟S56),更進一步驅動升 降機構73,將吸著單元70配置在上述基板吸引解除裝置 (步驟S57 ;圖13之狀態)。例如,如圖13所示,上述控 制部使搖動凸輪旋轉,以使吸著單元70在圖示之F2方向 搖動成為水平狀態。然後,上述控制部更進一步驅動升降 機構73 ’使升降支持構件72在圖示之E3方向更進一步 上升’以將吸著單元70配置在上述基板吸引解除位置。 32 M33 7563 利用a此種方式,被吸著單元70吸著©定之基板以, 平狀態配置在基板吸今丨 土 承盔蝥〇 ^ 刀砰丨示伹罝。另外,在圖13中,變 表:。°及者屢力之第1吸著部702的狀態以中空之箭頭 75其;=反檢7查裝置1之控制部控制搬運板移動機構 SL ΓΓ 移動到吸著單元7G之下方位置(步驟 邱’“基板檢查裝置1之控制部控制吸著壓力控制 °之動作’停止對第1〜第4吸著部7G2〜705供給負 塾(步驟S59;圖14之狀態)。利用此種方式,將吸著單 兀7〇所吸著固定之基板St載置在搬運板74上。例如, 如圖14所不,上述控制部使搬運板74在圖示之^方向 移動’在吸著固定基板st之吸著單元7〇的下方位置,配 置該搬運板74。然後’經由停止對第卜第4吸著部7〇2〜服 i、、、’s負£,將吸著固定之基板St載置在搬運板μ之上 面。另外’在圖14中,第卜第4吸著部7G2〜7{)5内部未 標示中空箭頭者表示未被供給負壓之狀態。 其次,基板檢查裝置丨之控制部控制搬運板移動機構 75,使搬運板74移動到成為A面檢查吸著台22之正下位 置的基板供給位置(步驟S60 ;圖15之狀態)。例如,如 圖15所示,上述控制部使搬運板74在圖示之G2方向移 動,以使該搬運板7 4移動到上述基板供給位置。 其次,基板檢查裝置1之控制部使全部之氣缸23a〜23d 和33a〜33d向伸長方向動作(參照圖3),以使A面檢查吸 著台22a〜22d中之任一個吸著面,配置在載置有基板^ 33 M337563 之搬運板74之上方附近。然後’ A面檢查吸著台22吸引 載置純運板74上之基板1該基板St之-方主面(具 體而言,B面)被直空%莫而丄 八工及者而固定在該Λ面檢查吸著台22 之吸著面(步驟S61)。 其次,基板檢查裝置i之控制部使全部之氣缸23a~23d 和33a〜33d向收縮方向動作(參照_…利用該動作,a 面檢查吸著台22a〜22d和B面檢查吸著台如〜伽全部配 置在第1旋轉構件21和第2旋轉構件31之侧面附近,在 上,步驟S61被真空吸著而固定在A面檢查吸著台^之 吸著面的基板s,由基板供給部7撿拾(步驟S62)。 其-人,基板檢查裝置1之控制部判斷是否繼續供給基板 S(步知S63)。然後,控制部在繼續供給基板s之情況時, 回到上述步驟S50重複進行處理,在結束基板s之供給 時,結束該流程圖之處理。 依照此種方式,在基板供給部γ,只吸著並提起最上位 置之基板St的端部附近。因為使用負壓之氣體吸引而產 生提起該基板St之力,所以吸引力不會老化,不需要先 前技術中使用黏著構件等時所必要之維護。另外,經由只 吸著最上位置之基板St的端部附近,可以容易地只剝離 最上位置之基板St,在最上位置之基板St和第2片基板 s之間不密著而形成有間隙之後,只有最上位置之基板S1: 被其他之吸著部確實地吸著固定。因此,本創作之基板取 出t置’即使是形成有貫通表面/背面之多個孔的基板, 亦可以防止由積載之多個基板之中取出2片,可以只取出 34 M337563 载置在最上位置之基板。 女在本創料,只將最上位置之基板^㈣他基板5剝 離之本質_h的要素’在如上所⑱,只吸著撿拾基板Μ在 ^度方向之端部。例如,在吸著撿拾於基板st之中央部 :’因為基板st和其他基板s之密著力較強,所以容易 撿拾2片基板,但是經由只吸著於長度方向之端部,可以 在基板St和其他基板5之間容易地形成間隙。 另卜對於被撿拾之基板St受第1吸著部702吸引之 2圍(參照圖8),相較於該吸引範圍所含基板st之孔的 總計孔面積,該吸引範圍所含第1吸著部7〇2之吸引孔 ha的總面積越大,防止取出2片之效果越高。例如,如 圖16所示,考慮到最上位置之基板st和其他基板s互相 .偏移而積載之情況。這時,對於第丨吸著部7〇2之吸引孔 _ 和基板St之孔互不一致的位置,該吸引孔ha之吸引 置吸引孔ha之吸引力作用在第2片基板S2(圖示之 虛線前碩)。亦即,防止取出2片之效果變高,要確實只 撿扣最上位置之基板St時,需要使施加於第2片基板μ 之吸引力變小,同時使吸引孔ha和基板st之孔互不一致 力/、作用於基板St(圖示之實線箭頭)。另外一方面,對 φ於第1吸著部702之吸引孔ha和基板st之孔相一致的位 之位置麦多。例如,經由使形成在第1吸著部702之吸引 範圍的吸引孔ha之孔數儘可能變多,而使施加在基板st 之吸引力變大,經由控制供給到第i吸著部7〇2負壓使其 變低(例如,上述之第丨吸著壓力)使施加在基板s之吸引 35 M337563 力爻小日寸,可以防止取出2片,同時確實地只撿拾最上位 f之基板St的效果變高。亦即,經由使形成在第丨吸著 T 7〇2之吸引範圍的吸引孔ha之孔數變多(吸引孔ha之 j面知變大),而使施加在基板st之吸引力相對於施加在 第2片基板S2之吸引力的比例增加。另外,經由控制供 、$到第1吸著部702之負壓使其變低,可以使施加在第2 片基板S2之吸引力的絕對值變低。 φ例如,如圖17所示,考慮使形成有多個吸引孔ha之第 1吸著部702和形成有多個貫通孔之基板st相重疊之情 形。在此處圖17之下圖中,以實線表示形成有多個吸引 孔ha之第1吸著部2,以虛線表示形成有多個貫通孔 之基板St,吸引孔ha和貫通孔重複之區域以塗黑區域表 •示。從圖17可以明白,因為吸引孔ha和貫通孔相重複之 面積,相對於吸引孔ha之面積的比例相對較低,所以相 對於施加在基板St之吸引力,施加在第2片基板s2之吸 籲引力極低。另外可以明白,經由更使吸引孔ha之孔數變 多,可以使施加在第2片基板S2之吸引力對施加在基板 St之吸引力的比例更低。 在上述第1吸著部7〇2之一實例中,以中心間之間距 1. 5mm形成直徑〇. 5mm之吸引孔ha而成為矩陣狀,但是 亦可以使用其他之態樣。例如,即使是通常送風機吸著所 使用之直徑1. 5mm的吸引孔,經由在設定於上述支持構件 701a側之既定區域中可孔加工之範圍内,儘可能使吸引 孔形成矩陣狀,亦可以實現本創作。另外,如圖18A所示, 36 M337563 亦可以使吸引孔ha交錯配置。經由將吸引孔ha形成交錯 配置Y因為可以更有效地配置吸引孔ha,所以可以更進 v k咼上述既疋區域内之孔數或孔總面積。另外,使吸 引孔ha成為交錯配置而使直徑形成為〇.5〜〇 8mm程度 时可以更有效地配置吸引孔ha。另外,亦可以以多孔 質結晶合金等構成第1吸著部702之吸著面。 考慮以相同之第i吸著部7〇2吸引最小尺寸之基板 Smin,對於未接觸在該基板Smin之吸著面,亦可以使第 1吸著部702之吸引孔ha的數目變少。例如,如圖18β 所示對於接觸在最小尺寸之基板Smin的第1吸著部7〇2 之吸著面,依照上述方式形成較多吸引孔“。另外一方 面,對於因基板S之尺寸而可能未與其接觸的第丨吸著部 • 702之吸著面,相對地形成較少數之吸引孔hb。另外,對 於基板Smin等尺寸較小之基板s,在吸引茂漏較多之情 況,亦可以利用吸著壓力控制部707區分基板s之尺寸而 _控制吸引壓力。 另外,考慮以相同之第1吸著部702吸引最小尺寸之美 板-η’亦可以將第1吸著部7〇2之吸引孔ha分成多: 群組而控制吸引壓力。例如,如圖18C所示,將形成有吸 引孔ha之第1吸著部咖的吸著面區分成為3個區域 Arl〜Ar3,對各個區域Arl〜Ar3供給之負壓分別獨立地由 吸著壓力控制部m所控制。另外,依照成為供給對象之 基板S的尺寸而控制供給到各個區域A r丨〜A『3之吸引壓力 日寸,可以依照基板尺寸而供給適當之吸引壓力。 37 M337563 另外’在上述說明中所示實例,將載置在搬運板74上 之基板St搬運到吸著單元70之後端側(亦即,後端抵接 構件706側)’但是亦可以搬運向另外一個方向。例如, 亦可以將載置在搬運板74上之基板St搬運向吸著單元 7〇之前端(亦即,第!吸著部7〇2側),亦可以搬運向吸 著單元70之左右方向。 另外,在上述說明中所使用之實例,如圖8等所示,將 相對於基板St之前端而靠近右側之端部設定在第i吸著 部702之吸引範圍,但是亦可以將吸引範圍設定在其他位 置。第1吸著部702之吸引範圍只要涵蓋各個尺寸之基板 St可以共同存在的前端部附近即可,例如,亦可以在相 對於基板St之前端而靠近左側之端部或基板^前端之中 央。 料,在上述說明中除了第i吸著部外亦設有3個 :::二第4,”03〜7〇5)’但是用以支持第1吸 1著固疋基;^ St之機構,亦可以使用其他態樣。 =之:式,因為只利用$ 1吸著部7〇2之吸著固定時 將U體提升之吸引力不或吸著111定基板St 將其知:起之安藝冗籍中 _ 。例如。要可二Π第…吸著部 .要至,丨、乂,/、要可以吸耆固定基板St穩定地提起, :支持第1吸著部7°2之其他吸著部即 可,亦可以使用4個以上之吸著部。另外,二 吸著部7〇2之其他吸著部亦可以使用具有大型吸著面之 吸著部’㈣著作為供給料之錢㈣ 者面之 38 M337563 另外,在上述說明中,使吸著單元70升降,以形成最 上位置之基板St和第2片基板S2之間隙藉以撿拾該基板 St,但是只要最上位置之基板St和第2片基板S2在高度 方向之位置關係分別相對地擴大/縮小即可,亦可以使用 其他之態樣。例如,亦可以使積載之基板S本身升降,將 最上位置之基板St和第2片基板S2在高度方向之位置關 係擴大/縮小。 另外,在上述說明中,使本創作之基板取出裝置適用在 鲁具有多個檢查吸著台之基板檢查裝置,但是亦可以適用在 其他之裝置。例如,亦可以適用在具有單獨檢查吸著台之 基板檢查裝置,亦可以適用在描繪裝置或進行其他處理之 t置。另外’利用基板取出裝置取出之基板亦可以不是需 •要對其兩面進行外觀檢查之兩面基板。 本創作之基板取出裝置可以使裝置之維護作業極力地 變少,同時在積載之多個基板中,可以防止取出2片,可 φ以只取出載置在最上層之基板,可以適用在對形成有貫通 表面/背面之多個孔的基板進行處理之裝置等用途。 以上已詳細說明本創作,上述說明之所有部份只不過是 本創作之實例,並不用來限定其範圍。在不脫離本創作之 範圍内,可以進行各種改良或變化。 【圖式簡單說明】 圖1是前視圖,表示本創作一實施形態之基板檢查裝置 1的概略構造。 圖2是俯視圖,表示圖1之基板檢查裝置1的概略構造。 39 M337563 圖3是前視圖,表示圖i之氣缸23和33為伸長狀態之 基板檢查裝置1的概略構造。 圖4是内部侧視圖,表示圖丨之基板檢查裝置1的空壓 機構之概略構造。 圖5是後視圖,表示圖i之基板檢查裝置1中驅 構件使其旋轉之機構的構造。 圖6是側視圖’表示圖1之基板供給部7的概略構造。 _ 圖7是圖6之吸著單元7〇的底視圖。 圖8表示第1吸著部7〇2吸引配置在既定位置之基 Smax和Smin的上面之範圍的一實例。 反 “圖9是流程圖’用來表示從基板供給部面檢 著台22a〜22d之任何一個供給基板s之動作。 — 圖1〇是概略圖,用來表示根據圖9所示流程圖之動 •使基板供給部7動作之狀態的第1階段。 圖11疋概略圖,用來表示根據圖9所示流程圖之動 _使基板供給部7動作之狀態的第2階段。 圖12是概略圖,用來表示根據圖9所示流程圖之動 使基板供給部7動作之狀態的第3階段。 囷疋概略圖,用來表示根據圖g所示流程圖之動作 使基板供給部7動作之狀態的第4階段。 圖14是概略圖,用來表示根據圖9所示流程圖之 使基板供給部7動作之狀態的第5階段。 ’ 圖15是概略圖,用來表示根據圖9所示流程圖之動 使基板供給部7動作之狀態的第6階段。 ’ M337563 圖16用來說明最上位置之基板st和其他基板s相互偏 移而積載之情況,施加在各個基板st和s之吸引力。 圖17表示使形成有多個吸引孔ha之第1吸著部702和 形成有多個貫通孔之基板st相重疊的狀態。 圖18A表示形成在第i吸著部7〇2之吸引孔ha的第1 變化例。 圖18B表示形成在第}吸著部7〇2之吸引孔ha的第2 變化例。 圖18C表示形成在第i吸著部7〇2之吸引孔^的第3 變化例。 圖19表示基板s之一實例。 圖2(^是職圖,知送風射著 置構造。 衣 之概略的裝 圖20B是剖視圖,表示習知送風機吸著方 置構造。 "" 式 圖21A是剖視圖,概略地表示習知使用 黏著構件之方 式。 圖21B是剖視圖,概略地表示習知使用 黏著構件之方 主要元件符號說明 3 4 基板檢查裝置 苐1檢查站 苐2檢查站 A面檢查頭 M337563 5 B面檢查頭 6 框架 7 基板供應部 8 基板儲存部 10 第1基板搬運輸送帶 11 第2基板搬運輸送帶 21 弟1旋轉構件 22 、 22a〜22d A面檢查吸著台 23 、 23a〜23d 氣缸 24 第1旋轉軸 25、35 正時皮帶輪 31 第2旋轉構件 32 、 32a〜32d B面檢查吸著台 33 、 33a〜33d 氣缸 34 第2旋轉軸 4卜51 縫隙 61 檢查頭樑 62a〜62c 軸承 63 本體基座 64 抵接構件 65 螺栓 62卜 621a〜621c 執道 622 、 622a 、 622bl Λ 622b2 、 622c 滑動塊 42 M337563 651 線性馬達 70 吸著單元 71 搖動機構 72 升降支持構件 73 升降機構 74 搬運板 75 搬運板移動機構 81a〜81c 基板盒 82a〜82c 升降台 83 轉盤 84 第1搬出輸送帶 85 第2搬出輸送帶 90 送風機 91a 、 91b 主配管 92 空壓切換部 93 、 93a〜93d 吸著配管 94 、 94a〜94d 氣缸配管 95 壓縮機 101 旋轉驅動馬達 102 皮帶輪 103 正時皮帶 104 、 105 張力輪 7(H、701a、701b 支持構件 702 第1吸著部 43 M337563 703 第2吸著部 704 第3吸著部 705 第4吸著部 706 後端抵接構件 707 吸著壓力控制部 ha " hb 吸引孔 S 基板 S2 第2片基板 SL 縫隙 Smax 最大基板 Smin 最小基板 Sng 不良基板 Sok 合格基板 St 最上位置基板 TH 通孔 44St near the end of the long axis direction. At this time, it can be understood from the operation of the step described later that the rocking mechanism 71 is operated to bring the suction surface of the absorbing unit 7 to a level, and therefore the absorbing surface is close to the main state of the substrate St at the uppermost position. Further, the control unit of the substrate inspection apparatus 1 controls the driving of the blower 9Q and the operation of the suction pressure control unit 707 to supply a negative pressure to the second suction unit 7〇2. In this manner, the end portion of the substrate St at the uppermost position is attracted to the plurality of suction holes ha formed in the absorbing surface of the first absorbing portion 702 (refer to Fig. 12, the suction of the first absorbing portion 702). The front surface of the substrate is in contact with the upper end portion of the substrate St (step S51; see Fig. 8). In this manner, the suction surface and the rear end abutting member 7〇6 of the second to fourth suction portions 703 to 705 are The upper surface of the substrate St is in contact with each other. At this time, the control unit of the substrate inspection device i controls the suction pressure control unit 707 to supply the negative pressure of the i-th suction pressure to the first absorbing unit 702. The first sorption The pressure is a negative pressure that can lift the end of one of the substrates, and is a negative one that is weaker than the second suction pressure to be described later. For example, for a substrate St having a thickness of 1.6 mm, a size of 95 mm x 30 mm, and a weight of 45 g, a width of 90 mm. In the case where the end portion can be lifted up, the first suction pressure is 3 to 5 mmHg. In the figure, the first suction pressure is generated in the state of the first suction portion 7〇2. The solid arrow indicates M337563 Next, the control unit of the substrate inspection device rotates the rocker cam to become a rabbit. 0 - % π ^ 丹 U is in the state of shaking the needle direction L (in the opposite direction in Fig. 10 - α) to a predetermined angle (step S52). At this time, since the upper surface of the substrate st at the position of Z ^ ^ is in contact state, Therefore, the sucker list = 70 maintains the same horizontal state as the substrate st (the state of Fig. 1). Next, the control unit of the substrate inspection device 驱动 drives the elevating mechanism 73 to raise the elevating support member 72 (step S53). For example, As shown in Fig. n, the control unit of the substrate inspection apparatus 1 drives the elevating mechanism 73 to raise the elevating support member 72 in the direction E2 shown in the figure. As the elevating support member 72 rises, it is stowed at the front end portion of the substrate St at the uppermost position. It is lifted in a state of being sucked by the first sucking P 7 0 2 . On the other hand, the sucker unit is used to make the sucker unit shake in the downward direction (not in the F1 direction) until it becomes heavy. Since the above-described angle is set, the rear end of the substrate st is in contact with the other substrate S that is stacked. That is, only the front end of the substrate St is lifted from the other substrate S, and a gap is formed between the substrate St and the other substrate S (Fig. State of 11 Next, the control unit of the substrate inspection device 1 controls the operation of the suction pressure control unit 707 to supply a negative pressure to the second to fourth suction portions 7〇3 to 7〇5 (step S54). The end portion of the uppermost position substrate st is attracted to the plurality of suction holes hb or hc (see FIG. 7) formed on the suction surface of the brothers 4 to 705, and the fourth to fourth suction portions are used. 702 to 705 can reliably suck and fix the substrate St (the state of Fig. 12). At this time, the control unit of the substrate inspection apparatus 1 controls the suction pressure control unit 707 to supply the negative pressure of the second suction 31 M337563 waste. The second to fourth absorbing portions are two-force: the substrate can be surely sucked and fixed, and the entire substrate is lifted, and the negative pressure is stronger than the first absorbing waste. For example, in the case of a thick product u:, Y, 95mmxl3m45g^wm9: the visibility is sucked up and the whole is lifted, 帛2 sucks above. Further, in Fig. 12, the second suction pressure is generated: the sorrow is indicated by the white arrow inside the second to fourth absorbing portions 703 to 705. Here, the substrate St' has a plurality of holes of the through-hole TH or the slit SL #through surface/# face as described in the prior art. However, since a gap is formed between the substrate st at the uppermost position and the substrate s of the second sheet from the uppermost position, the substrate st and the substrate s of the second sheet are not adhered to each other, and the attraction force is only the substrate at the uppermost position. The control unit of the substrate inspection device 1 controls the operation of the suction pressure control unit 707, and changes the pressure supplied to the i-th suction unit 7〇2 from the i-th suction pressure to the second. The suction pressure (step S55). Then, the control unit of the substrate inspection f is set to rotate the rocking cam of the rocking mechanism 71 so that the suction unit π 70 is shaken to the horizontal state (step S56), the elevating mechanism 73 is further driven, and the absorbing unit 70 is disposed above. The substrate suction releasing device (step S57; state of Fig. 13). For example, as shown in Fig. 13, the control unit rotates the rocking cam to cause the absorbing unit 70 to swing in the F2 direction shown in the horizontal state. Then, the control unit further drives the elevating mechanism 73' to raise the elevating support member 72 further in the E3 direction shown in the drawing to arrange the absorbing unit 70 at the substrate suction releasing position. 32 M33 7563 In this way, the absorbing unit 70 sucks the substrate set by the absorbing unit 70, and the flat state is placed on the substrate to absorb the hood. In addition, in Fig. 13, the table is changed. ° The state of the first absorbing portion 702 is the hollow arrow 75; the control unit of the reverse inspection 7 check device 1 controls the transporting plate moving mechanism SL ΓΓ to move to the lower position of the absorbing unit 7G (step Qiu "The operation of the control unit of the substrate inspection device 1 to control the suction pressure control °" stops the supply of negative enthalpy to the first to fourth absorbing portions 7G2 to 705 (step S59; state of Fig. 14). The substrate St to which the suction unit 7 is sucked and fixed is placed on the conveyance plate 74. For example, as shown in Fig. 14, the control unit moves the conveyance plate 74 in the direction of the figure. The conveyance plate 74 is disposed at a position below the suction unit 7A. Then, by stopping the fourth suction portion 7〇2 to the service i, , and 's, the substrate St is held by the suction. It is placed on the top of the conveyance plate μ. In addition, in Fig. 14, the inside of the fourth suction portion 7G2 to 7{5) is not marked with a hollow arrow, indicating that the negative pressure is not supplied. Next, the substrate inspection device The control unit controls the transporting plate moving mechanism 75 to move the transporting plate 74 to the front and bottom of the A-side inspection absorbing table 22. The substrate supply position (step S60; the state of Fig. 15). For example, as shown in Fig. 15, the control unit moves the transport plate 74 in the G2 direction shown in the figure to move the transport plate 74 to the substrate supply position. Next, the control unit of the substrate inspection apparatus 1 operates all of the cylinders 23a to 23d and 33a to 33d in the extending direction (see FIG. 3) so that one of the suction surfaces 22a to 22d of the A surface is inspected. It is disposed near the upper side of the transporting plate 74 on which the substrate ^33 M337563 is placed. Then, the 'A-side inspection absorbing table 22 attracts the substrate 1 on the pure transporting plate 74 to the main surface of the substrate St (specifically, The B surface is fixed to the suction surface of the suction surface 22 by the straight surface (step S61). Next, the control unit of the substrate inspection device i makes all the cylinders 23a to 23d. And 33a to 33d are operated in the contraction direction (refer to _... by this operation, the a-surface inspection sorption tables 22a to 22d and the B-surface inspection sorption stations are all disposed in the first rotating member 21 and the second rotating member 31. Near the side, on the top, step S61 is vacuumed and fixed on the A side to check the suction table. The substrate s of the suction surface is picked up by the substrate supply unit 7 (step S62). The control unit of the substrate inspection device 1 determines whether or not the substrate S is continuously supplied (step S63). Then, the control unit continues to supply the substrate s. In the case of the above-described step S50, the processing is repeated, and when the supply of the substrate s is completed, the processing of the flowchart is terminated. In this manner, in the substrate supply unit γ, only the substrate St of the uppermost position is sucked and lifted. In the vicinity of the end portion, since the force for lifting the substrate St is generated by the gas suction using the negative pressure, the attraction force is not deteriorated, and maintenance necessary for the use of the adhesive member or the like in the prior art is not required. Further, by sucking only the vicinity of the end portion of the substrate St at the uppermost position, it is possible to easily peel only the substrate St at the uppermost position, and after the substrate St and the second substrate s at the uppermost position are not adhered to each other, a gap is formed. Only the substrate S1 at the uppermost position is reliably sucked and fixed by the other absorbing portions. Therefore, the substrate of the present invention is taken out t. Even if a substrate having a plurality of holes penetrating the front surface/back surface is formed, it is possible to prevent two sheets from being taken out from the stacked substrates, and it is possible to take only 34 M337563 and place it in the uppermost position. The substrate. In the present invention, only the substrate of the uppermost position is used, and the element _h of the substrate 5 is peeled off. In the above 18, only the end of the substrate in the ^ direction is sucked. For example, it is sucked and picked up at the central portion of the substrate st: 'Because the adhesion between the substrate st and the other substrate s is strong, it is easy to pick up two substrates, but it can be on the substrate St by absorbing only the end portion in the longitudinal direction. A gap is easily formed between the other substrate 5. Further, the second substrate (see FIG. 8) in which the substrate St to be picked up is attracted by the first absorbing portion 702 is compared with the total hole area of the hole of the substrate st included in the suction range, and the first suction portion of the suction range is included. The larger the total area of the suction holes ha of the portion 7〇2, the higher the effect of preventing the removal of the two sheets. For example, as shown in Fig. 16, it is considered that the substrate st and the other substrate s at the uppermost position are staggered and staggered. At this time, the suction hole _ of the second sucking portion 7〇2 and the hole of the substrate St do not coincide with each other, and the suction force of the suction hole ha attracts the suction hole ha to act on the second substrate S2 (the dotted line is shown) Former master). In other words, the effect of preventing the removal of the two sheets becomes high. When the substrate St at the uppermost position is actually buckled, the attraction force applied to the second substrate μ is required to be small, and the holes of the suction holes ha and the substrate st are mutually made. The inconsistent force / acts on the substrate St (solid arrow shown). On the other hand, the position of the position where the suction hole ha of the first absorbing portion 702 and the hole of the substrate st coincide with each other is Φ. For example, the number of holes of the suction holes ha formed in the suction range of the first absorbing portion 702 is increased as much as possible, so that the suction force applied to the substrate st is increased, and is supplied to the ith absorbing portion 7 via the control. 2 Negative pressure makes it lower (for example, the above-mentioned third suction pressure), so that the attraction of 35 M337563 applied to the substrate s is small, and it is possible to prevent two sheets from being taken out, and at the same time, only the substrate St of the uppermost position f is surely picked up. The effect becomes higher. In other words, by increasing the number of holes of the suction holes ha formed in the suction range of the second suction T 7〇2 (the j-plane of the suction holes ha becomes large), the attraction force applied to the substrate st is relatively The proportion of the attraction force applied to the second substrate S2 increases. Further, by controlling the supply and the negative pressure to the first absorbing portion 702 to be low, the absolute value of the suction force applied to the second substrate S2 can be lowered. For example, as shown in Fig. 17, it is considered that the first absorbing portion 702 in which the plurality of suction holes ha are formed and the substrate st in which the plurality of through holes are formed are overlapped. In the lower diagram of Fig. 17, the first absorbing portion 2 in which a plurality of suction holes ha are formed is indicated by a solid line, and the substrate St on which a plurality of through holes are formed is indicated by a broken line, and the suction hole ha and the through hole are repeated. The area is shown in the black area. As can be understood from Fig. 17, since the area in which the suction hole ha and the through hole are overlapped is relatively low with respect to the area of the suction hole ha, it is applied to the second substrate s2 with respect to the attraction force applied to the substrate St. The attraction is extremely low. Further, it can be understood that the ratio of the attraction force applied to the second substrate S2 to the attraction force applied to the substrate St can be made lower by increasing the number of holes of the suction holes ha. In one example of the first absorbing portion 7〇2, a suction hole ha having a diameter of 55 mm is formed in a matrix shape with a distance of 1.5 mm between the centers. However, other aspects may be used. For example, even if the suction hole having a diameter of 1. 5 mm used for the suction of the blower is normally formed, the suction holes may be formed into a matrix as much as possible within a range of the hole machining in a predetermined region set on the side of the support member 701a. Realize this creation. Further, as shown in Fig. 18A, 36 M337563 may also have the suction holes ha staggered. By forming the suction holes ha in a staggered arrangement Y, since the suction holes ha can be arranged more efficiently, it is possible to further increase the number of holes or the total area of the holes in the above-described ridge area. Further, when the suction holes ha are arranged in a staggered manner and the diameter is set to about 5 to 8 mm, the suction holes ha can be arranged more efficiently. Further, the absorbing surface of the first absorbing portion 702 may be formed of a porous crystal alloy or the like. It is conceivable that the substrate Smin of the smallest size is attracted by the same i-th absorbing portion 7〇2, and the number of the suction holes ha of the first absorbing portion 702 can be made small without touching the absorbing surface of the substrate Smin. For example, as shown in Fig. 18β, a plurality of suction holes are formed in accordance with the above-described manner for the suction surface of the first absorbing portion 7〇2 contacting the substrate Smin of the smallest size. On the other hand, for the size of the substrate S The suction surface of the second suction portion 702 that may not be in contact therewith is relatively formed with a relatively small number of suction holes hb. Further, for a substrate s having a small size such as the substrate Smin, in the case where the suction is large, The suction pressure control unit 707 can be used to distinguish the size of the substrate s to control the suction pressure. Further, it is conceivable that the first suction portion 7 〇 2 can be sucked by the same first absorbing portion 702 to attract the smallest size of the stencil-n'. The suction hole ha is divided into a plurality of groups to control the suction pressure. For example, as shown in Fig. 18C, the suction surface of the first absorbing portion in which the suction hole ha is formed is divided into three regions Arl to Ar3. The negative pressure supplied from the regions A1 to Ar3 is independently controlled by the absorbing pressure control unit m. Further, the suction pressure is supplied to each of the areas A r 丨 〜 A 『3 according to the size of the substrate S to be supplied. Can be supplied according to the size of the substrate 37 M337563 Further, in the example shown in the above description, the substrate St placed on the carrier plate 74 is transported to the rear end side of the absorbing unit 70 (that is, the side of the rear end abutting member 706). However, it is also possible to carry the conveyance in the other direction. For example, the substrate St placed on the conveyance plate 74 may be conveyed to the front end of the suction unit 7 (that is, the side of the first suction portion 7〇2). In the left-right direction of the suction unit 70, as shown in FIG. 8 and the like, the end portion close to the right side with respect to the front end of the substrate St is set in the i-th absorbing portion 702. Although the suction range is set, the suction range may be set to another position. The suction range of the first absorbing portion 702 may be in the vicinity of the front end portion where the substrates St of the respective sizes can coexist, for example, may be opposite to the substrate St. The front end is close to the end of the left side or the center of the front end of the substrate. In the above description, in addition to the i-th absorbing portion, there are also three::: two fourth, "03~7〇5)' Support the first suction 1 solid foundation; ^ St machine Also can use other aspects. =: The formula, because only the suction of the suction part of the $1 〇7 is fixed. The attraction of the U-body is not increased or the 111-plate substrate is sucked. It is known as the AI. E.g. It is necessary to sip the absorbing part. To reach, 丨, 乂, /, you can suck the fixed substrate St stably, and support: the other absorbing part of the first absorbing part 7 ° 2 can also be used, Use more than 4 absorbing parts. In addition, the other absorbing portion of the second absorbing portion 7〇2 may use a absorbing portion having a large absorbing surface (4) as a material for feeding (4) 38 M337563. In addition, in the above description, absorbing The unit 70 is lifted and lowered to form the gap between the substrate St and the second substrate S2 at the uppermost position to pick up the substrate St. However, the positional relationship between the substrate St and the second substrate S2 in the uppermost position in the height direction is relatively enlarged/reduced. Yes, you can use other aspects. For example, the stacked substrate S itself may be moved up and down, and the position of the uppermost substrate St and the second substrate S2 in the height direction may be enlarged/reduced. Further, in the above description, the substrate take-out device of the present invention is applied to a substrate inspection device having a plurality of inspection suction stations, but it can be applied to other devices. For example, it can also be applied to a substrate inspection device having a separate inspection sorption table, and can also be applied to a drawing device or other processing. Further, the substrate taken out by the substrate take-out device may not be a double-sided substrate on which both sides of the substrate are to be visually inspected. The substrate take-out device of the present invention can reduce the maintenance work of the device as much as possible, and at the same time, it is possible to prevent two pieces from being taken out in a plurality of stacked substrates, and it is possible to take out only the substrate placed on the uppermost layer, and it is suitable for the formation of the pair. A device having a substrate that penetrates a plurality of holes on the front surface or the back surface is used for processing. The above description has been described in detail, and all the above descriptions are merely examples of the present invention and are not intended to limit the scope thereof. Various modifications or changes can be made without departing from the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view showing a schematic configuration of a substrate inspecting apparatus 1 according to an embodiment of the present invention. FIG. 2 is a plan view showing a schematic structure of the substrate inspection apparatus 1 of FIG. 1. 39 M337563 Fig. 3 is a front view showing the schematic configuration of the substrate inspection apparatus 1 in which the cylinders 23 and 33 of Fig. i are in an extended state. Fig. 4 is a side elevational view showing the schematic configuration of the air pressure mechanism of the substrate inspection apparatus 1 of the drawing. Fig. 5 is a rear elevational view showing the configuration of a mechanism for rotating the driving member in the substrate inspection apparatus 1 of Fig. i. Fig. 6 is a side view showing the schematic structure of the substrate supply unit 7 of Fig. 1 . Figure 7 is a bottom plan view of the sorption unit 7A of Figure 6. Fig. 8 shows an example in which the first absorbing portion 7〇2 attracts a range in which the bases Smax and Smin are disposed at predetermined positions. In contrast, "Fig. 9 is a flowchart" for indicating the operation of supplying the substrate s from any of the substrate supply surface inspection stages 22a to 22d. - Fig. 1A is a schematic view showing the flow chart according to Fig. 9. The first stage of the state in which the substrate supply unit 7 is operated. Fig. 11 is a schematic view showing the second stage of the state in which the substrate supply unit 7 is operated according to the flow chart shown in Fig. 9. Fig. 12 The schematic diagram shows the third stage of the state in which the substrate supply unit 7 is operated in accordance with the flow chart shown in Fig. 9. The schematic view shows the substrate supply unit 7 in accordance with the operation of the flowchart shown in Fig. g. Fig. 14 is a schematic view showing the fifth stage of the state in which the substrate supply unit 7 is operated according to the flowchart shown in Fig. 9. Fig. 15 is a schematic view showing the figure according to the figure. The sixth stage of the state in which the substrate supply unit 7 is operated by the flow chart shown in Fig. 9. M337563 Fig. 16 is a view for explaining that the substrate st and the other substrate s at the uppermost position are offset from each other and are stacked on each of the substrates st and The attraction of s. Figure 17 shows that a plurality of suctions are formed. The first absorbing portion 702 of the hole ha and the substrate st having the plurality of through holes are overlapped. Fig. 18A shows a first variation of the suction hole ha formed in the i-th absorbing portion 7〇2. Fig. 18B shows The second variation of the suction hole ha formed in the absorbing portion 7〇2 is shown in Fig. 18C. Fig. 18C shows a third variation of the suction hole formed in the ith absorbing portion 7〇2. Fig. 19 shows one of the substrates s. Fig. 2 is a cross-sectional view showing a conventional suction blower squashing structure. Fig. 21B is a cross-sectional view schematically showing the main components of the conventionally used adhesive member. 3 4 Substrate inspection device 检查1 inspection station 苐2 inspection station A surface inspection head M337563 5 B surface inspection head 6 frame 7 substrate supply unit 8 substrate storage unit 10 first substrate conveyance belt 11 second substrate conveyance belt 21 first rotation member 22, 22a to 22d A surface inspection suction table 23, 23a to 23d cylinder 24 first rotation Shaft 25, 35 timing pulley 31 second rotation 32, 32a to 32d, B-side inspection suction table 33, 33a to 33d, cylinder 34, second rotation shaft 4, 51, slit 61, inspection head beam 62a to 62c, bearing 63, body base 64, abutment member 65, bolt 62, 621a to 621c Roads 622, 622a, 622bl 622 622b2, 622c Slide block 42 M337563 651 Linear motor 70 Suction unit 71 Shake mechanism 72 Elevating support member 73 Elevating mechanism 74 Carrier plate 75 Carrier plate moving mechanisms 81a to 81c Substrate boxes 82a to 82c Elevator table 83 Turntable 84 First carry-out conveyor belt 85 Second carry-out conveyor belt 90 blowers 91a and 91b Main piping 92 Air pressure switching units 93, 93a to 93d Suction piping 94, 94a to 94d Cylinder piping 95 Compressor 101 Rotary driving motor 102 Pulley 103 Timing belts 104 and 105 Tension wheels 7 (H, 701a, 701b Supporting member 702 First absorbing portion 43 M337563 703 Second absorbing portion 704 Third absorbing portion 705 Fourth absorbing portion 706 Rear end abutting member 707 Suction pressure control unit ha " hb suction hole S substrate S2 second substrate SL slit Smax maximum substrate Smin minimum substrate Sng defective base Eligible substrate Sok St uppermost position of the substrate 44 through holes TH