JP2008087883A - Substrate taking-out device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide substrate taking-out device and method for taking out only the substrate put at the uppermost position by preventing two substrates from being simultaneously taken out while reducing labor required in a maintenance work of the device as much as possible. <P>SOLUTION: A suction unit 70 is provided with at least a first suction part 702 for sucking only a part close to an upper face end part of the substrate St put at the uppermost position by its suction face. An elevating mechanism 73 lifts or lowers the suction unit 70 and lowers the suction unit 70 down to the position where the suction face of the first suction part 702 and the part close to the upper face end part of the substrate St at the uppermost position approach mutually. The first suction part 702 makes its suction face sucked onto the part close to the upper face end part of the substrate St at the uppermost position. The elevating mechanism 73 lifts the suction unit 70 while the suction face of the first suction part 702 is sucked onto the part close to the upper face end part of the substrate St at the uppermost position. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate take-out apparatus and a method thereof, and more particularly to a substrate take-out apparatus and a method therefor that take out stacked substrates one by one.

  Conventionally, it is necessary to prevent two or more sheets from being fed simultaneously in an apparatus that feeds the uppermost member one by one from the stacked sheet-like members. For example, as shown in FIG. 19, a substrate S such as a printed circuit board for mounting an electronic component such as a semiconductor device is assumed as the sheet-like member stacked as described above. The substrate S is formed with a plurality of holes penetrating the front and back, such as through holes TH (filled regions in the drawing) and slits SL (shaded regions in the drawing). When picking up the substrate S placed at the uppermost position by vacuum suction, for example, from the substrate supply unit loaded with such a substrate S, when a strong suction force is generated on the second and subsequent substrates S as well. There is.

  For example, as shown in FIGS. 20A and 20B, a blower suction method in which the substrate S loaded in the substrate case 502 is vacuum-sucked to the suction surface of the suction table 501 will be described. 20A and 20B are cross-sectional views showing a schematic device structure of a blower adsorption system. A plurality of suction holes are formed on the suction surface of the suction table 501. The plurality of suction holes are sucked by a blower (not shown), and when the suction surface of the suction table 501 is disposed near the opening of the substrate case 502, a negative pressure is generated inside the substrate case 502. The uppermost substrate S is vacuum-sucked on the suction surface by the suction force from the suction table 501 and picked up from the substrate case 502.

  However, as shown in FIG. 20A, since the substrate S has a plurality of holes penetrating the front and back, such as through holes TH and slits SL, the suction force from the suction table 501 is the second and subsequent substrates S. It also works around. For example, when the uppermost position and the second substrate S from the uppermost position are in close contact with each other and the third substrate S is warped, the suction force with respect to the second substrate S is greatly affected. To do. This is because a negative pressure is generated between the uppermost substrate S and the suction table 501 by blower suction, and a gap between the second and third substrates S is a positive pressure (atmospheric pressure). This is because the second substrate S is easily lifted. Further, even when a deviation occurs between the uppermost substrate S and the second substrate S, the through holes TH and slits SL formed in the uppermost substrate S act similarly to the suction holes of the suction table 501. Therefore, the second substrate S is easily lifted. As a result, as shown in FIG. 20B, the uppermost position and the second substrate S are simultaneously picked up and vacuum-sucked onto the suction surface of the suction table 501.

As a method for separating the second and subsequent members from the uppermost position, a substrate take-out device using an adhesive member is disclosed (for example, see Patent Document 1). As shown in FIGS. 21A and 21B, the substrate take-out device moves the adhesive member arm 503 on the substrate S with the adhesive member 504 exposed downward with respect to the substrate S stacked on the lifting table 505. To protrude. And the upper surface of the board | substrate S arrange | positioned in the uppermost position loaded is contact | abutted with the adhesion member 504 (state of FIG. 21A). And the clearance gap is formed between the board | substrate S of the uppermost position, and the other board | substrate S by dropping the raising / lowering table 505 (state of FIG. 21B). Thereafter, a sandwiching member or the like is inserted into the gap and the substrate S is sucked from above, whereby only the uppermost substrate S is sucked. In the above-described substrate take-out device, not only when the uppermost substrate S and the second substrate S coincide and overlap, but also when the uppermost substrate S and the second substrate S are displaced. However, only the uppermost substrate S can be taken out.
JP 2005-335843 A

  However, in the substrate take-out device disclosed in Patent Document 1, a decrease in the adhesive strength of the adhesive member 504 becomes a problem. For example, the substrate S itself generates foreign matters such as fiber scraps from the end portions thereof, and the adhesive force of the adhesive member 504 is reduced when the foreign matter adheres to the adhesive member 504. When the decrease in the adhesive force progresses, it becomes impossible to adhere only the uppermost substrate S and separate it from the other substrate S, so that the number of continuous use of the adhesive member 504 is limited. Therefore, in the substrate take-out apparatus, maintenance of the adhesive member 504 is required, and more specifically, when the adhesive force of the adhesive member 504 is reduced, an operation for refreshing the adhesive force is required.

  Further, a method of picking up a part of the substrate S by vacuum suction using a suction pad having a small suction area is also conceivable. However, in this method, it is necessary to bring the suction pad into contact with a portion where the through hole TH or the slit SL is not formed, so it is necessary to adjust the position of the suction pad according to the shape of the substrate S to be supplied. It becomes. Therefore, the work required for this adjustment is required for each substrate. Further, since a part of the substrate S is vacuum-sucked, intensive stress is applied to the substrate S, which causes deformation and contamination of the substrate S. Furthermore, depending on the shape of the substrate S, there is no portion without an appropriate through-hole for contacting the suction pad, and there is a possibility that pickup cannot be performed.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a substrate take-out apparatus and method for taking out only the uppermost substrate loaded while preventing two sheets from being removed while minimizing maintenance work of the apparatus.

In order to achieve the above object, the present invention has the following features.
1st invention is the board | substrate extraction apparatus which takes out a board | substrate from the mounted board | substrate. The substrate take-out device includes a suction unit and a lifting mechanism. The adsorption unit includes at least a first adsorption unit that adsorbs only the vicinity of the upper surface end portion of the stacked uppermost substrate with the adsorption surface. The lifting mechanism moves the suction unit up and down. The elevating mechanism lowers the suction unit to a position where the suction surface of the first suction portion and the vicinity of the upper end of the uppermost substrate are close to each other. The first adsorption unit adsorbs the adsorption surface in the vicinity of the upper end of the uppermost substrate. The elevating mechanism raises the adsorption unit in a state where the adsorption surface of the first adsorption unit is adsorbed in the vicinity of the upper end of the uppermost substrate.

  In a second aspect based on the first aspect, a plurality of suction holes for sucking an external gas are formed in a lattice arrangement or a staggered arrangement on the adsorption surface of the first adsorption section.

  In a third aspect based on the second aspect, the substrate has a plurality of through holes. The total area of the suction holes formed in the suction surface of the first suction part is wider than the total area of the through holes of the substrate formed in the portion where the suction surface is sucked.

  In a fourth aspect based on the second aspect, the substrate has a plurality of through holes. The suction holes are all formed in a partial region included in the suction surface of the first suction part. The total area of the suction holes formed on the suction surface of the first suction part is wider than the total area of the through holes of the substrate formed at the site where the region where the suction holes are formed contacts.

  In a fifth aspect based on the second aspect, the suction holes are formed with different hole number densities with respect to a region obtained by dividing the suction surface of the first suction portion into a plurality of portions.

  In a sixth aspect based on the first aspect, the suction unit is configured such that the suction unit sucks, on the suction surface, an area different from the area on which the first suction part is sucked with respect to the upper surface of the uppermost substrate. Is further included. When a gap is formed between the uppermost substrate and another substrate in accordance with the raising operation of the lifting mechanism, the second adsorption unit adsorbs the adsorption surface to the upper surface of the uppermost substrate.

  In a seventh aspect based on the sixth aspect, a swing mechanism is further provided. The swing mechanism swings the suction unit about the major axis direction of the suction surface of the first suction unit.

  In an eighth aspect based on the seventh aspect, the suction unit is configured such that when the suction surface of the first suction portion is sucked in the vicinity of the top front end portion of the uppermost substrate, the rear end abutting against the rear end of the substrate is placed. A contact member is further included.

  In a ninth aspect based on the sixth aspect, an adsorption pressure control unit is further provided. The adsorption pressure control unit controls the suction pressure supplied to the first adsorption unit and the second adsorption unit. The adsorption pressure control unit supplies the first suction pressure to the first adsorption unit when the first adsorption unit adsorbs the vicinity of the upper surface end of the uppermost substrate, and according to the raising operation of the lifting mechanism, When a gap is formed between the substrate at the position and another substrate, a second suction pressure higher than the first suction pressure is supplied to the first suction unit and the second suction unit.

  A tenth aspect of the invention is a substrate take-out method for taking out a substrate from a loaded substrate. The substrate removal method includes a descending step, an adsorption step, and an ascending step. The lowering step lowers the first suction portion that sucks only the vicinity of the upper surface end of the stacked uppermost substrate, and moves the suction surface of the first suction portion and the vicinity of the upper surface end of the uppermost substrate. Make it close. In the adsorption step, the adsorption surface of the first adsorption unit and the vicinity of the upper end of the uppermost substrate are adsorbed. The ascending step raises the first adsorption unit in a state where the adsorption surface of the first adsorption unit is adsorbed in the vicinity of the upper end of the uppermost substrate.

  According to the first aspect, of the stacked substrates, only the vicinity of the end portion of the uppermost substrate is attracted and pulled up. The force for pulling up the substrate does not change with time because it uses an adsorption force, and the maintenance required when using a conventional adhesive member or the like becomes unnecessary. In addition, by adsorbing and pulling up only the vicinity of the edge of the uppermost substrate, only the uppermost substrate can be easily peeled off, and even a substrate with a plurality of holes penetrating the front and back can be loaded. Of the plurality of substrates, it is possible to remove only the substrate placed at the uppermost position while preventing two substrates from being removed.

  According to the second aspect, since a plurality of suction holes are provided on the suction surface of the first suction part, when taking out a substrate having a plurality of holes penetrating the front and back, the second substrate from the uppermost position The suction force acting on the uppermost substrate is larger than the suction force acting on the substrate.

  According to the third aspect of the invention, since the total area of the suction holes is larger than the total area of the through holes of the substrate facing the suction surface, the effect of preventing the two-sheet removal is enhanced.

  According to the fourth aspect of the invention, since the region where the suction holes are formed is concentrated on a part of the suction surface, when sucking the substrate having a small size, by sucking the region and the substrate, Even a small-sized substrate can be taken out stably.

  According to the fifth aspect of the present invention, substrates of various sizes can be stably taken out by adjusting the suction surface area to be sucked with the substrate according to the size of the substrate to be taken out.

  According to the sixth aspect, after the gap is formed between the uppermost substrate and another substrate, the substrate is sucked and fixed by the plurality of sucking portions, so that the substrate can be stably held. Can do.

  According to the seventh aspect, since the suction unit can swing, by swinging the suction unit in a state where the suction surface of the first suction unit is sucked near the upper surface end of the uppermost substrate, Since one end of the uppermost substrate can be pulled up, a gap is easily formed between the uppermost substrate and another substrate.

  According to the eighth aspect of the invention, the suction unit is configured such that the rear end of the substrate is brought into contact with the rear end contact member in a state where the suction surface of the first suction unit is adsorbed near the upper surface end of the uppermost substrate. By swinging, it is possible to pull up only one end while pressing the other end of the uppermost substrate, so that a gap is more easily formed between the uppermost substrate and the other substrate.

  According to the ninth aspect, the pressure supplied to the first suction unit is lowered until a gap is formed between the uppermost substrate and another substrate, so that the second substrate from the uppermost position is applied. The absolute amount of the acting suction force can be reduced, and the effect of preventing two sheets from being taken is increased.

  Further, according to the substrate extraction method of the present invention, the same effect as the above-described substrate extraction apparatus can be obtained.

  With reference to FIGS. 1-5, the board | substrate inspection apparatus with which the board | substrate extraction apparatus which concerns on one Embodiment of this invention is mounted is demonstrated. FIG. 1 is a front view showing a schematic structure of the substrate inspection apparatus. FIG. 2 is a top view showing a schematic structure of the substrate inspection apparatus. FIG. 3 is a front view showing a schematic structure of the substrate inspection apparatus in a state where the air cylinder is extended. FIG. 4 is a diagram schematically showing a pneumatic mechanism of the substrate inspection apparatus. FIG. 5 is a rear view showing the structure of a mechanism for rotationally driving the rotating member in the substrate inspection apparatus. In addition, in order to clarify the positional relationship of each component, it is annotated that the entire configuration of the substrate inspection apparatus 1 is not shown in FIGS.

  1 and 2, the substrate inspection apparatus 1 includes a first inspection stage 2, a second inspection stage 3, an A-surface inspection head 4, a B-surface inspection head 5, a frame 6, a substrate supply unit 7, a substrate storage unit 8, A first substrate transfer conveyor 10, a second substrate transfer conveyor 11, and a control unit (not shown) are provided. In addition, the board | substrate supply part 7 is equivalent to an example of the board | substrate extraction apparatus of this invention. Here, an example of an object to be inspected of the substrate inspection apparatus 1 is a substrate S such as a printed circuit board for mounting an electronic component such as a semiconductor device, and as described in the background art, such as a through hole TH and a slit SL. A plurality of holes penetrating the front and back are formed. Moreover, the said board | substrate S is a double-sided board which requires the external appearance test | inspection of the both surfaces, for example. And one main surface of the board | substrate S which is a to-be-inspected object is made into A surface, and the other main surface is made into B surface.

  The first inspection stage 2 includes a first rotating member 21, an A-surface inspection suction table 22, an air cylinder 23, and a first rotating shaft 24. The first rotating member 21 has a substantially rectangular parallelepiped shape, and can rotate in the direction A in the drawing around the first rotating shaft 24. Four A-side inspection suction tables 22a to 22d are provided on four side surfaces of the first rotating member 21 parallel to the first rotating shaft 24 via air cylinders 23a to 23d, respectively. In FIG. 1, the first rotation shaft 24 is arranged perpendicular to the paper surface, and with respect to the first rotation shaft 24 via three air cylinders 23 a (only two air cylinders 23 a are shown in FIG. 1). An A-side inspection suction table 22a is provided in the upward direction. An A-surface inspection suction table 22b is provided in the left direction with respect to the first rotating shaft 24 via three air cylinders 23b (only two air cylinders 23b are shown in FIG. 1). An A-surface inspection suction table 22c is provided in a downward direction with respect to the first rotating shaft 24 via three air cylinders 23c (only two air cylinders 23c are shown in FIG. 1). Tables 22a and 22c are arranged parallel to each other. An A-surface inspection suction table 22d is provided in the right direction with respect to the first rotating shaft 24 via three air cylinders 23d (only two air cylinders 23d are shown in FIG. 1). Inspection suction tables 22b and 22d are arranged in parallel to each other.

  The second inspection stage 3 is juxtaposed with the first inspection stage 2. The second inspection stage 3 includes a second rotating member 31, a B-surface inspection suction table 32, an air cylinder 33, and a second rotating shaft 34. The second rotating member 31 has a substantially rectangular parallelepiped shape similar to that of the first rotating member 21, and can rotate in the direction B in the drawing around a second rotating shaft 34 parallel to the first rotating shaft 24. Four B-side inspection suction tables 32a to 32d are provided on four side surfaces of the second rotation member 31 parallel to the second rotation shaft 34 via air cylinders 33a to 33d, respectively. In FIG. 1, the second rotation shaft 34 is arranged perpendicular to the paper surface, and the second rotation shaft 34 is connected to the second rotation shaft 34 via three air cylinders 33 a (only two air cylinders 33 a are shown in FIG. 1). A B-side inspection suction table 32a is provided directly above. A B-side inspection suction table 32b is provided in the left direction with respect to the second rotating shaft 34 through three air cylinders 33b (only two air cylinders 33b are shown in FIG. 1). The table 32b and the A-side inspection suction table 22d are arranged so as to face each other. A B-side inspection suction table 32c is provided in a downward direction with respect to the second rotation shaft 34 via three air cylinders 33c (only two air cylinders 33c are shown in FIG. 1). Tables 32a and 32c are arranged parallel to each other. A B-side inspection suction table 32c is provided on the right side with respect to the second rotating shaft 34 via three air cylinders 33d (only two air cylinders 33d are shown in FIG. 1). Inspection suction tables 32b and 32d are arranged in parallel to each other.

  As shown in FIGS. 1 and 2, the frame 6 is generally composed of an inspection head beam 61, three linear motion bearings 62 a to 62 c, a main body base 63, a contact member 64, and a ball screw 65. The main body base 63 is fixed to a plane located above the first inspection stage 2 and the second inspection stage 3 by a predetermined support column. The linear motion bearings 62a to 62c can be configured by various combinations such as a rail and a slide block, a shaft and a bearing or a sleeve, a guide rail and a guide, and as an example, a rail and a slide block are used. The three linear motion bearings 62a to 62c include rails 621a to 621c and slide blocks 622a, 622b1, 622b2, and 622c, respectively. In FIG. 2, a rail 621 and a slide block 622 provided below the inspection head beam 61 are indicated by broken lines). The rails 621a to 621c are fixedly arranged in parallel with a predetermined interval therebetween, and rails 621a and 621c are arranged on both sides of the rail 621b as a center. The first inspection stage 2 is disposed in the lower space between the rails 621a and 621b, and the second inspection stage 3 is disposed in the lower space between the rails 621b and 621c. Further, the main body base 63 is provided with a ball screw 65 that rotates in the upper space of the rail 621b by the drive of the linear motor 651 in parallel with the rail 621b. Here, the driving of the linear motor 651 is controlled by the control unit. In FIGS. 1 and 2, the main body base 63 that supports the rails 621a to 621c is shown separately, but this is for explaining the relationship with other components. The base 63 is fixedly connected to each other by forming openings at least in the upper spaces of the first inspection stage 2 and the second inspection stage 3. A plurality of abutting members 64 (for example, three locations with respect to the opening) are arranged on the same plane, and protrude to the opening to be fixed to the main body base 63.

  The inspection head beam 61 is installed between rails 621 a to 621 c fixed on the upper surface of the main body base 63. Under the inspection head beam 61, slide blocks 622a, 622b1, 622b2, and 622c are provided. The slide block 622a is movably engaged along the rail 621a, the slide blocks 622b1 and 622b2 are movably engaged along the rail 621b, and the slide block 622c is movably engaged along the rail 621c. is doing. The inspection head beam 61 is screwed with the ball screw 65 at the upper part of the slide blocks 622b1 and 622b2. Accordingly, when the linear motor 651 is driven, the ball screw 65 rotates, and the inspection head beam 61 moves on the main body base 63 in the direction in which the rails 621a to 621c are arranged in parallel (C direction in the drawing).

  In addition, the A-side inspection head 4 and the B-side inspection head 5 are arranged on the inspection head beam 61. The A-side inspection head 4 and the B-side inspection head 5 each include an imaging device (not shown) such as a CCD camera, and slits 41 and 51 (indicated by broken lines in FIG. 2) opened toward the lower portion of the imaging device. The lower space of the inspection head beam 61 is imaged via each of these. The A-side inspection head 4 is disposed on the inspection head beam 61 between the slide block 622a and the slide blocks 622b1 and 622b2. Specifically, as will be apparent later, when the A-surface inspection suction table 22 of the first inspection stage 2 is fixed at a position where it comes into contact with the contact member 64, the inspection head beam 61 moves in the direction C shown in the figure. Thus, the A-side inspection head 4 is arranged at a position where the imaging device of the A-side inspection head 4 can image the substrate S adsorbed on the A-side inspection suction table 22. Further, the B-side inspection head 5 is disposed on the inspection head beam 61 between the slide blocks 622b1 and 622b2 and the slide block 622c. Specifically, when the B surface inspection suction table 32 of the second inspection stage 3 is fixed at a position where it comes into contact with the contact member 64, the inspection head beam 61 moves in the direction C shown in the figure to thereby cause the B surface inspection head 5 to move. The B-side inspection head 5 is disposed at a position where the imaging device can image the substrate S sucked on the B-side inspection suction table 32.

  The substrate supply unit 7 is disposed in a lower space of the first inspection stage 2 in order to supply the substrate S loaded on the first substrate transport conveyor 10 to the first inspection stage 2. As will be described later, the substrate supply unit 7 includes a suction unit 70, a swing mechanism 71, a lifting support member 72, a lifting mechanism 73, a transport plate 74, and a transport plate moving mechanism 75. In FIG. 1, only the transport plate 74 and the transport plate moving mechanism 75 of the substrate supply unit 7 are illustrated, and other components are not illustrated.

  As shown in FIG. 2, substrates S before being inspected by the substrate inspection apparatus 1 are stacked for each type on the first substrate transport conveyor 10, and any one type of substrate S is arranged in a space immediately below the suction unit 70. Is done. Then, the suction unit 70 picks up the substrate St placed on the uppermost part from the substrate S loaded on the lower part based on the control of the control unit, and places the substrate St on the transport plate 74. Further, the transport plate 74 is configured to be movable in the G direction in the figure in accordance with the drive of the transport plate moving mechanism 75 under the control of the control unit. The transport plate 74 transports the substrate St placed on the upper surface thereof to a position directly below the A-side inspection suction table 22 in accordance with the drive of the transport plate moving mechanism 75. In addition, the board | substrate S before the test | inspection supplied to the board | substrate supply part 7 is each loaded on the 1st board | substrate conveyance conveyor 10 with the A surface which is one main surface facing down. Further, as will be apparent later, when the A-side inspection suction table 22 of the first inspection stage 2 is lowered downward, the substrate on which the suction surface of the A-side inspection suction table 22 is placed on the transport plate 74. Arranged in the vicinity of St.

  The substrate storage unit 8 includes three substrate cases 81a to 81c, three lift tables 82a to 82c, a turntable 83, a first carry-out conveyor 84, and a pair of second carry-out conveyors 85. The lift tables 82a to 82c are provided inside the substrate cases 81a to 81c, respectively, and the substrate S after the inspection by the substrate inspection apparatus 1 is loaded in the substrate cases 81a to 81c on the lift tables 82a to 82c. And the raising / lowering tables 82a-82c move up and down based on the control of the said control part, respectively, for example, are controlled so that the position of the up-down direction of the board | substrate S mounted in the uppermost part becomes fixed. For example, in the substrate cases 81a to 81c, the substrates Sng that have failed the inspection of the A and / or B surfaces by the substrate inspection apparatus 1 are sequentially stacked. These substrate cases 81 a to 81 c are arranged on the rotation plane of the turntable 83. The turntable 83 is controlled by the control unit to rotate and stop in the direction D in the drawing, and arranges any one of the substrate cases 81 a to 81 c in a space directly below the second inspection stage 3. The inspected substrates Sng stored in the substrate storage unit 8 are stacked in the substrate cases 81a to 81c, respectively, with the A surface facing upward. For example, when the B-side inspection suction table 32 of the second inspection stage 3 sucks and fixes the substrate Sng and descends downward to release the suction, the substrate case 81a disposed immediately below the B-side inspection suction table 32 The substrate Sng is stacked in ˜81c.

  The first carry-out conveyor 84 is configured to be movable in the H direction in the figure under the control of the control unit. The pair of second carry-out conveyors 85 are arranged on the upper part of the second substrate transfer conveyor 11 and are configured to be movable in the direction I in the figure under the control of the control unit. For example, the first carry-out conveyor 84 and the second carry-out conveyor 85 carry the substrate Sok that has passed the inspection of the A surface and the B surface by the substrate inspection apparatus 1 to the second substrate transfer conveyor 11.

  When the B-side inspection suction table 32 of the second inspection stage 3 descends downward with the substrate Sok being sucked and fixed, the first carry-out conveyor 84 is positioned directly below the B-side inspection suction table 32 (that is, the B-side inspection suction table 32). The suction table 32 and any of the substrate cases 81a to 81c) are moved in the H direction in the figure. When the B-side inspection suction table 32 releases the suction of the substrate Sok, the substrate Sok is placed on the first carry-out conveyor 84. Then, the 1st carrying-out conveyor 84 moves in the state which mounted the board | substrate Sok to the 2nd board | substrate conveyance conveyor 11 vicinity position used as the 2nd carrying-out conveyor 85 and a line-up state. When the first carry-out conveyor 84 and the second carry-out conveyor 85 are arranged in a line, the belts of the first carry-out conveyor 84 and the second carry-out conveyor 85 are moved in the direction in which the substrate Sok moves onto the second carry-out conveyor 85. Starts rotating. And if the board | substrate Sok moves to the 2nd carrying-out conveyor 85 completely, a pair of 2nd carrying-out conveyor 85 will move to the illustration I direction which leaves | separates from each other. As a result, the substrate Sok on the second carry-out conveyor 85 is dropped and stacked on the second substrate transfer conveyor 11 or another substrate Sok loaded on the second substrate transfer conveyor 11.

  Next, with reference to FIGS. 1-3, the expansion / contraction operation | movement of the air cylinders 23 and 33 with which the 1st test | inspection stage 2 and the 2nd test | inspection stage 3 are each provided is demonstrated.

  As described above, the first rotating member 21 is provided with the air cylinders 23a to 23d that support the A-side inspection suction tables 22a to 22d, respectively. The air cylinders 23a to 23d are configured to be extendable and contractable under the control of the control unit, and change the distance between the A-side inspection suction tables 22a to 22d and the first rotating shaft 24 that are supported by the extension and contraction operations, respectively. FIG. 1 shows a state in which the air cylinders 23 a to 23 d are contracted, and the A-side inspection suction tables 22 a to 22 d are respectively arranged in the vicinity of the side surfaces of the first rotating member 21. 3 shows a state in which the air cylinders 23a to 23d are extended, and the A-side inspection suction tables 22a to 22d are arranged at positions away from the first rotating member 21, respectively.

  As shown in FIG. 2 and FIG. 3, the A-side inspection suction table 22a arranged in the direction directly above the first rotation shaft 24 has an upper surface (first rotation shaft) when the air cylinder 23a extends. 24), the outer surface is positioned in contact with the contact member 64. Hereinafter, the position of the A-side inspection suction table 22 positioned in contact with the contact member 64 is referred to as an A-side inspection position. In this embodiment, as shown in FIG. 2, in order to stably position the A-surface inspection suction table 22a at the A-surface inspection position, air is provided at the locations (three locations) where the contact members 64 are fixed. The cylinder 23a is set so as to include locations (three locations) where the A-side inspection suction table 22a is supported.

  Further, as shown in FIG. 3, the A-side inspection suction table 22c arranged downward with respect to the first rotating shaft 24 has a suction surface of the A-side inspection suction table 22c when the air cylinder 23c extends. It is arranged near the upper part of the substrate St placed on the transport plate 74.

  Further, as shown in FIG. 3, the suction surface of the A-side inspection suction table 22d arranged in the right direction with respect to the first rotating shaft 24 is the same as the B in which the air cylinder 33b is extended when the air cylinder 23d is extended. It contacts the suction surface of the surface inspection suction table 32b. Hereinafter, a position where the suction surface of the A-side inspection suction table 22 and the suction surface of the B-side inspection suction table 32 abut will be referred to as a substrate delivery position.

  The second rotating member 31 is provided with air cylinders 33a to 33d that support the B-side inspection suction tables 32a to 32d, respectively. The air cylinders 33a to 33d are configured to be extendable / contractible under the control of the control unit, and change the distance between the B-side inspection suction tables 32a to 32d and the second rotating shaft 34 that are supported by the extension / contraction operation. FIG. 1 shows a state in which the air cylinders 33 a to 33 d are contracted, and the B-side inspection suction tables 32 a to 32 d are respectively arranged in the vicinity of the side surfaces of the second rotating member 31. 3 shows a state in which the air cylinders 33a to 33d are extended, and the B-side inspection suction tables 32a to 32d are arranged at positions away from the second rotating member 31, respectively.

  As shown in FIG. 2 and FIG. 3, the B-side inspection suction table 32a arranged in the direction directly above the second rotation shaft 34 has an upper surface (second rotation shaft) when the air cylinder 33a extends. 34, the outer surface) is in contact with the contact member 64 and positioned. Hereinafter, the position of the B surface inspection suction table 32 that is positioned in contact with the contact member 64 is referred to as a B surface inspection position. In this embodiment, as shown in FIG. 2, in order to stably position the B-side inspection suction table 32a at the B-side inspection position, air is provided at the places (three places) where the contact members 64 are fixed. The cylinder 33a is set so as to include places (three places) where the B-side inspection suction table 32a is supported.

  Further, as shown in FIG. 3, the B-side inspection suction table 32c disposed downward with respect to the second rotating shaft 34 has a suction surface of the B-side inspection suction table 32c when the air cylinder 33c extends. It is arranged near the upper part of the first carry-out conveyor 84 or above the opening of the substrate case 81. Hereinafter, the position of the B surface inspection suction table 32 is referred to as a substrate discharge position.

  Further, as shown in FIG. 3, the suction surface of the B-side inspection suction table 32b arranged in the left direction with respect to the second rotation shaft 34 is similar to the A in which the air cylinder 23d is extended when the air cylinder 33b is extended. It contacts the suction surface of the surface inspection suction table 22d.

  Next, the pneumatic mechanism of the substrate inspection apparatus 1 will be described with reference to FIG. 4 shows only the substrate supply unit 7 and the pneumatic mechanism on the first inspection stage 2 side, the second inspection stage 3 side is also configured in the same manner as the first inspection stage 2 side. The pneumatic mechanism on the supply unit 7 and the first inspection stage 2 side will be described representatively. Further, FIG. 4 shows that the A-side inspection suction table 22 is shown in a cross section, omitting a part of the configuration of the first inspection stage 2 in order to explain the pneumatic mechanism on the first inspection stage 2 side. Annotate. In FIG. 4, only the components related to the pneumatic mechanism among the components of the substrate supply unit 7 are shown in a block diagram.

  4, the pneumatic mechanism relating to the first inspection stage 2 of the substrate inspection apparatus 1 includes a blower 90, a compressor 95, a main pipe 91a, a main pipe 91b, an air pressure switching unit 92, an adsorption pipe 93, and a cylinder pipe 94. Yes. The first rotating shaft 24 supports an air pressure switching unit 92 inside the first rotating member 21. The air pressure switching unit 92 has a plurality of switching valves whose opening and closing are controlled by the control unit, and the first rotary shaft 24 has a hollow path (from FIG. (Shown by a broken line). A timing pulley 25 is fixed to the other end of the first rotating shaft 24. The main pipe 91a connects the blower 90 and the air pressure switching unit 92 through the hollow path of the first rotating shaft 24, and the air pressure generated by the blower 90 via the air pressure switching unit 92 is transferred to the A surface inspection suction table. It supplies to 22a-22d. Similarly, the main pipe 91b connects the compressor 95 and the air pressure switching unit 92 through the hollow path of the first rotating shaft 24, and the air pressure generated by the compressor 95 via the air pressure switching unit 92 is supplied to the air cylinder. It supplies to 23a-23d.

  A plurality of suction holes are formed in the suction surfaces AF of the A-side inspection suction tables 22a to 22d (only the A-side inspection suction tables 22a and 22c are shown in FIG. 4). Further, between the A-side inspection suction tables 22a to 22d and the switching valve of the air pressure switching unit 92, suction pipes 93a to 93d (in FIG. 4) that can be expanded and contracted according to the expansion and contraction operations of the air cylinders 23a to 23d, respectively. Only adsorption pipes 93a and 93c are shown). Here, the suction pipes 93a to 93d are connected to different switching valves, respectively. The pneumatic pressure (negative pressure) supplied from the suction pipes 93a to 93d to the A-side inspection suction tables 22a to 22d is opened to the outside from the suction holes formed in the A-side inspection suction tables 22a to 22d, respectively. . That is, when negative pressure is supplied to the A-side inspection suction tables 22a to 22d via the suction pipes 93a to 93d based on the control of the control unit, a negative pressure is generated in each suction hole and the suction surface AF. Vacuum adsorption using can be performed.

  Further, cylinder pipes 94a to 94d (only cylinder pipes 94a and 94c are shown in FIG. 4) are connected between the air cylinders 23a to 23d and the switching valve of the air pressure switching unit 92, respectively. Then, based on the control of the control unit, pneumatic pressure (positive pressure) is supplied from the compressor 95 to the cylinder pipes 94a to 94d, and the air cylinders 23a to 23d can be expanded and contracted. Since the pneumatic mechanism on the second inspection stage 3 side is the same as that on the first inspection stage 2 side, detailed description is omitted. A timing pulley 35 (see FIG. 5) is fixed to the other end of the second rotating shaft 34 of the second inspection stage 3. In the above-described embodiment, the air pressure switching unit 92 switches between the two systems of the air pressure, that is, the blower 90 and the compressor 95, but each may include an individual switching unit.

  The adsorption unit 70 of the substrate supply unit 7 includes a first adsorption unit 702, a second adsorption unit 703, a third adsorption unit 704, and a fourth adsorption unit 705. The pneumatic mechanism related to the substrate supply unit 7 includes a blower 90 and an adsorption pressure control unit 707. The adsorption pressure control unit 707 supplies air pressure (negative pressure) generated by the blower 90 to the adsorption unit 70 based on the control of the control unit. For example, the adsorption pressure control unit 707 includes a plurality of solenoid valves and the like that are operation-controlled based on the control of the control unit, and includes a first adsorption unit 702, a second adsorption unit 703, a third adsorption unit 704, and a first adsorption unit. The presence or absence of the negative pressure supplied to each of the four adsorption portions 705 and their pressure are controlled.

  Next, with reference to FIG. 5, a mechanism for rotationally driving the first rotating member 21 and the second rotating member 31 in the substrate inspection apparatus 1 will be described. FIG. 5 is a rear view showing a part of the substrate inspection apparatus 1, and the positional relationship and the rotation direction of the first inspection stage 2 and the second inspection stage 3 shown in FIGS. It is noted that.

  In FIG. 5, the mechanism that rotationally drives the first rotating member 21 and the second rotating member 31 includes a rotation driving motor 101, a timing belt 103, and tension pulleys 104 and 105. A pulley 102 is fixed to the rotation shaft of the rotation drive motor 101, and the rotation drive motor 101 drives the pulley 102 by a predetermined rotation angle based on the control of the control unit. The timing belt 103 is wound around a pulley 102 and timing pulleys 25 and 35 via tension pulleys 104 and 105 so as to be rotatable. The tension pulleys 104 and 105 control the tension of the timing belt 103 that has been stretched. The driving force of the rotary drive motor 101 rotates the timing pulleys 25 and 35 through the timing belt 103 in synchronism with each other at the same rotation angle. And the 1st rotating shaft 24 and the 2nd rotating shaft 34 to which the timing pulleys 25 and 35 were respectively fixed also rotated, and according to rotation of the 1st rotating shaft 24 and the 2nd rotating shaft 34, respectively, it is the 1st rotating member. 21 and the second rotating member 31 also rotate in the A direction and B direction in the figure. In the present embodiment, the first rotating member 21 and the second rotating member 31 are rotated every 90 ° in the A direction and B direction in the figure, respectively, according to the rotation instruction from the control unit.

  Next, the detailed structure of the substrate supply unit 7 will be described with reference to FIGS. 6 and 7. FIG. 6 is a side view showing a schematic structure of the substrate supply unit 7 by showing the suction unit 70 and the swing mechanism 71 in cross section. FIG. 7 is a bottom view of the suction unit 70.

  In FIG. 6, the substrate supply unit 7 includes a suction unit 70, a swing mechanism 71, a lifting support member 72, a lifting mechanism 73, a transport plate 74, and a transport plate moving mechanism 75.

  6 and 7, the adsorption unit 70 includes a pair of support members 701a and 701b, a first adsorption unit 702, a second adsorption unit 703, a third adsorption unit 704, a fourth adsorption unit 705, and a rear An end abutting member 706. The first to fourth suction portions 702 to 705 are each formed of a rod-shaped hollow rectangular column, and are respectively constructed between a pair of support members 701a and 701b. The suction unit 70 is supported by the elevating support member 72, and the first to fourth suction units 702 to 705 are arranged in the same direction on the uninspected substrate S stacked on the first substrate transport conveyor 10. It is arranged to cross.

  The first suction unit 702 has a plurality of suction holes ha formed on a lower surface (a side surface of a hollow rectangular column parallel to the major axis direction; hereinafter referred to as an adsorption surface) facing the stacked substrate S. For example, the suction hole ha is a hole having a diameter of 0.5 mm between the center of a predetermined region (for example, width of about 10 mm × length of about 140 mm) set on the lower surface of the first suction portion 702 on the support member 701a side. It is formed in a matrix with a pitch of 1.5 mm. This is an example of an aspect in which the suction hole ha is formed, and a region in which the suction hole ha is formed and other aspects will be described later. And the negative pressure controlled by the adsorption pressure control part 707 (refer FIG. 4) is supplied to the hollow inside of the 1st adsorption | suction part 702, and the external gas below the 1st adsorption | suction part 702 is attracted | sucked from the suction hole ha. The The first suction portion 702 is supported at both ends near one end of the support members 701a and 701b (hereinafter referred to as the front end side of the suction unit 70), and is illustrated with its long axis (O-axis shown) as the center. It can rotate in the I direction. More specifically, the first suction portion 702 can rotate around the O axis independently of the swinging of the suction unit 70 described later, and only the first suction portion 702 among the four suction portions. Supported by As a result, the first suction unit 702 can flexibly perform the substrate suction, and the substrate once sucked is difficult to peel off.

  The second suction unit 703 has a plurality of suction holes hb on the lower surface (suction surface) facing the stacked substrate S. For example, the suction hole hb has a center of 1.0 mm in diameter with respect to a predetermined area (for example, width of about 10 mm × length of about 50 mm) set on the support member 701a side on the lower surface of the second suction portion 703. A hole having a diameter of 1.0 mm is formed between the center of another predetermined region (for example, width of about 10 mm × length of about 80 mm) that is formed in a matrix with a pitch of 2.0 mm and is adjacent to the predetermined region on the support member 701b side It is formed in a matrix with a pitch of 8.0 mm. As long as a plurality of the suction holes hb are formed at positions facing the substrate S, they may be formed in other modes. Then, the negative pressure controlled by the adsorption pressure control unit 707 is supplied into the hollow inside of the second adsorption unit 703, and the external gas below the second adsorption unit 703 is sucked from the suction hole hb. The second suction portion 703 is fixed at both ends thereof to the other end side of the support members 701a and 701b (hereinafter referred to as the rear end side of the suction unit 70) with respect to the first suction portion 702.

  The third suction unit 704 has a plurality of suction holes hb similar to those of the second suction unit 703 formed on the lower surface (suction surface) facing the stacked substrate S. And the negative pressure controlled by the adsorption pressure control part 707 is supplied to the hollow inside of the 3rd adsorption | suction part 704, and the external gas below the 3rd adsorption part 704 is attracted | sucked from the suction hole hb. Further, the third suction portion 704 is fixed at both ends of the support members 701a and 701b on the rear end side of the suction unit 70 with respect to the second suction portion 703.

  The fourth suction unit 705 has a plurality of suction holes hc formed on the lower surface (suction surface) facing the stacked substrate S. For example, the suction hole hc is a hole having a diameter of 1.0 mm between the center of a predetermined region (for example, width of about 10 mm × length of about 80 mm) set on the lower surface of the fourth suction portion 705 on the support member 701a side. A hole having a diameter of 1.0 mm is formed between the center of another predetermined region (for example, width of about 10 mm × length of about 50 mm) that is formed in a matrix at a pitch of 8.0 mm and is adjacent to the predetermined region on the support member 701b side. It is formed in a matrix with a pitch of 2.0 mm. As long as a plurality of the suction holes hc are formed at positions facing the substrate S, they may be formed in other modes. And the negative pressure controlled by the adsorption pressure control part 707 is supplied to the hollow inside of the 4th adsorption part 705, and the external gas under the 4th adsorption part 705 is attracted | sucked from the suction hole hc. The fourth suction portion 705 has both ends fixed to the third suction portion 704 in the vicinity of the other end of the support members 701a and 701b on the rear end side of the suction unit 70.

  The rear end abutting member 706 is disposed on the most rear end side of the suction unit 70, and is fixed to the rear end side of the fourth suction portion 705, for example.

  The suction unit 70 is supported by an elevating support member 72 so as to be swingable about a rotation shaft provided on the front end side thereof. The rotation axis is parallel to the direction in which the first to fourth suction portions 702 to 705 are installed, and is, for example, the O axis shown in the figure. A swing mechanism 71 is provided on the rear end side of the suction unit 70 (for example, in the vicinity of the third suction unit 704 and the fourth suction unit 705). The swing mechanism 71 connects the rear end side of the suction unit 70 and the lifting support member 72. Further, inside the swing mechanism 71, a swing cam whose rotation angle is controlled by the control unit is provided. Then, as the swing cam rotates in accordance with the control of the control unit, the distance between the rear end side of the suction unit 70 and the lifting support member 72 is increased or decreased, and the suction unit 70 is illustrated with the rotation shaft as the center. Swings in the E direction. Note that the mechanism for swinging the suction unit 70 may be in another form. For example, a mechanism for realizing vertical driving such as an air cylinder may be provided. Further, a rotation mechanism such as a motor for directly rotating the suction unit 70 around the rotation shaft may be provided.

  The elevating mechanism 73 elevates and lowers the elevating support member 72 in the direction F in the figure in accordance with the control of the control unit. The substrate supply unit 7 detects a stacking height of the substrates S to be supplied (remaining amount of the substrates S), and outputs a height sensor (not shown) that outputs the height information to the control unit. It has. As a result, the suction unit 70 has the suction surfaces of the first to fourth suction portions 702 to 705 opposed to the one main surface of the substrate St placed on the uppermost position loaded on the first substrate transport conveyor 10. Position (substrate suction start position) and a position where the substrate St sucked by the suction surfaces of the first to fourth suction portions 702 to 705 is transferred to the transport plate 74 (substrate suction release position; position shown in FIG. 6). It is possible to move up and down.

  In addition, before the operation | movement by the flowchart mentioned later is started, the board | substrate S used as supply object is loaded on the 1st board | substrate conveyance conveyor 10, and is arrange | positioned in the predetermined position used as the lower space of the adsorption | suction unit 70. FIG. Here, the predetermined position means that when the suction unit 70 is lowered toward the substrate S on which the suction unit 70 is loaded, the suction surface of the first suction unit 702 is close to the vicinity of the front end of the upper surface in the major axis direction of the substrate S, and In the position where the suction surface of the second suction part 703 is close to the other upper surface region of the substrate S, the short axis direction of the substrate S and the installation direction of the first to fourth suction parts 702 to 705 are parallel. is there.

  With reference to FIG. 8, a description will be given of a range in which the first suction unit 702 approaches and sucks through the suction hole ha, taking the maximum size substrate Smax and the minimum size substrate Smin to be supplied as an example. FIG. 8 is a diagram illustrating an example of a suction range of the first suction unit 702 with respect to the upper surfaces of the substrates Smax and Smin disposed at the predetermined positions.

  In FIG. 8, when the suction unit 70 is lowered toward the substrate Smax stacked at the predetermined position, the suction surface of the first suction unit 702 comes close to the vicinity of the upper end of the substrate Smax in the major axis direction. Then, by sucking from the plurality of suction holes ha of the first suction portion 702, the region having the width W and the length L is sucked in the vicinity of the upper end portion of the substrate Smax. For example, in the example of the suction hole ha described above, W = about 10 mm and L = about 140 mm. On the other hand, as described above, since the plurality of suction holes ha are formed in the predetermined region offset toward the support member 701a side of the first suction portion 702, in the maximum size substrate Smax, either one of the left and right sides in the vicinity of the front end portion of the upper surface. A region that is shifted to the side becomes the suction range of the first suction unit 702, and the suction range is preferably set in a range from the one side to about 2/3 of the width in the minor axis direction of the substrate Smax. In consideration of sucking the substrate Smin having the minimum size by the same first suction unit 702, the suction range of the first suction unit 702 may exceed the width of the substrate Smin in the minor axis direction. Specifically, when the entire width in the minor axis direction of the substrate Smax is set as the suction range of the first suction unit 702, the suction pressure must be increased because suction leakage increases with respect to the substrate Smin. In order to reduce the adjustment of the suction pressure as much as possible, it is desirable to set a region shifted to either the left or right side in the vicinity of the front end portion of the upper surface as the suction range of the first suction unit 702 in the maximum size substrate Smax. Note that the suction surface of the first suction unit 702 is disposed in the vicinity of the front end portions of the upper surfaces of the substrates Smax and Smin so that the full width in the minor axis direction and the suction surface are in contact with each other.

  Returning to FIG. 6, the transport plate moving mechanism 75 horizontally moves the transport plate 74 in the G direction in the drawing in accordance with the control of the control unit. Thereby, when the suction unit 70 sucks and supports the substrate St and is disposed at the substrate suction release position, the transport plate 74 is disposed at a position below the substrate St (a position indicated by a broken line in FIG. 6). When the suction support of the substrate St by the suction unit 70 is released, the substrate St is placed on the upper surface of the transport plate 74. Then, the transport plate 74 moves to a position directly below the A-side inspection suction table 22 with the substrate St placed on the upper surface thereof.

  Next, the operation of the substrate supply unit 7 will be described with reference to FIGS. FIG. 9 is a flowchart showing an operation of supplying the substrate S from the substrate supply unit 7 to any of the A-surface inspection suction tables 22a to 22d. 10 to 15 are schematic views showing in stages the state in which the substrate supply unit 7 operates based on the operation of the flowchart shown in FIG.

  In FIG. 9, the control unit of the substrate inspection apparatus 1 drives the lifting mechanism 73 to place the substrate S loaded on the first substrate transport conveyor 10 and to be supplied at the uppermost position. The elevating support member 72 is lowered to a position (substrate adsorption start position) where the substrate St and the adsorption surface of the adsorption unit 70 are brought close to each other (step S50). For example, the control unit of the substrate inspection apparatus 1 calculates the stacking height of the substrate S currently being supplied (the remaining amount of the substrate S) using the height information output from the height sensor, A substrate suction start position for lowering the suction unit 70 is determined according to the loading height. Then, as shown in FIG. 10, the controller of the substrate inspection apparatus 1 drives the elevating mechanism 73 to lower the elevating support member 72 in the E1 direction so that the adsorption unit 70 is disposed at the substrate adsorption start position. Let As a result, the suction surface of the first suction unit 702 comes close to the vicinity of the end in the long axis direction of the substrate St stacked at the uppermost position. At this time, as will be apparent from the operation in the steps described later, the swing mechanism 71 operates so that the suction surface of the suction unit 70 is horizontal, and therefore, the suction surface and the main surface of the uppermost substrate St. Are close to each other in parallel.

  Next, the control unit of the substrate inspection apparatus 1 controls the drive of the blower 90 and the operation of the adsorption pressure control unit 707 to supply negative pressure to the first adsorption unit 702. As a result, the ends of the uppermost substrate St are sucked into a plurality of suction holes ha (see FIG. 7) formed in the suction surface of the first suction unit 702, and the suction surface of the first suction unit 702 and the substrate St The front end of the upper surface comes into contact (step S51; see FIG. 8). Accordingly, the suction surfaces of the second to fourth suction portions 703 to 705 and the rear end contact member 706 are brought into contact with the upper surface of the substrate St. At this time, the control unit of the substrate inspection apparatus 1 controls the adsorption pressure control unit 707 to supply a negative pressure of the first adsorption pressure to the first adsorption unit 702. The first adsorption pressure is a negative pressure that can lift the end of one substrate St, and is a negative pressure that is weaker than a second adsorption pressure described later. For example, the first adsorption pressure is 3 to 5 mmHg when the substrate St having a thickness of 1.6 mm, a size of 95 mm × 130 mm, and a weight of 45 g is adsorbed with a width of 90 mm and its end is lifted. In FIG. 10, a state where the first adsorption pressure is generated is indicated by a solid line arrow inside the first adsorption unit 702.

  Next, the control unit of the substrate inspection apparatus 1 rotates the swing cam of the swing mechanism 71 so that the suction unit 70 can swing downward (counterclockwise in FIG. 10) to a predetermined angle. (Step S52). At this time, since the suction surfaces of the first to fourth suction portions 702 to 705 and the rear end abutting member 706 are in contact with the upper surface of the substrate St stacked at the uppermost position, the suction unit 70 is connected to the substrate St. The horizontal state is maintained (the state of FIG. 10).

  Next, the control part of the board | substrate inspection apparatus 1 drives the raising / lowering mechanism 73, and raises the raising / lowering support member 72 (step S53). For example, as shown in FIG. 11, the control unit of the substrate inspection apparatus 1 drives the lifting mechanism 73 to lift the lifting support member 72 in the direction E2 in the drawing. As the elevating support member 72 is raised, the front end portion of the substrate St stacked at the uppermost position is lifted while being adsorbed by the first adsorption portion 702. On the other hand, the suction unit 70 swings downward (in the direction F1 in the drawing) until the predetermined angle is reached due to the weight of the suction unit 70 and the like, so that the rear end of the substrate St is placed on another stacked substrate S. It will be in contact with. That is, only the front end of the substrate St is pulled up from the other substrate S, and a gap is formed between the substrate St and the other substrate S (state of FIG. 11).

  Next, the control part of the board | substrate inspection apparatus 1 controls the operation | movement of the adsorption pressure control part 707, and supplies a negative pressure to the 2nd-4th adsorption parts 703-705 (step S54). As a result, the end of the uppermost substrate St is sucked into the plurality of suction holes hb or hc (see FIG. 7) formed on the suction surfaces of the second to fourth suction portions 703 to 705, and the substrate St is the first. To be securely fixed by the fourth suction portions 702 to 705 (state shown in FIG. 12). At this time, the control unit of the substrate inspection apparatus 1 controls the adsorption pressure control unit 707 to supply the negative pressure of the second adsorption pressure to the second to fourth adsorption units 703 to 705. The second adsorption pressure is a negative pressure that can reliably adsorb and fix the substrate St and lift the whole, and is a negative pressure stronger than the first adsorption pressure. For example, the second adsorption pressure is 10 mmHg or more when the substrate St having a thickness of 1.6 mm, a size of 95 mm × 130 mm, and a weight of 45 g is adsorbed with a width of 90 mm to lift the whole. In addition, in FIG. 12, the state in which the 2nd adsorption pressure has generate | occur | produced is shown with the white arrow inside the 2nd-4th adsorption | suction part 703-705.

  Here, as described in the background art, the substrate St is formed with a plurality of holes penetrating the front and back, such as the through holes TH and the slits SL. However, since a gap is formed between the uppermost substrate St and the second substrate S from the uppermost position, the substrate St and the second substrate S are not in close contact with each other. A large suction force acts only on the substrate St.

  Next, the control unit of the substrate inspection apparatus 1 controls the operation of the adsorption pressure control unit 707 to change the supply pressure to the first adsorption unit 702 from the first adsorption pressure to the second adsorption pressure (step S55). . Then, the control unit of the substrate inspection apparatus 1 rotates the swing cam of the swing mechanism 71 to swing the suction unit 70 to the horizontal state (step S56), and further drives the lifting mechanism 73 to move the suction unit 70. It arrange | positions in the said board | substrate suction cancellation | release position (step S57; state of FIG. 13). For example, as shown in FIG. 13, when the control unit rotates the swing cam, the suction unit 70 swings in the direction F2 in the drawing and becomes horizontal. Then, the controller further drives the lifting mechanism 73 to further lift the lifting support member 72 in the direction E3 in the drawing, and the suction unit 70 is disposed at the substrate suction release position. As a result, the substrate St sucked and fixed to the suction unit 70 is placed in the substrate suction release position in a horizontal state. In FIG. 13, the state of the first suction portion 702 that has been changed to the second suction pressure is indicated by an internal white arrow.

  Next, the control unit of the substrate inspection apparatus 1 controls the transport plate moving mechanism 75 to move the transport plate 74 to a position below the suction unit 70 (step S58). And the control part of the board | substrate inspection apparatus 1 controls the operation | movement of the adsorption pressure control part 707, and stops the negative pressure currently supplied to the 1st-4th adsorption parts 702-705 (step S59; FIG. 14) Status). As a result, the substrate St that has been suction-fixed to the suction unit 70 is placed on the transport plate 74. For example, as shown in FIG. 14, the control unit moves the transport plate 74 in the G1 direction in the figure, and places the transport plate 74 at a position below the suction unit 70 to which the substrate St is sucked and fixed. Then, by stopping the negative pressure supplied to the first to fourth suction units 702 to 705, the suction-fixed substrate St is placed on the upper surface of the transport plate 74. In addition, in FIG. 14, the inside of the 1st-4th adsorption | suction part 702-705 has shown the state by which the negative pressure is not supplied.

  Next, the control unit of the substrate inspection apparatus 1 controls the transport plate moving mechanism 75 to move the transport plate 74 to a substrate supply position that is directly below the A-surface inspection suction table 22 (step S60; FIG. 15). Status). For example, as shown in FIG. 15, the control unit moves the transport plate 74 in the direction G <b> 2 in the drawing to move the transport plate 74 to the substrate supply position.

  Next, the control unit of the substrate inspection apparatus 1 operates any one of the A-side inspection suction tables 22a to 22d by operating all the air cylinders 23a to 23d and 33a to 33d in the extending direction (see FIG. 3). The suction surface is disposed in the vicinity of the upper portion of the transport plate 74 on which the substrate St is placed. Then, the A surface inspection suction table 22 sucks the substrate St placed on the transport plate 74, and one main surface (specifically, the B surface) of the substrate St is the suction surface of the A surface inspection suction table 22. (Step S61).

  Next, the control part of the board | substrate inspection apparatus 1 is operated in the direction which shrinks all the air cylinders 23a-23d and 33a-33d (refer FIG. 1). By this operation, the A-side inspection suction tables 22a to 22d and the B-side inspection suction tables 32a to 32d are all arranged in the vicinity of the side surfaces of the first rotating member 21 and the second rotating member 31, and the A-side inspection suction table in step S61. The substrate S fixed to the suction surface 22 by vacuum suction is picked up from the substrate supply unit 7 (step S62).

  Next, the control unit of the substrate inspection apparatus 1 determines whether or not to continue supplying the substrate S (step S63). When the supply of the substrate S is continued, the control unit returns to step S50 and repeats the process. When the supply of the substrate S is finished, the control unit ends the process according to the flowchart.

  In this way, the substrate supply unit 7 sucks and lifts only the vicinity of the end of the uppermost substrate St among the stacked substrates S. Since the force for pulling up the substrate St uses gas suction by negative pressure, the suction force does not change with time, and the maintenance required when using a conventional adhesive member or the like becomes unnecessary. Further, by adsorbing only the vicinity of the end portion of the uppermost substrate St, only the uppermost substrate St can be easily peeled off, and the uppermost substrate St and the second substrate S are not in close contact with each other. After the gap is formed, only the uppermost substrate St is reliably sucked and fixed by the other sucking portions. Therefore, the substrate take-out device of the present invention is placed on the uppermost position while preventing two substrates from being stacked, even if the substrate has a plurality of holes penetrating the front and back. Only the substrate can be taken out.

  In the present invention, the essential element that allows only the uppermost substrate St to be peeled from the other substrate S is to adsorb only the longitudinal end of the substrate St to be picked up as described above. For example, when the central portion of the substrate St to be picked up is attracted, the adhesion between the substrate St and the other substrate S is strong, so it is easy to pick up two substrates, but by adsorbing only the end in the longitudinal direction, A gap is easily formed between the substrate St and another substrate S.

  Further, with respect to the suction range (see FIG. 8) of the first suction portion 702 of the substrate St to be picked up, the first area included in the suction range is based on the total hole area of the holes in the substrate St included in the suction range. The larger the total area of the suction holes ha of the suction part 702, the higher the effect of preventing the two-sheet removal. For example, as shown in FIG. 16, a case is considered in which the uppermost substrate St and another substrate S are stacked with being shifted. At this time, the suction force of the suction hole ha acts only on the substrate St at a location where the suction hole ha of the first suction portion 702 and the hole of the substrate St do not match (solid arrow in the figure). On the other hand, at the place where the suction hole ha of the first suction portion 702 and the hole of the substrate St coincide, the suction force of the suction hole ha acts on the second substrate S2 (broken arrow in the drawing). In other words, in order to increase the effect of preventing the two-sheet removal and reliably pick up only the uppermost substrate St, the suction hole ha and the substrate are reduced while reducing the suction force acting on the second substrate S2. It is necessary to increase the number of places where the St holes do not match. For example, the suction force acting on the substrate St is increased by increasing the number of suction holes ha formed in the suction range of the first suction unit 702 as much as possible, and the negative pressure supplied to the first suction unit 702 is reduced. If the suction force acting on the substrate S is reduced by controlling (for example, the above-described first adsorption pressure), the effect of reliably picking up only the uppermost substrate St is increased while preventing two substrates from being taken. That is, by increasing the number of suction holes ha formed in the suction range of the first suction portion 702 (increasing the total area of the suction holes ha), the suction force acting on the second substrate S2 is reduced. The ratio of the suction force acting on the substrate St increases. Further, by controlling the negative pressure supplied to the first suction unit 702 to be low, the absolute amount of the suction force acting on the second substrate S2 is reduced.

  For example, as shown in FIG. 17, a first suction portion 702 having a plurality of suction holes ha and a substrate St having a plurality of through holes are considered to overlap each other. Here, in the lower part of FIG. 17, the first suction part 702 in which a plurality of suction holes ha are formed is indicated by a solid line, the substrate St in which a plurality of through holes are formed is indicated by a broken line, and the suction holes ha and the through holes are illustrated. The area where and overlap is shown as a filled area. As apparent from FIG. 17, the ratio of the area where the suction hole ha and the through hole overlap with respect to the area of the suction hole ha is relatively low. It can be seen that the suction force acting on the substrate S2 is extremely low. Further, it is apparent that the ratio of the suction force acting on the second substrate S2 to the suction force acting on the substrate St is further reduced by increasing the number of suction holes ha.

  In the example of the first suction portion 702 described above, the suction holes ha having a diameter of 0.5 mm are formed in a matrix shape with a center-to-center pitch of 1.5 mm, but other modes may be used. For example, even in the case of a suction hole having a diameter of 1.5 mm that is normally used for suction of a blower, the suction holes are formed in a matrix shape as much as possible in a predetermined range set on the support member 701a side as long as the hole can be processed. Thus, the present invention can be realized. Further, as shown in FIG. 18A, the suction holes ha may be staggered. By forming the suction holes ha in a staggered arrangement, the suction holes ha can be more efficiently arranged, and therefore the number of holes and the total area of the holes in the predetermined region can be further increased. Needless to say, if the suction holes ha are staggered to have a diameter of about 0.5 to 0.8 mm, the suction holes ha can be arranged more efficiently. Furthermore, the adsorption surface of the first adsorption unit 702 may be made of a porous crystal alloy or the like.

  In consideration of sucking the substrate Smin of the minimum size by the same first suction part 702, the number of suction holes ha in the first suction part 702 is set to the suction surface that does not contact the substrate Smin. You can reduce it. For example, as shown in FIG. 18B, as described above, a large number of suction holes ha are formed on the suction surface of the first suction unit 702 that abuts even on the smallest-sized substrate Smin. On the other hand, a relatively small number of suction holes hb are formed on the suction surface of the first suction portion 702 where there can be a substrate S that does not come into contact according to its size. Furthermore, when there are many suction leaks with respect to the small-sized substrate S such as the substrate Smin, the suction pressure control unit 707 may control the suction pressure for each size of the substrate S.

  Further, in consideration of sucking the substrate Smin of the minimum size by the same first suction part 702, the suction holes ha in the first suction part 702 may be divided into a plurality of groups to control the suction pressure. For example, as shown in FIG. 18C, the suction surface of the first suction portion 702 in which the suction hole ha is formed is divided into three regions Ar1 to Ar3, and the negative pressure supplied to each region Ar1 to Ar3 is set. The adsorption pressure control unit 707 controls each independently. And if the suction pressure supplied to each area | region Ar1-Ar3 is controlled according to the size of the board | substrate S used as supply object, the appropriate suction pressure according to a board | substrate size can be supplied.

  In the above description, the substrate St placed on the transport plate 74 is transported to the rear end side of the suction unit 70 (that is, the rear end contact member 706 side). It may be transported to. For example, the substrate St placed on the transport plate 74 may be transported to the front end side (that is, the first suction unit 702 side) of the suction unit 70, or may be transported in the left-right direction of the suction unit 70. Absent.

  In the above description, as shown in FIG. 8 and the like, an example is used in which the end that is offset to the right with respect to the front end of the substrate St is set as the suction range of the first suction unit 702. A suction range may be set for the position. The suction range of the first suction unit 702 may be in the vicinity of the front end where the substrates St of each size exist in common. For example, the end of the front end of the substrate St or the front end of the substrate St is offset. It does not matter even if it is in the center.

  In the above description, three suction units (second to fourth suction units 703 to 705) are provided in addition to the first suction unit 702. However, the first suction unit 702 supports the suction and fixation of the substrate St. The mechanism may be in other modes. As described above, in the second to fourth suction units 703 to 705, the suction force for lifting the entire substrate St is insufficient only by the suction fixing by the first suction unit 702, or the posture to lift the substrate St by suction fixing is stable. It is provided to not. For example, as long as the substrate St can be sucked and fixed and can be stably pulled up, at least one other sucking portion that supports the first sucking portion 702 is sufficient, and four or more sucking portions may be used. Further, the other suction unit that supports the first suction unit 702 may be a suction unit having a large suction surface that sucks almost the entire surface of the substrate St to be supplied.

  In the above description, the suction unit 70 is moved up and down to form a gap between the uppermost substrate St and the second substrate S2, and the substrate St is picked up. However, the uppermost substrate St and the second substrate St2 are picked up. Other modes may be used as long as the positional relationship in the height direction with the eye substrate S2 is relatively enlarged / reduced. For example, the stacked substrate S itself may be moved up and down to enlarge / reduce the positional relationship in the height direction between the uppermost substrate St and the second substrate S2.

  In the above description, the substrate take-out device of the present invention is applied to a substrate inspection device having a plurality of inspection suction tables, but may be applied to other devices. For example, the present invention may be applied to a substrate inspection apparatus having a single inspection suction table, or may be applied to a drawing apparatus or other processing apparatus. Further, the substrate taken out by the substrate take-out device may not be a double-sided substrate that requires an appearance inspection on both sides.

  The substrate take-out apparatus and method according to the present invention take out only the substrate placed at the uppermost position while preventing two substrates from being stacked while minimizing the maintenance work of the apparatus. And can be applied to uses such as an apparatus for processing a substrate on which a plurality of holes penetrating the front and back are formed.

1 is a front view showing a schematic structure of a substrate inspection apparatus 1 according to an embodiment of the present invention. 1 is a top view showing a schematic structure of the substrate inspection apparatus 1 of FIG. 1 is a front view showing a schematic structure of the substrate inspection apparatus 1 in a state where the air cylinders 23 and 33 of FIG. 1 are extended. 1 is an internal side view showing a schematic structure of a pneumatic mechanism in the substrate inspection apparatus 1 of FIG. The rear view which shows the structure of the mechanism which rotationally drives the rotation member in the board | substrate inspection apparatus 1 of FIG. 1 is a side view showing a schematic structure of the substrate supply unit 7 of FIG. 6 is a bottom view of the suction unit 70 of FIG. The figure which shows an example of the suction range of the 1st adsorption | suction part 702 with respect to the upper surface of the board | substrates Smax and Smin arrange | positioned in a predetermined position. The flowchart which shows the operation | movement which supplies the board | substrate S from the board | substrate supply part 7 to either A surface test | inspection adsorption | suction table 22a-22d. The schematic diagram which showed the 1st step of the state which the board | substrate supply part 7 operate | moves based on the operation | movement of the flowchart shown in FIG. FIG. 9 is a schematic diagram showing a second stage in a state where the substrate supply unit 7 operates based on the operation of the flowchart shown in FIG. FIG. 9 is a schematic diagram showing a third stage of a state in which the substrate supply unit 7 operates based on the operation of the flowchart shown in FIG. FIG. 9 is a schematic diagram showing a fourth stage in a state where the substrate supply unit 7 operates based on the operation of the flowchart shown in FIG. 9. FIG. 9 is a schematic diagram showing a fifth stage in which the substrate supply unit 7 operates based on the operation of the flowchart shown in FIG. The schematic diagram which showed the 6th step of the state which the board | substrate supply part 7 operate | moves based on operation | movement of the flowchart shown in FIG. FIG. 6 is a diagram for explaining the suction force acting on each of the substrates St and S when the uppermost substrate St and another substrate S are stacked with being shifted. The figure which shows the state which accumulated the 1st adsorption | suction part 702 in which the several suction hole ha was formed, and the board | substrate St in which the several through-hole was formed. The figure which shows the 1st modification of the suction hole ha formed in the 1st adsorption | suction part 702. The figure which shows the 2nd modification of the suction hole ha formed in the 1st adsorption | suction part 702. The figure which shows the 3rd modification of the suction hole ha formed in the 1st adsorption | suction part 702. The figure which shows an example of the board | substrate S Sectional drawing which shows the schematic apparatus structure of the conventional blower adsorption system Sectional drawing which shows the schematic apparatus structure of the conventional blower adsorption system Sectional drawing which shows the system using the conventional adhesive member roughly Sectional drawing which shows the system using the conventional adhesive member roughly

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate inspection apparatus 2 ... 1st test | inspection stage 21 ... 1st rotation member 22 ... A surface test | inspection adsorption | suction table 23, 33 ... Air cylinder 24 ... 1st rotating shaft 25, 35 ... Timing pulley 3 ... 2nd test | inspection stage 31 ... Second rotating member 32 ... B surface inspection suction table 34 ... Second rotating shaft 4 ... A surface inspection head 41, 51 ... Slit 5 ... B surface inspection head 6 ... Frame 61 ... Inspection head beam 62 ... Linear motion bearing 621 ... Rail 622 ... Slide block 63 ... Main body base 64 ... Abutting member 65 ... Ball screw 651 ... Linear motor 7 ... Substrate supply unit 70 ... Adsorption unit 701 ... Support member 702 ... First adsorption unit 703 ... Second adsorption unit 704 ... Third Suction part 705 ... fourth suction part 706 ... rear end contact member 707 ... suction pressure control part 71 ... swing mechanism 72 ... elevating support member 73 ... elevating mechanism 74 ... transport plate 75 ... transport plate movement Structure 8 ... Substrate storage part 81 ... Substrate case 82 ... Elevating table 83 ... Turntable 84 ... First carry-out conveyor 85 ... Second carry-out conveyor 90 ... Blower 91 ... Main pipe 92 ... Air pressure switching part 93 ... Adsorption pipe 94 ... Cylinder Pipe 95 ... Compressor 101 ... Rotation drive motor 102 ... Pulley 103 ... Timing belt 104, 105 ... Tension pulley 10 ... First substrate transport conveyor 11 ... Second substrate transport conveyor

Claims (10)

A substrate take-out device that removes a substrate from a loaded substrate,
A suction unit including at least a first suction unit that sucks only the vicinity of the upper surface end portion of the uppermost substrate mounted on the suction surface;
An elevating mechanism for elevating the adsorption unit,
The elevating mechanism lowers the adsorption unit to a position where the adsorption surface of the first adsorption unit and the vicinity of the upper end of the uppermost substrate are close to each other,
The first adsorption unit adsorbs the adsorption surface in the vicinity of the upper end of the uppermost substrate,
The lifting mechanism raises the suction unit in a state where the suction surface of the first suction part is sucked near the upper surface end of the uppermost substrate.   The substrate take-out apparatus according to claim 1, wherein a plurality of suction holes for sucking an external gas are formed in a lattice arrangement or a staggered arrangement on the adsorption surface of the first adsorption unit. The substrate has a plurality of through holes,
The substrate extraction according to claim 2, wherein a total area of the suction holes formed in the suction surface of the first suction unit is wider than a total area of the through holes of the substrate formed in a portion where the suction surface is suctioned. apparatus. The substrate has a plurality of through holes,
The suction holes are all formed in a partial region included in the suction surface of the first suction part,
The total area of the suction holes formed in the suction surface of the first suction part is wider than the total area of the through holes of the substrate formed in a portion where the region where the suction holes are formed contacts. The board take-out device described in 1.   The substrate extraction apparatus according to claim 2, wherein the suction holes are formed with different hole number densities in a region obtained by dividing the suction surface of the first suction part into a plurality of parts. The adsorption unit further includes a second adsorption unit that adsorbs, on the adsorption surface, an area different from an area adsorbed by the first adsorption unit with respect to the upper surface of the uppermost substrate.
The second adsorbing unit adsorbs the adsorbing surface to the upper surface of the uppermost substrate when a gap is formed between the uppermost substrate and another substrate in accordance with the raising operation of the elevating mechanism. The substrate take-out device according to claim 1.   The substrate take-out apparatus according to claim 6, further comprising a swinging mechanism that swings the suction unit around a major axis direction of the suction surface of the first suction unit.   The suction unit further includes a rear end abutting member that comes into contact with a rear end of the substrate when the suction surface of the first suction portion is sucked near the upper surface front end of the uppermost substrate. The board take-out device described in 1. An adsorption pressure control unit that controls the suction pressure supplied to the first adsorption unit and the second adsorption unit;
The adsorption pressure control unit
When the first suction part sucks the vicinity of the upper end of the uppermost substrate, the first suction pressure is supplied to the first suction part,
When a gap is formed between the uppermost substrate and another substrate in accordance with the lifting operation of the lifting mechanism, a second suction pressure that is stronger than the first suction pressure is applied to the first suction unit. The substrate take-out apparatus according to claim 6, wherein the substrate take-out device is supplied to the second suction unit. A substrate removal method for removing a substrate from a loaded substrate,
A lowering step of lowering the first suction part that sucks only the vicinity of the upper surface end of the stacked uppermost substrate and bringing the suction surface of the first suction part close to the upper surface end of the uppermost substrate. When,
An adsorption step for adsorbing the adsorption surface of the first adsorption unit and the vicinity of the upper end of the uppermost substrate;
And a raising step of raising the first adsorption unit in a state where the adsorption surface of the first adsorption unit is adsorbed in the vicinity of the upper end of the uppermost substrate.

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