KR20040064588A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE: A semiconductor processing apparatus is provided to remarkably improve an operation speed of a semiconductor processing apparatus and reduce the volume of the semiconductor processing apparatus by decreasing a transfer distance of a wafer frame in the X-axis direction of a wafer frame transferring apparatus and a transfer distance of a semiconductor in the X-axis direction of the first transfer apparatus. CONSTITUTION: A work table(410) has a wafer frame mounting part(411). A Y-axis direction driving unit(420) transfers the work table in the Y-axis direction. A wafer frame clamping unit(430) selectively fixes the main body of a wafer frame placed on a wafer frame mounting part. A semiconductor separating pin(440) separates a semiconductor attached to tape of the wafer frame, disposed under the work table. A Z-axis direction driving unit(450) transfers the semiconductor separating pin in the Z-axis direction. An X-axis direction driving unit(460) transfers the Z-axis direction driving unit in the X-axis direction.

Description

Semiconductor manufacturing equipment

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a semiconductor processing apparatus, and more particularly, to a semiconductor processing apparatus which separates and transports a semiconductor that has been sawed after being attached to a tape of a wafer frame.

As is well known, a wafer cutting device may cut a wafer, but may also cut semiconductor strips such as BGA, CSP, MLF, etc. through slight structural changes. For example, the semiconductor strip is cut into individual semiconductors 21 by a wafer cutting device in a state where the semiconductor strip is attached to the tape 12 of the wafer frame 10, thereby achieving a state as shown in FIG.

Therefore, in order to load these semiconductors 21 in a package tray or to store them in a tube, a semiconductor separation device that separates the semiconductors 21 attached to the tape 12 of the wafer frame 10 from each other is required.

In the conventional semiconductor separator, when the wafer frame 10 is mounted and fixed on the work table, the work table is moved in the XY axis direction (horizontally and horizontally and horizontally), and the semiconductor separation pin disposed below the work table. The semiconductors 21 reciprocated in the Z-axis direction (vertical direction) and attached to the tape 12 of the wafer frame 10 are sequentially separated from the tape 12 and disposed on the work table. The first conveying device is adapted to convey in the loading direction.

However, in the conventional semiconductor processing apparatus, since the working table is moved in the XY axis direction, miniaturization of the semiconductor processing apparatus is restricted, and the transfer distance and the wafer frame 10 of the semiconductor first transfer apparatus are used as the working table. As the transfer distance of the wafer frame transfer apparatus to be supplied increases, a problem occurs that a decrease in working speed occurs.

In addition, in the related art, the adsorption mechanism 511 (see FIG. 7) of the semiconductor pick-up mechanism for transferring semiconductors separated by one is moved in the Z-axis direction or moved in the Z-axis direction after being horizontally transferred in the X-axis or Y-axis direction. After the system is moved in the X-axis or Y-axis direction, a delay time is generated during each operation switching, which causes a problem that the semiconductor transfer speed is greatly reduced.

Accordingly, the present invention has been invented to solve the above problems, and an object thereof is to provide a semiconductor processing apparatus capable of miniaturization of a semiconductor processing apparatus and a faster overall processing operation speed.

1 is a plan view showing a wafer frame to which a semiconductor product is attached;

2 is a plan view showing a semiconductor processing apparatus according to the present invention;

3 is an enlarged front view of the wafer frame transfer apparatus illustrated in FIG. 2;

4A is a plan view of the semiconductor separator shown in FIG. 2;

4B is a right partial cross-sectional view of the semiconductor separator shown in FIG. 2;

5a to 5d are views for explaining an operating state of the wafer frame clamping mechanism constituting the semiconductor separation device;

6 is an enlarged view of a portion of the adsorption member shown in FIG. 4B;

7 is an enlarged front view of the semiconductor first transfer device illustrated in FIG. 2;

8 is a plan view showing another embodiment of the present invention;

9 is an enlarged front view of the semiconductor first transfer apparatus, the wafer frame pickup mechanism, and the image photographing apparatus illustrated in FIG. 8;

FIG. 10 is a plan view illustrating a wafer frame mounting unit rotating device of the semiconductor separator; FIG.

11A is a cross-sectional view taken along the line O-A of FIG. 10;

11B is a cross-sectional view taken along the line O-B of FIG. 10;

11C is a cross-sectional view taken along the line O-C of FIG. 10;

12 and 13 are planar layouts showing different embodiments of the present invention, respectively.

-Explanation of terms for the main parts of the accompanying drawings-

10; Wafer frame, 11; main body,

12; Tape, 20; Sawn semifinished product,

21; Semiconductor, 30; Package Tray,

41; Tray feed elevators, 42,43; Tray loading hoist,

50; Airlines 61, 62, 63, 64; Guide Rail,

100; Wafer cassette magazine, 200; Wafer frame hoist,

300; Wafer frame feeder, 310; Wafer frame pickup mechanism,

311; Adsorption mechanism, 312; Z axis drive mechanism,

312a; Pneumatic cylinder, 312a '; Piston rod,

312b; Moving block, 320; X axis drive mechanism,

321; Drive motor, 322; Screw shaft,

323; Moving block, 323a; nut,

400; Semiconductor separator, 410; Worktable,

411; Wafer frame mounting portion 411a; Roller Engagement,

411b; Gear portion 411c; Wafer frame support,

411d; Buffer member, 411e; Fitting,

411f; Sensing units 412a, 412b, 412c; Support,

420; Y-axis drive mechanism, 421; Drive motor,

422; Screw shaft, 423; Moving Block,

423a; Nut, 423b; support fixture,

430; Wafer frame clamping mechanism, 431; Pneumatic cylinder,

431a; Pushing portion, 432; Pusher,

433; Revolution, 434; spring,

440; Semiconductor isolation pins 450; Z axis drive mechanism,

451; Drive motor, 452; cam,

453; Moving block, 453a; Hanging,

453b; Vent holes, 460; X axis drive mechanism,

461; Drive motor, 462; Screw shaft,

463; Moving block, 463a; nut,

470; Adsorption mechanism, 470a; Vent Hole,

471; Buffer member, 480; Wafer frame mounting rotator,

481; Drive motor, 482; Timing Belt,

500; A semiconductor first transfer device, 510; Semiconductor pickup mechanism,

511; Adsorption mechanism, 512; Z-axis first drive mechanism,

512a; Pneumatic cylinder, 512a '; Piston rod,

512b; Moving block, 513; Z axis second drive mechanism,

513a; Drive motor, 513b; Screw shaft,

513c; Moving block, 513c '; nut,

520; Y-axis drive mechanism, 521; Drive motor,

522; Screw shaft, 523; Moving Block,

523a; Nut, 530; X axis drive mechanism,

531; Drive motor, 532; Screw shaft,

533; Moving block, 533a; nut,

600,600 '; Semiconductor temporary mounting means, 610; Seating Block,

620; Y-axis drive mechanism, 621; Drive motor,

622; Screw shaft, 623; Moving Block,

700; A semiconductor second transfer device, 710; Semiconductor pickup mechanism,

720; Y-axis drive mechanism, 721; Drive motor,

722; Screw shaft, 723; Moving Block,

723a; Nut, 730; X axis drive mechanism,

731; Drive motor, 732; Screw shaft,

733; Moving block, 733a; nut,

740; Bad semiconductor collection unit, 810; Package tray pickup mechanism,

820; Wafer frame pickup mechanism, 821; Adsorption mechanism,

822; Z-axis drive mechanism, 822a; Pneumatic cylinder,

822a '; Piston rod, 822b; Moving Block,

910,920,930; Imaging device, 1100; X axis drive mechanism,

1110; Pneumatic cylinder, 1111; Piston rod,

1120; Moving block, 1200; Semiconductor supplies,

1210; Air block, 1220; X axis drive mechanism,

1221; Drive motor, 1222; Screw shaft,

1223; Moving block, 1300; Pushing Device,

1400; Tube feeder, 1500; Tube loading box

1600; Y axis drive mechanism, 1610; Drive motor,

1620; Screw shaft, 1630; Moving Block,

.

The present invention for achieving the above object is a wafer frame supply apparatus for picking up and supplying the wafer frame seated on the wafer cassette by individual, or by placing the wafer frame conveyed by the wafer into the wafer cassette; A wafer frame feeder for transferring the wafer frame supplied by the wafer frame feeder in the process progress direction along the X axis direction, or for transferring the separated wafer frame to the wafer frame feeder along the X axis direction; A semiconductor separation device that separates the semiconductors individually from the wafer frame transferred by the wafer frame transfer device; A semiconductor processing device comprising a semiconductor first transfer device disposed on an upper portion of a semiconductor separation device and configured to transfer semiconductors separated by the semiconductor separation device in a stacking direction along the X-axis direction, wherein the semiconductor separation device is a wafer. A worktable with a frame mount; A Y-axis drive mechanism for moving the work table in the Y-axis direction; A wafer frame clamping mechanism for selectively fixing the main body of the wafer frame mounted on the wafer frame mounting portion; A semiconductor separation pin disposed under the work table to separate the semiconductor attached to the tape of the wafer frame; A Z-axis driving mechanism for moving the semiconductor separation pin in the Z-axis direction; The X axis direction drive mechanism which moves a Z axis direction drive mechanism to an X axis direction is comprised, The structure characterized by the above-mentioned.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

According to FIG. 2, the semiconductor processing apparatus according to the present invention includes a wafer frame, in which a wafer frame 10 seated on a wafer cassette is picked up and supplied individually, or a wafer frame 10, which is transported individually, is placed in a wafer cassette and seated thereon. Supply apparatuses 100 and 200; Transfer the wafer frame 10 supplied by the wafer frame supply apparatuses 100 and 200 in the process progress direction along the X axis direction, or transfer the separated wafer frame 10 along the X axis direction to the wafer frame supply apparatuses 100 and 200. Wafer frame transfer device 300 for transferring to; A semiconductor separation device 400 that separates the semiconductors 21 from the wafer frame 10 transferred by the wafer frame transfer device 300 individually; The semiconductor first transfer device 500 is disposed on the semiconductor separator 400 and transfers the semiconductors 21 separated by the semiconductor separator 400 in a stacking direction along the X-axis direction. To achieve.

The wafer frame supply apparatuses 100 and 200 include a wafer cassette magazine 100 on which a wafer cassette is seated; The wafer frame 10 is pulled out from the wafer cassette seated on the wafer cassette magazine 100 and lifted upward, or the wafer frame 10 conveyed from the wafer frame pickup mechanism 310 is transferred downward. Representative of the wafer frame lifting device 200 is inserted into the wafer cassette seated on the wafer cassette magazine 100. The wafer cassette magazine 100 is a storage capable of storing a wafer cassette in a drawer type, which is omitted since it is a general technology widely used in the present field. In addition, the wafer frame elevating device 200 is also a common technique that is widely used in this field, so a description thereof will be omitted.

The wafer frame transfer device 300 includes a wafer frame pickup mechanism 310 for sucking the wafer frame 10 and an X axis direction driving mechanism 320 for moving the wafer frame pickup mechanism 310 in the X axis direction. Was used. The X-axis direction drive mechanism 320 includes a drive motor 321, a screw shaft 322 rotated by the drive motor 321, and a nut 323a engaged with the screw shaft 322. The moving block 323 is linearly moved along the axis 322. As shown in FIG. 3, the wafer frame pick-up mechanism 310 is fixed to a suction block 311 and a moving block 323 to suck the wafer frame 10 in the Z-axis direction. It consists of a Z-axis drive mechanism 312 to move to. The Z-axis driving mechanism 312 is fixed to the pneumatic cylinder 312a and the piston rod 312a 'of the pneumatic cylinder 312a and moved in the Z-axis direction by the pneumatic cylinder 312a. )

In the case of the present invention, as shown in Figs. 4A and 4B, a worktable 410 having a wafer frame mounting portion 411; A Y-axis direction drive mechanism 420 for moving the work table 410 in the Y-axis direction; A wafer frame clamping mechanism 430 for selectively fixing the main body 11 of the wafer frame 10 mounted on the wafer frame mounting portion 411; A semiconductor separation pin 440 disposed below the work table 410 to remove the semiconductor 21 attached to the tape 12 of the wafer frame 10; A Z-axis driving mechanism 450 for moving the semiconductor separation pin 440 in the Z-axis direction; It is to be noted that the semiconductor separation device 400 is formed of the X-axis driving mechanism 460 for moving the Z-axis driving mechanism 450 in the X-axis direction. This is because the semiconductor separation pin 440 and the Z-axis driving mechanism 450 are moved in the X-axis direction by the X-axis driving mechanism 460, so that the wafer frame mounting portion 411 moves in the X-axis direction, which is a process progressing direction. It is not necessary to move, and the movement in the X-axis direction of the semiconductor separation pin 440 by the X-axis driving mechanism 460 can also be smaller than the diameter of the wafer frame 10 so as not to leave the wafer frame mounting portion 411. Because it does not. Therefore, the wafer frame transfer distance in the X-axis direction of the wafer frame transfer apparatus 300 and the semiconductor transfer distance in the X-axis direction of the semiconductor first transfer apparatus 500 are reduced, so that the working speed of the semiconductor processing apparatus is increased. It is greatly improved and the width of the semiconductor processing apparatus can be reduced. The Y-axis direction driving mechanism 420 for moving the work table 410 in the Y-axis direction, and the X-axis direction driving mechanism 450 for moving the Z-axis driving mechanism 450 in the X-axis direction are driven motors. (421; 451), ball screws (422; 452) rotated by the drive motors (421; 451), and nuts (423a; 453a) engaged with the ball screws (422; 452), and the ball screws (422; Ball screw transfer mechanism consisting of a moving block (423; 453) linearly moved along 452) was applied. The wafer frame clamping mechanism 430 is rotatably fixed to the pneumatic cylinder 431, the pusher 432 moved in the Z-axis direction by the pneumatic cylinder 431, and the wafer frame mounting part 411, and the pusher 432. The rotating piece 433 is forcedly rotated by a) and a spring 434 for supporting the rotating piece 433 in one direction, but the present invention is not limited thereto, but the wafer frame mounting portion of the work table 410 Anything that can fix the wafer frame 10 mounted on 411 is applicable. For example, while the pushing portion 431a of the pneumatic cylinder 431 is directly against the rotating piece 433, the rotating piece 433 is forcibly rotated by the pushing portion 431a, or about the hinge axis H1. By changing the positions of the spring 433, the pusher 432, and the pneumatic cylinder 431, the rotating piece 433 is kept open normally, and is forcibly closed by the pneumatic cylinder 431 and the pusher 432, Of course, the frame 10 may be fixed. Since the operation state of the wafer frame clamping mechanism 430 is shown in detail in FIGS. 5A to 5D, a description thereof will be omitted. The Z-axis drive mechanism 450 may include a drive motor 451 installed on the moving block 463 of the X-axis drive mechanism 460, a cam 452 rotated by the drive motor 451, and A locking portion 453a mounted on the cam 452 is provided to be movable in the Z-axis direction on the moving block 463 of the X-axis driving mechanism 460 to move the semiconductor separation pin 440 in the Z-axis direction. It consists of a moving block 453 to move. On the other hand, as shown in Figure 4b and 6, the moving block 463 of the X-axis drive mechanism 460 is provided with an adsorption mechanism 470 having a buffer member 471, the moving block 453 It is embedded in the adsorption mechanism 470 so as to be movable in the Z-axis direction, and the semiconductor separation pin 440 is fixed to the upper end of the moving block 453 so as to protrude upwardly of the adsorption mechanism 470, A vent hole 453b communicating with the vent hole 470a of the mechanism 470 is formed along the central axis of the movable block 453, and the air line 50 is formed at an opening of the lower vent hole 470a of the movable block 453. This makes up a linked structure. Therefore, when the vacuum pressure is supplied through the air line 50, the outside air is forcibly sucked through the vent hole 470a of the adsorption mechanism 470, and the sucked air is vent hole 453b of the movable block 453; Since it is sucked into the air line 50 through h1 → h2 → h3 → h4, the semiconductor separation pin 440 is lifted while the bottom surface of the tape 12 of the wafer frame 10 is adsorbed by the adsorption mechanism 470. And the semiconductor 21 attached to the tape 12 is moved in the direction.

The semiconductor first transfer device 500 may be applied to any of the well-known ones for transferring the semiconductors 21 separated by the semiconductor separation device 400 in the loading direction along the X-axis direction. In this case, in order to seat the semiconductor 21 on the package tray 30 forming a matrix, the semiconductor pickup which absorbs the semiconductor 21 removed from the tape 12 of the wafer frame 10 and lifts it in the Z-axis direction. A mechanism 510; A Y-axis direction drive mechanism 520 for moving the semiconductor pickup mechanism 510 in the Y-axis direction; The X-axis direction drive mechanism 530 which moves the Y-axis direction drive mechanism 520 to an X-axis direction was used. In addition, in the case of this embodiment, in order to simultaneously adsorb and transport several semiconductors 21 removed from the tape 12 of the wafer frame 10 in a short time, the semiconductors 21 as shown in FIG. Moving blocks of a plurality of adsorption mechanisms 511 for individually adsorbing the respective components, the first driving mechanism 512 for linearly reciprocating the adsorption mechanism 511 individually in the Z-axis direction, and the Y-axis direction driving mechanism 520 ( A semiconductor pickup mechanism 510 is used, which is fixed to 523 and comprises a second drive mechanism 513 that linearly reciprocates the first drive mechanism 512 in the Z-axis direction.

Meanwhile, according to the embodiment shown in FIG. 2, the tray supply elevating device 41 and the tray loading elevating device 42 are disposed under the semiconductor first transfer device 500, so that the semiconductor separating device 400 The semiconductor 21 removed from the tape 12 by this is loaded in the package tray 30 of the tray loading raising and lowering device 42 by the semiconductor first transporting device 500, and X of the semiconductor first transporting device 500. The package tray pick-up mechanism 810 is provided in the axial drive mechanism 530, and the tray feed lift device is provided via the package tray pick-up mechanism 810 moved in the X-axis direction by the X-axis drive mechanism 530. The package tray 30 of 41 is supplied to the tray loading elevating device 42. Such a tray type semiconductor loading device equipped with the package tray pick-up mechanism 810, the tray supply lifting device 41, and the tray loading lifting device 42 is already well known in the art, and a description thereof will be omitted. Shall be.

According to the embodiment shown in FIG. 2, the semiconductor first transfer device 500 transfers the wafer frame 10 lifted by the wafer frame lifter 200 to the semiconductor separation device 400 along the X-axis direction. The wafer frame 10, which has been separated, has to be transferred from the semiconductor separator 400 to the wafer frame lifter 200 along the X-axis direction, so that the wafer frame supply speed to the semiconductor separator 400 is slowed. Is generated.

However, as shown in FIGS. 8 and 9, the wafer frame pick-up mechanism 820 is installed in the X-axis driving mechanism 530 of the semiconductor first transfer device 500, thereby providing the X-axis driving mechanism 530. By the wafer frame pick-up mechanism 820 moved in the X-axis direction by the wafer frame pickup mechanism 820, the wafer frame 10 is separated from the semiconductor separation device 400 to the wafer frame lifting device 200 along the X-axis direction In addition, the wafer frame transfer apparatus 300 may solve the problem by supplying the wafer frame 10 to be separated to the semiconductor separator 400. Here, since the wafer frame pickup mechanism 820 has the same structure as the wafer frame pickup mechanism 310 of the wafer frame transfer device 300 shown in FIG. 3, a detailed description thereof will be omitted.

Referring to the cross-linking operation in more detail, first, the wafer frame 10 to be separated is conveyed by the wafer frame lifter 200 individually and is adsorbed to the wafer frame pickup mechanism 310 of the wafer frame transfer device 300. In the state, when the semiconductor 21 finally separated by the adsorption mechanism 511 of the semiconductor pickup mechanism 510 is adsorbed, the wafer frame pickup mechanism is driven by the X-axis drive mechanism 320 of the wafer frame transfer apparatus 300. As the 310 is transported toward the semiconductor separator 400, the semiconductor pick-up mechanism 510 and the wafer frame pickup mechanism 820 are moved away from the semiconductor separator 400 by the X-axis driving mechanism 530 (FIG. Immediately moved from 8 to the X-axis direction), and the wafer frame 10 which has been separated is adsorbed from the semiconductor separator 400 to the wafer frame pickup mechanism 820 and then removed from the semiconductor separator 400. We The wafer frame 10 to be separated from the wiper frame pickup mechanism 310 is supplied to the semiconductor separator 400. Thereafter, after the semiconductors 21 of the semiconductor pickup mechanism 510 are transferred in the stacking direction, the wafer frame pickup mechanism 310 of the wafer frame transfer apparatus 300 and the wafer frame 10 having been separated are sucked. All of the wafer frame pickup mechanisms 820 are moved toward the wafer frame lifting device 200, so that the wafer frame pickup device 310 of the wafer frame transfer device 300 is excessively over the wafer frame lifting device 200, and the separation operation is completed. The wafer frame pick-up mechanism 820, which absorbs the wafer frame 10, is positioned in the upper portion of the wafer frame lifting device 200. Subsequently, the separated wafer frame 10 that has been separated is transferred from the wafer frame pickup device 820 to the wafer frame lifter 200, and the separated wafer frame 10 that has been transferred to the wafer frame lifter 200 is The semiconductor pick-up mechanism 510 is able to adsorb the semiconductor 21 separated by the semiconductor separator 400 while being conveyed to the wafer cassette of the wafer cassette magazine 100 by the wafer frame lifting device 200. The semiconductor pickup mechanism 510 and the wafer frame pickup mechanism 820 are moved toward the semiconductor separator 400. Subsequently, after the wafer frame pickup mechanism 310 is positioned on the upper portion of the wafer frame lifter 200, a new wafer frame 10 to be separated is loaded into the wafer cassette magazine 100 by the wafer frame lifter 200. ) Is transferred from the wafer cassette to the wafer frame pickup mechanism 310. Thereafter, the above operation is continuously repeated, so that the semiconductor 21 separation operation is continuously performed.

According to the embodiment shown in FIG. 2, the semiconductor first transfer device 500 directly transfers the semiconductor 21 from the semiconductor separation device 400 to the tray loading and lowering device 42, and the package tray 30 thereof. ), There is a disadvantage in that the transfer speed of the semiconductor from the semiconductor separator 400 becomes slow.

However, as shown in FIG. 8, the semiconductor temporary mounting means disposed under the semiconductor first transfer device 500 to temporarily seat the semiconductor 21 transferred by the semiconductor first transfer device 500 ( 600); This problem is solved by reinforcing and installing the semiconductor second transfer device 700 disposed above the semiconductor temporary seating means 600 and transferring the semiconductor 21 seated on the semiconductor temporary seating means 600 in the loading direction. . In the present embodiment, the semiconductor temporary mounting means 600 uses a mounting block 610 fixed to the base, and in consideration of the overall process speed, a plurality of the mounting blocks 610 are sequentially arranged in the X-axis direction as necessary. Of course, you can install.

FIG. 8 illustrates a semiconductor loading method using a package tray. According to this, the semiconductor second transfer device 700 absorbs the semiconductor 21 mounted on the temporary seating means 600 in the Z-axis direction. A semiconductor pick-up mechanism 710 for lifting; A Y-axis direction driving mechanism 720 for driving the semiconductor pickup mechanism 710 in the Y-axis direction; A structure consisting of an X-axis direction driving mechanism 730 for driving the Y-axis direction driving mechanism 720 in the X-axis direction is the same as that of the semiconductor first transfer device 500 shown in FIG. The detailed description will be replaced with FIG. In addition, a package tray pick-up mechanism 810 is installed in the X-axis driving mechanism 720 of the semiconductor second transfer device 700, and a tray supply lifting device (10) is disposed below the semiconductor second transfer device 700. 41) and the tray loading elevating device 42, the package tray pick-up mechanism 810 is supplied to the tray loading elevating device 42, the package tray 30 of the tray supply elevating device 41, the semiconductor The semiconductor of the semiconductor temporary seating means 600 is seated on the package trays 30 of the tray loading lifting devices 42 and 43 by the second transfer device 700.

In addition, according to the embodiment illustrated in FIG. 2, a method for determining whether the wafer frame 10 is mounted on the wafer frame mounting part 411 of the worktable 410 and fixed is not found. Whenever the shape of the sawed semifinished product 20 attached to the tape 12 of the frame 10 is changed, the operating states of the Y-axis drive mechanism 420 and the X-axis drive mechanism 460 are measured again each time. The hassle that needs to be set is generated, and if the fixed position of the wafer frame mounting portion 411 is changed or the attachment position of the sawed semifinished product 20 is changed, the semiconductor separation device 400 and the semiconductor first transfer device 500 are changed. ) Will cause malfunctions.

However, as shown in FIG. 8 and FIG. 9, an image photographing apparatus 910 for setting the position of the wafer frame 10 is installed in the semiconductor first transfer apparatus 500, and the Y-axis driving mechanism is provided as a medium. Controlling the operation of the 420 and the X-axis driving mechanism 460 solves this problem. Such an image photographing apparatus 910 may be installed in the wafer frame transfer apparatus 300 as necessary.

In particular, as illustrated in FIGS. 10 to 11C, the wafer frame mounting unit 411 disposed under the image photographing apparatus 910 is rotatably installed on the wafer frame working table 410, and the wafer frame mounting unit ( By reinforcing and installing the wafer frame mounting unit rotating device 480 for rotating the 411, even if the wafer frame 10 is incorrectly fixed at a predetermined angle around the rotation axis of the wafer frame mounting unit 411, it can be easily corrected. There is an advantage. In the present embodiment, the support rollers 412a, 412b, 412c are provided on the work table 410, and the wafer frame mounting portion 411 is rotatably engaged with the support rollers 412a, 412b, 412c. The wafer frame mounting part 411 is rotated by the driving motor 451 via the timing belt 482. The wafer frame top portion 411 is a gear that is connected to the timing belt 482 while forming an upper portion of the roller engaging portion 411a that is engaged with and supported by the support rollers 412a, 412b, and 412c, and the roller engaging portion 411a. 411b, a wafer frame support 411c for supporting the wafer frame 10 while forming an upper portion of the gear 411b, and a buffer member attached to the support surface of the wafer frame 10 of the wafer frame support 411c ( 411d). Each of these parts was to be integrally fastened to each other via fastening members such as bolts or screws, and the shock absorbing member 411d was bonded to the wafer frame support 411c. On the other hand, reference numeral "411e" is a fitting member that is fitted to the groove portion of the wafer frame support portion 411c to adjust the height while supporting both ends of the hinge shaft of the rotating piece 433, and reference numeral "411f" is a sensing unit, Unexplained symbol "S" is a sensor for detecting the rotation state of the wafer frame top portion 411.

In addition, as shown in FIG. 12, the mounting block 610 in which the semiconductor 21 transferred by the semiconductor first transfer device 500 is temporarily seated, and the Y moving the mounting block 610 in the Y-axis direction. While installing the temporary temporary mounting means (600,600 ') consisting of the axial drive mechanism (620), while the image capturing device 920 for photographing the upper surface of the semiconductor 21 is installed on the upper part of the semiconductor temporary mounting means (600) The normal semiconductor 21 can be classified and loaded into the normal tray stacking device 42, and the bad semiconductor stacking device 43 can be loaded. Since the semiconductor stacking device having such a defective tray loading device 43 is already well known, a detailed description thereof will be omitted.

In this case, the processing speed of the entire semiconductor processing apparatus may be lowered due to the time required for determining whether the semiconductor 21 is defective through the image photographing apparatus 920. However, as shown in FIG. This problem is solved by arranging the semiconductor temporary mounting means 600, 600 'sequentially along the X-axis direction and installing the X-axis direction driving mechanism 1100 for moving the image photographing apparatus 920 in the X-axis direction. In some cases, three or more semiconductor temporary mounting means may be sequentially disposed along the X-axis direction. In the present embodiment, the X axis direction drive mechanism 1100 is fixed to the air cylinder 1110 and the piston rod 1111 of the air cylinder 1110 to move the image photographing apparatus 920 in the X axis direction. The one consisting of a moving block 1120 was used.

In the case of the embodiment shown in Fig. 12, the semiconductor supply device 1200 for transferring the semiconductor 21 from the semiconductor second transfer device 700 toward the tube at an air injection pressure; A pushing device 1300 for mechanically injecting the semiconductor 21 transferred into the tube by the air injection pressure of the semiconductor supply device 1200 into the tube; A tube supply device 1400 for discharging the tube filled with the semiconductors 21 from the semiconductor input position and supplying a new tube to be introduced into the semiconductor input position; The tube stacking box 1500 for storing the tubes discharged from the tube supply device 1400 has a reinforced structure, so that the semiconductor 21 can be collected in the package tray 30 or the tube according to the needs of the user. Since the tube type semiconductor loading apparatuses 1200, 1300, 1400 and 1500 are already well known in the art and are being performed, a detailed description thereof will be omitted. In the present embodiment, the air block 1210 for pushing the semiconductor 21 transferred and seated from the semiconductor second transfer device 700 in the Y-axis direction at the air injection pressure, and the air block 1210 in the X-axis direction After the semiconductor feed device 1200 is applied to the semiconductor supply device 1200, which is composed of the reciprocating X-axis drive mechanism 1220, the semiconductor 21 from the semiconductor transfer device 700 is seated on the air block 1210. The semiconductor supply apparatus 1200 is moved to the semiconductor input position. The X-axis direction drive mechanism 1220 includes a drive motor 1221, a screw shaft 1222 rotated by the drive motor 1221, and a nut engaged with the screw shaft 1222. A moving block 1223 that is linearly moved along the X-axis direction is used. According to this embodiment, there is an advantage in that the semiconductor 21 can be selectively loaded and stored in a package tray or tube as needed.

On the other hand, since the semiconductor conveyance speed of the semiconductor transfer device 700 is inevitably required to be relatively high, in order to prevent the processing speed of the semiconductor processing device from being lowered by this, in the X axis direction of the semiconductor transfer device 700. Speed of feed should be increased.

However, the Y-axis direction drive mechanism 720 and the X-axis direction drive mechanism 730 of the semiconductor second transfer device 700 are rotated by the drive motors 721 and 731 and the drive motors 731 and 731. Consisting of a screw shaft 722; 732 and a moving block 723; 733 linearly moved along the screw shaft 722; 732 with a nut 723a; 733a engaged with the screw shaft 722; 732. In this case, when only one end of the moving block 733 of the X-axis driving mechanism 730 is supported on the guide rail 61 so as to be movable, the X-axis driving mechanism 730 is stopped. , Stress concentration is generated at the connecting portion of the guide rail 61 and the movable block 733 by the dynamic force, thereby causing a problem of its breakage.

Therefore, as shown in FIGS. 8 and 12, both ends of the moving block 733 of the X-axis driving mechanism 730 are connected to the pair of guide rails 61 and 64 arranged in parallel in the X-axis direction. It is preferable that each of the two movable devices 700 is movable so that the semiconductor second transfer device 700 which is quickly operated is safely supported.

FIG. 13 illustrates a semiconductor processing apparatus for loading a semiconductor into a tube, and accordingly, the semiconductor second transfer apparatus 700 absorbs the semiconductor 21 seated on the temporary seating means 600 and 600 '. A semiconductor pick-up mechanism 710 for lifting in the Z-axis direction; X-axis direction driving mechanism 730 for driving the semiconductor pickup mechanism 710 in the X-axis direction, which is the semiconductor pickup mechanism 510 and X of the semiconductor first transfer device 500 shown in FIG. Since it is the same as the axial drive mechanism 530, a more detailed description thereof will be replaced with FIG.

A semiconductor supply device 1200 for transferring the semiconductor 21 from the semiconductor second transfer device 700 toward the tube at an air injection pressure; A pushing device 1300 for mechanically injecting the semiconductor 21 transferred into the tube by the air injection pressure of the semiconductor supply device 1200 into the tube; A tube supply device 1400 for discharging the tube filled with the semiconductors 21 from the semiconductor input position and supplying a new tube to be introduced into the semiconductor input position; A tube stacker 1500 for storing the tubes discharged from the tube supply device 1400 is installed.

In the case of such a tube-only embodiment, as compared with FIG. 12, the position of the semiconductor supply device air block 1210 is disposed on the same line on the X-axis as the mounting blocks 610 of the semiconductor temporary mounting means 600 and 600 '. The Y-axis direction driving mechanism 720 for driving the semiconductor pickup mechanism 710 in the Y-axis direction and the X-axis direction driving mechanism 1220 for driving the air block 1210 to the semiconductor insertion position along the X-axis direction are provided. There is an advantage of becoming unnecessary.

Furthermore, the moving distance from the temporary mounting means 600, 600 'to the semiconductor supply device 1220 is greatly reduced, so that the transfer speed of the semiconductor 21 by the semiconductor second transfer device 700 is improved by about 30% compared to FIG. Therefore, the overall working speed of the semiconductor processing apparatus is greatly improved.

In the present embodiments, the Y-axis drive mechanisms 520 and 720 constituting the semiconductor first transfer device 500 and the semiconductor second transfer device 700 may include driving motors 521 and 721; A screw shaft 522; 722 rotated by the drive motors 521; 721 and a nut 523a; 723a engaged with the screw shaft 522; 722 are moved linearly along the screw shaft 522; 722. The moving blocks 523 and 723 are used. Here, the semiconductor pick-up mechanism 710 of the semiconductor second transfer device 700 is similar to the semiconductor pick-up mechanism 510 shown in FIG. 7. 7 corresponds to " 511 ", the first drive mechanism (corresponding to " 512 " in FIG. 7) to linearly reciprocate the suction mechanism 511 separately in the Z-axis direction, and the Y-axis drive mechanism 720 The second drive mechanism (corresponding to "513" in FIG. 7) used to fix the moving block 723 to linearly reciprocate the plurality of first drive mechanisms 512 in the Z-axis direction was used.

The Z-axis direction first drive mechanism 512 constituting the semiconductor pickup mechanism 510 of the semiconductor first transfer device 500 and the semiconductor pickup mechanism 710 of the semiconductor second transfer device 700 is a pneumatic cylinder. 512a and a moving block 512b fixed to the piston rod 512a 'of the pneumatic cylinder 512a, and the second Z-axis driving mechanism 513 includes a drive motor 513a, A screw shaft 513b rotated by the drive motor 513a and a moving block 513c linearly moved along the screw shaft 513b with a nut 513c 'engaged with the screw shaft 513b. Was used. In this way, when the pneumatic cylinder mechanism is used as the first drive mechanism 512 in the Z axis direction and the ball screw mechanism is used as the second drive mechanism 513 in the Z axis direction, movement to the top dead center of the adsorption mechanism 511 is performed. Since the movement to the bottom dead center is quick and smooth, the semiconductor 51 is adsorbed more smoothly by the adsorption mechanism 511, and there is an effect that the impact due to the pickup of the semiconductor 51 is not generated. The operation state thereof will be described in more detail. First, the driving motor 513a of the pneumatic cylinder 512a of the first driving mechanism 512 and the second driving mechanism 513 with the adsorption mechanism 511 positioned at the top dead center. ) Is driven simultaneously, the first driving mechanism 512 installed on the moving block 513c of the second driving mechanism 513 descends, and the adsorption mechanism (installed on the moving block 512b of the first driving mechanism 512). 511 is lowered. Even if the pneumatic cylinder 512a of the first drive mechanism 512 and the driving motor 513a of the second drive mechanism 513 are driven at the same time, the pneumatic cylinder 512a compared with the drive motor 513a. Since the reaction speed of Δ is high, it descends quickly by the pneumatic cylinder 512a and the driving motor 513a at the beginning of the descent, and when the adsorption mechanism 511 reaches the bottom dead center, the pneumatic cylinder 512a is stopped and adsorbed. The mechanism 511 is lowered only by the drive motor 513a, and the adsorption mechanism 511 is slowly decelerated to the bottom dead center. Become strong. When the adsorption mechanism 511 is lowered to the bottom dead center in this manner, the semiconductor 21 is adsorbed to the adsorption mechanism 511 by the vacuum pressure of the adsorption mechanism 511, and then the adsorption mechanism 511 is correspondingly corresponding to the lowering. It will rise to top dead center. Therefore, the adsorption mechanism 511 is quickly transferred in the vertical direction by the pneumatic cylinder 512a of the first Z-axis driving mechanism 512 and the pneumatic cylinder 513a of the second Z-axis driving mechanism 513. Since the deceleration is smoothly near the top dead center and the bottom dead center, the reciprocating movement speed of the adsorption mechanism 511 in the vertical direction is improved, and the transfer of the semiconductor 21 by the adsorption mechanism 511 is performed smoothly.

On the other hand, as mentioned above, conventionally, the semiconductor pick-up mechanism 510 such that the adsorption mechanism 511 is moved in the Z-axis direction after being moved in the Y-axis direction, or moved in the Y-axis direction after being moved in the Z-axis direction; 710 and the Y-axis drive mechanisms 520 and 720 are operated and controlled, and accordingly, since a delay time is generated at each operation switching, the processing speed of the semiconductor first and second transfer devices 500 and 700 becomes slow. Is generated.

Therefore, the semiconductor pick-up mechanisms 510 and 710 and the Y-axis driving mechanisms 520 and 720 are controlled to move in the Z-axis direction while the suction mechanism 511 is moved in the Y-axis direction, thereby providing the semiconductor first. It is desirable to improve the processing speed of the two transfer apparatuses 500 and 700. In this embodiment, the first and second drive mechanisms 512 and 513 of the semiconductor pickup mechanisms 510 and 710 and the drive motors 521 and 721 of the Y-axis drive mechanisms 520 and 720 are operated to control the suction mechanism. 511 is moved in the Y-axis direction while moving in the Z-axis direction.

The present invention is not limited to the above embodiments, and of course, various modifications can be made without departing from the scope of the following claims.

For example, as shown in FIG. 12, an image photographing apparatus 930 for bottom photographing of the semiconductor 21 is reinforced in a lower portion of the semiconductor first transfer apparatus 500 or the semiconductor second transfer apparatus 700. Thus, the defects of the semiconductor 21 can be determined by the two imaging apparatuses 920 and 930. In the exemplary embodiment as shown in FIG. 13, the image photographing apparatus 930 for photographing the bottom surface of the semiconductor 21 includes a mounting block 610 and a semiconductor supply apparatus 1200 of the semiconductor temporary mounting means 600, 600 ′. Disposed between the air blocks 1210 and driven in the Y-axis direction by the Y-axis driving mechanism 1600 so that the semiconductor 21 is attracted to the semiconductor pick-up mechanism 710 and fixed in the state. The imaging device 930 is positioned in the Y-axis direction to photograph the bottom surface of the semiconductor 21. The Y-axis direction drive mechanism 1600 includes a drive motor 1610, a screw shaft 1620 rotated by the drive motor 1610, and a nut engaged with the screw shaft 1620. It was used that consists of a moving block 1630 is linearly moved along the Y axis direction. In this case, a defective semiconductor collecting unit 740 is installed in the image photographing apparatus 930 or the Y-axis driving mechanism 1600 to collect the defective semiconductors so that the defective semiconductor is moved by the Y-axis driving mechanism 1600. The defective semiconductor collecting unit 740 is collected by the defective semiconductor collecting unit 740, or the defective semiconductor collecting unit 740 or the discharge hole is reinforced between the image photographing apparatus 930 and the air block 1210, so that the defective semiconductor is picked up by the semiconductor pickup mechanism 710. While moving toward the air block 1210 by the X-axis driving mechanism 730 in a state of being adsorbed to, it is preferable to freely fall to the defective semiconductor collection unit 740 or the discharge hole to be naturally collected. Here, of course, the transfer direction of the image photographing apparatus 930 by the semiconductor pickup mechanism 710 may be appropriately changed in the horizontal direction according to the arrangement direction of the semiconductor.

It goes without saying that the defective semiconductor collecting portion 740 and the discharge hole can be appropriately shifted as necessary without regard to the position as described above. Here, the discharge hole refers to a hole which penetrates the base and guides the defective semiconductor to the defective semiconductor collecting unit provided on the bottom of the base.

According to the present invention as described above, since the semiconductor separation pin 440 and the Z-axis driving mechanism 450 is moved in the X-axis direction by the X-axis driving mechanism 460, the wafer frame mounting portion 411 is There is no need to move in the X-axis direction, which is the process progressing direction, and the movement of the semiconductor separation pin 440 by the X-axis direction driving mechanism 460 in the X-axis direction is also smaller than the diameter of the wafer frame 10. Since the wafer frame mounting portion 411 is not deviated, the wafer frame transfer distance in the X-axis direction of the wafer frame transfer apparatus 300 and the semiconductor transfer distance in the X-axis direction of the semiconductor first transfer apparatus 500 become smaller. As a result, the working speed of the semiconductor processing apparatus is greatly improved, and the volume of the semiconductor processing apparatus is reduced.

Meanwhile, pneumatic pressure is applied to the Z-axis direction first driving mechanism 512 constituting the semiconductor pickup mechanism 510 of the semiconductor first transfer device 500 and the semiconductor pickup mechanism 710 of the semiconductor second transfer device 700. If a cylinder mechanism is used and the ball screw mechanism is used as the second Z-axis driving mechanism 513, the movement to the top dead center and the bottom dead center of the suction mechanism 511 can be made smoothly and smoothly. The 51 is adsorbed more smoothly by the adsorption mechanism 511, and there is an effect that the impact due to the pickup of the semiconductor 51 is not generated.

In addition, when the suction mechanism 511 is moved in the Y-axis direction while moving in the Z-axis direction, the semiconductor pickup control mechanisms 510 and 710 and the Y-axis direction drive mechanisms 520 and 720 control the operation of the semiconductor first. · The processing speed of the two transfer apparatuses 500 and 700 is greatly improved.

Claims (16)

A wafer frame supply device (100,200) for picking up and supplying the wafer frame 10 seated on the wafer cassette individually or inserting the wafer frame 10 transported individually into the wafer cassette; Transfer the wafer frame 10 supplied by the wafer frame supply apparatuses 100 and 200 in the process progress direction along the X axis direction, or transfer the separated wafer frame 10 along the X axis direction to the wafer frame supply apparatuses 100 and 200. Wafer frame transfer device 300 for transferring to; A semiconductor separation device 400 that separates the semiconductors 21 from the wafer frame 10 transferred by the wafer frame transfer device 300 individually; A semiconductor first transfer device 500 disposed above the semiconductor separation device 400 to transfer the semiconductors 21 separated by the semiconductor separation device 400 in a loading direction along the X-axis direction; In the semiconductor processing apparatus having an image photographing apparatus 910 for setting the position of the wafer frame 10, The semiconductor separator 400, A worktable 410 having a wafer frame mount 411; A Y-axis direction drive mechanism 420 for moving the work table 410 in the Y-axis direction; A wafer frame clamping mechanism 430 for selectively fixing the main body 11 of the wafer frame 10 mounted on the wafer frame mounting portion 411; A semiconductor separation pin 440 disposed below the work table 410 to remove the semiconductor 21 attached to the tape 12 of the wafer frame 10; A Z-axis driving mechanism 450 for moving the semiconductor separation pin 440 in the Z-axis direction; A semiconductor processing apparatus comprising an X-axis direction driving mechanism (460) for moving the Z-axis direction driving mechanism (450) in the X-axis direction. The wafer frame mounting unit of claim 1, wherein a wafer frame mounting unit 411 disposed below the image photographing apparatus 910 is rotatably installed on the wafer frame work table 410, and rotates the wafer frame mounting unit 411. The semiconductor processing apparatus, characterized in that the mounting portion rotating device 480 is provided. The wafer frame clamping mechanism 430 is rotatable to a pneumatic cylinder 431, a pusher 432 moved in the Z-axis direction by the pneumatic cylinder 431, and a wafer frame mounting portion 411. It is fixed so as to be rotated by a pusher (432) and the rotating piece (433), and a semiconductor processing device characterized in that consisting of a spring (434) to support the pivot piece in one direction. The method of claim 1, wherein the semiconductor first transfer device 500, A semiconductor pick-up mechanism 510 which sucks the semiconductor 21 removed from the tape 12 of the wafer frame 10 and lifts it in the Z-axis direction; A Y-axis direction drive mechanism 520 for moving the semiconductor pickup mechanism 510 in the Y-axis direction; A semiconductor processing apparatus comprising an X-axis driving mechanism (530) for moving the Y-axis driving mechanism (520) in the X-axis direction. The semiconductor frame of claim 1, wherein the wafer frame pickup mechanism 820 is installed in the semiconductor first transfer apparatus 500, and the wafer frame 10 of the semiconductor separation apparatus 400, which has been separated, is a semiconductor first transfer apparatus 500. And a wafer frame supplying device (100,200) by a wafer frame pick-up mechanism (820) moved in the X-axis direction. The semiconductor temporary mounting means 600 and 600 'of claim 1, further comprising a semiconductor temporary mounting means 600, 600' disposed under the semiconductor first transfer apparatus 500 to temporarily seat the semiconductor 21 transferred by the semiconductor first transfer apparatus 500. ; It is disposed on the semiconductor temporary seating means (600,600 '), the semiconductor second transfer device 700 for transferring the semiconductor 21 seated on the semiconductor temporary seating means (600,600') in the loading direction is characterized in that the reinforcement Semiconductor processing device. The method of claim 6, wherein the semiconductor temporary mounting means (600,600 '), the mounting block 610 and the seating block 610 is temporarily seated on the semiconductor 21 transported by the semiconductor first transfer device 500 It consists of a Y-axis drive mechanism 620 to move in the Y-axis direction, characterized in that the image recording device 920 for photographing the upper surface of the semiconductor 21 is installed on the upper portion of the semiconductor temporary mounting means (600,600 ') Semiconductor processing apparatus. 8. The X-axis direction driving mechanism according to claim 7, wherein the semiconductor temporary mounting means is provided in pairs (600, 600 ') and sequentially disposed along the X-axis direction, and moves the image photographing apparatus 920 in the X-axis direction. 1100 is provided. The semiconductor pickup device 710 of claim 6, wherein the semiconductor second transfer device 700 includes: a semiconductor pickup mechanism 710 for absorbing the semiconductor 21 seated on the temporary seating means 600 and lifting it in the Z-axis direction; A semiconductor processing apparatus comprising an X-axis driving mechanism (730) for driving the mechanism (710) in the X-axis direction and provided with a tube-type semiconductor loading device (1200, 1300, 1400, 1500). The Y-axis direction driving mechanism 720 of claim 9, wherein the semiconductor second transfer device 700 is provided with a Y-axis driving mechanism 720 for driving the semiconductor pickup mechanism 710 in the Y-axis direction. Is driven in the X-axis direction by an X-axis driving mechanism (730), and a tray type semiconductor loading apparatus (41, 42, 43, 810) is provided. The Y-axis driving mechanism 720 and the X-axis driving mechanism 730 of the semiconductor second transfer device 700 include a driving motor 721; 731 and a driving motor 731; A moving block 723 linearly moved along the screw shaft 722; 732 with a screw shaft 722; 732 rotated by a screw and a nut 723a; 733a engaged with the screw shaft 722; 732. 733), wherein both ends of the moving block 733 of the X-axis driving mechanism 730 are movable on and supported by a pair of guide rails 61 and 64 arranged in parallel in the X-axis direction, respectively. A semiconductor processing apparatus, characterized in that. The semiconductor pickup mechanism (510; 710) according to any one of claims 4, 9, and 10, includes a plurality of adsorption mechanisms (511) for adsorbing the semiconductors (21) individually, and an adsorption mechanism ( The first drive mechanism 512 for individually linearly reciprocating the 511 in the Z-axis direction and the moving blocks 523; 723 of the Y-axis drive mechanisms 520; 720 are fixed to the first drive mechanism 512. A second drive mechanism 513 which linearly reciprocates in the Z-axis direction; The Z-axis direction first drive mechanism 512 includes a pneumatic cylinder 512a and a moving block 512b fixed to the piston rod 512a 'of the pneumatic cylinder 512a; The second Z-axis drive mechanism 513 includes a drive motor 513a, a screw shaft 513b rotated by the drive motor 513a, and a nut 513c 'engaged with the screw shaft 513b. Consisting of a moving block 513c linearly moved along the screw shaft 513b; The adsorption mechanism 511 is selected whether or not the semiconductor 21 is adsorbed by the first driving mechanism 512, the speed to the upper and lower dead center is smoothly controlled by the second driving mechanism 513. A semiconductor processing apparatus. The Y-axis direction driving mechanism (520; 720) for driving the semiconductor pick-up mechanism (510; 710) in the Y-axis direction includes driving motors (521; 721) and driving motors (521; 721). A moving block 523; 723 linearly moved along the screw shaft 522; 722 having a screw shaft 522; 722 rotated by the screw shaft and a nut 523a; 723a engaged with the screw shaft 522; 722. Consisting of; The first and second drive mechanisms 512 and 513 of the semiconductor pickup mechanisms 510 and 710 are driven in the Y axis direction so that the adsorption mechanism 511 of the semiconductor pickup mechanisms 510 and 710 is moved in the Y axis direction when the semiconductor pickup mechanisms 510 and 710 are moved in the Z axis direction. Semiconductor processing apparatus, characterized in that the mechanism (520; 720) operation control. The image photographing apparatus 930 according to any one of claims 1 to 11, for photographing the bottom surface of the semiconductor 21 under the semiconductor first transfer apparatus 500 or the second semiconductor transfer apparatus 700. And a collecting part (740) for collecting the defective semiconductors. 15. The semiconductor processing apparatus according to claim 14, wherein the image photographing apparatus 930 is installed so as to be movable horizontally so that the semiconductor pick-up mechanism 710 can be inspected with the semiconductor 21 attached thereto. Device. 16. The semiconductor processing apparatus according to claim 15, wherein a collecting unit (740) is provided in the image photographing apparatus (930).