TWM324397U - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
TWM324397U
TWM324397U TW096209243U TW96209243U TWM324397U TW M324397 U TWM324397 U TW M324397U TW 096209243 U TW096209243 U TW 096209243U TW 96209243 U TW96209243 U TW 96209243U TW M324397 U TWM324397 U TW M324397U
Authority
TW
Taiwan
Prior art keywords
heat
fan
fins
heat dissipation
fixing seat
Prior art date
Application number
TW096209243U
Other languages
Chinese (zh)
Inventor
Jin-Jiun Liau
Meng-Hung Ke
Original Assignee
Tai Sol Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tai Sol Electronics Co Ltd filed Critical Tai Sol Electronics Co Ltd
Priority to TW096209243U priority Critical patent/TWM324397U/en
Priority to US11/892,692 priority patent/US20080302512A1/en
Publication of TWM324397U publication Critical patent/TWM324397U/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

M324397 八、新型說明: 【新型所屬之技術領域】 本創作係與散熱技術有關,特別是指一種散熱襄置。 【先前技術】 5 15 按’習知之散熱裝置,有多種形態。例如散熱 垂直設立多數散熱鰭片,藉由該等散熱鳍片來 散熱裝置,係於—基板上設置熱管,再於熱管二 等ί二,㈣鰭片’11由熱管將該基板的熱傳輪至該 荨政熱鰭片上,藉以進行散熱。 料=1^速散熱鰭μ與线的熱交換料,通常會在 熱鰭片的旁侧設置一風扇,對準該等散_ 可、隙吸人空氣,藉以使冷空氣進入鰭片之間,而 了達到更好的熱交換效率。 晉於:述自知的散熱鰭片與風扇,通常是以風肩貼 π '4邊緣的方式來設置。此種貼置的方式會使得 的氣流’在進人散熱鰭片時產生較大的流阻。 在項叙散熱則時會造成大量的助聲,噪音 的二==時的背壓亦較大。相對的風扇繼 【新型内容】 上^之主要目的在於提供—種散熱裝置,其可解決 ^,達到降低料、增加進風量的效果,進而具有 20 M324397 較佳的散熱效果。 緣是,為了達成前述目的,依據本創作所提供之一種 散熱裝置,包含有:一固定座,至少一熱管、複數散熱鰭 片以及〜風扇;其中,該熱管設於該固定座,並由該固定 5座向—侧延伸,且穿過該等散熱鰭片;該風扇,設於該等 散熱鰭片之一侧,該風扇依吹動空氣的方向係定義一進風 面以及〜出風面,該風扇係以該進風面或出風面面對該等 散熱轉片間的空間;該等散熱鰭片靠近該風扇的邊緣係局 部鎮空’而於該等散熱鰭片與該風扇之間定義出一緩衝空 10間。藉此,可藉由該缓衝空間來加大散熱鰭片與風扇之間 的二隙’藉此,風扇所吹動的氣流進入散熱鰭片時的备流 阻即因而降低,又可減少風扇所吹動的氣流的風切聲,進 而減少了噪音。 15 【實施方式】 為了詳細說明本創作之構造及特點所在,兹舉以下之 二較佳實施例並配合圖式說明如后,其中: 如第-圖至第三圖所示,本創作第一較佳實施例所提 ,之-種散熱裝置1G’主要由—固定座n、複數熱管13、 複數散熱鰭片15以及一風扇17所組成,直中· 該等齡13,設於_定座11,並由朗定座η向 -侧且向上延伸,且穿過該等散熱韓片15。 該風扇17 ’設於該等散熱鰭片15之一侧,該風扇17 依队動^氣的方向係定義—進風φ ι7ΐ以及—出風面 20 M324397 172,該風扇17係以該進風面171或出風面172面對該 散熱鰭片15間的空間。本實施例中係以該進風面η〗^ 該等散熱鰭片15。 胃 該等散熱鰭片15靠近該風扇17的邊緣係局部鎮空, 而於該等散熱鰭片15與該風扇17之狀義出—緩衝 16:又’該等散熱鰭;^ 15靠近該風扇17的 二曰, 且各該散熱鰭片15靠近該風扇17的邊緣 狀 側漸漸靠近該風扇17。 丁田r兴向兩 流先轉該風扇17,使氣 17 緩衝空間16才被該風扇 “ 7讀氣錢纟丨加速散熱的效果。 大钟=所能達成之功效在於:藉由該緩衝空間16來加 15 入ίί二之_隙,藉此,風扇π在吸 低,阻降低======: ==:聲 予圖式及詳述。而同樣=述狀怨成近相同,容不再 提供之-種散《置20,:;且:第二較佳實施例所 罟具有一固定座21、複數熱管 20 M324397 23、複數散熱Μ片25以及一風扇27,其中: 該固定座21係設有複數熱管23,該等熱管23之管身 設於該固定座21,且兩端分別向該固定座21之兩側向外向 上延伸,位於該固定座21兩侧的該等熱管23之管身並且 5分別套設有複數散熱鰭片25,而於該固定座21之一側的古亥 等散熱鰭片25定義出一第一組散熱鰭片251,並於該固定 座21的另一侧的該等散熱鰭片25定義出一第二組散熱縛 片252,該風扇27位於該第一組散熱籍片251以及該第二 組散熱鰭片252之間。且該等散熱鰭片25靠近該風扇27 1〇的邊緣係局部鏤空,而於該第一組散熱鰭片251以及該第 二組散熱鰭片252係與該風扇27之間定義出二緩衝空間 26 〇 且,該第一組散熱鰭片251以及該第二組散熱鰭片252 靠近該風扇27的邊緣係呈弧狀。又,各該散熱鰭片25靠 is近該風扇27的邊緣,係由中央向兩側漸漸靠近該風扇27。 本第二實施例之形態係以該二組散熱鰭片251,252把 ,風扇27的進風面及出風面夾持起來,使風扇27兩面的 氣流能完全的用來散熱,達到更佳的散熱效果。利用該二 緩衝空間26來制前述第—實施例之相同效果。本第二實 2〇施例之其他使用狀況及所能達成之功效概同於前揭實施 例,容不贅述。 M324397 【圖式簡單說明】 第一圖係本創作第一較佳實施例之組合立體圖。 第二圖係本創作第一較佳實施例之分解立體圖。 第三圖係本創作第一較佳實施例之俯視圖。 第四圖係本創作第二較佳實施例之組合立體圖。 第五圖係本創作第二較佳實施例之分解立體圖。 第六圖係本創作第二較佳實施例之俯視圖。 【主要元件符號說明】 ίο 10散熱裝置 15散熱鰭片 171進風面 25散熱鰭片 11固定座 13熱管 16緩衝空間 17風扇 172出風面 20散熱裝置 15 21固定座 23熱管 251第一組散熱鰭片 252第二組散熱鰭片 26緩衝空間 27風扇M324397 Eight, new description: [New technical field] This creation is related to heat dissipation technology, especially a heat dissipation device. [Prior Art] 5 15 According to the conventional heat sink, there are various forms. For example, the heat dissipation vertically sets up a plurality of heat dissipation fins, and the heat dissipation device is disposed on the substrate, and the heat pipe is disposed on the substrate, and then the heat pipe is secondarily used, and (4) the fin '11 is heat pipe of the substrate by the heat pipe. On the hot fins of the government, to dissipate heat. Material = 1 ^ speed heat sink fin μ and the line of heat exchange material, usually a fan is placed on the side of the heat fin, aligning with the gap, can absorb air, so that cold air enters between the fins And achieve better heat exchange efficiency. Jin: The self-contained fins and fans are usually set by the wind shoulders π '4 edge. This placement allows the airflow to create a large flow resistance when entering the heat sink fins. In the case of heat dissipation, a large amount of auxiliary sound is generated, and the back pressure of the noise of the second == is also large. Relative fan follow 【New content】 The main purpose of the above is to provide a kind of heat dissipating device, which can solve the problem of reducing the material and increasing the air intake, and thus has the better heat dissipation effect of 20 M324397. The heat dissipation device provided by the present invention includes: a fixing seat, at least one heat pipe, a plurality of heat dissipating fins, and a fan; wherein the heat pipe is disposed on the fixing seat, and Fixing 5 seats to extend to the side and passing through the heat dissipating fins; the fan is disposed on one side of the heat dissipating fins, and the fan defines an air inlet surface and an air outlet surface according to a direction of blowing air The fan faces the space between the heat-dissipating fins by the air inlet surface or the air-out surface; the heat-dissipating fins are partially evacuated near the edge of the fan, and the heat-dissipating fins and the fan are Define a buffer space of 10 between. Thereby, the two gaps between the heat dissipation fins and the fan can be increased by the buffer space, whereby the standby flow resistance when the airflow blown by the fan enters the heat dissipation fins is reduced, and the fan can be reduced. The wind cuts of the blown air stream, which in turn reduces noise. [Embodiment] In order to explain the structure and characteristics of the present invention in detail, the following two preferred embodiments are described with reference to the following drawings, wherein: as shown in the first to third figures, the first creation In the preferred embodiment, the heat dissipating device 1G' is mainly composed of a fixing base n, a plurality of heat pipes 13, a plurality of heat dissipating fins 15, and a fan 17, and the middle portion is 13 and is set in the _ seating. 11, and extending from the landslide η to the side and upward, and passing through the heat sinks 15 . The fan 17' is disposed on one side of the heat dissipating fins 15. The fan 17 is defined by the direction of the movement of the team - the inlet air φ ι7 ΐ and the wind surface 20 M324397 172, and the fan 17 is driven by the air. The surface 171 or the air outlet surface 172 faces the space between the heat dissipation fins 15. In this embodiment, the heat sink fins 15 are formed by the air inlet surface η. The heat dissipating fins 15 are partially vacant near the edge of the fan 17, and the heat dissipating fins 15 and the fan 17 are shaped like a buffer 16: 'the heat sink fins; ^ 15 close to the fan The two fins of the 17 and the heat dissipating fins 15 gradually approach the fan 17 near the edge side of the fan 17. Ding Tian R Xing first turned the fan 17 to the two streams, so that the gas 17 buffer space 16 was accelerated by the fan. The effect of the big clock = can be achieved by: the buffer space 16 Add 15 to ίί二之,, whereby the fan π is sucking low, the resistance is reduced ======: ==: the sound is given to the figure and the detailed description. The second preferred embodiment has a fixed seat 21, a plurality of heat pipes 20 M324397 23, a plurality of heat radiating fins 25, and a fan 27, wherein: the fixing seat The 21 series is provided with a plurality of heat pipes 23, and the pipes of the heat pipes 23 are disposed on the fixing base 21, and the two ends respectively extend outwardly and upwardly toward the two sides of the fixing seat 21, and the heat pipes located on both sides of the fixing seat 21 A plurality of heat dissipation fins 25 are respectively disposed on the body of the tube 23, and a heat dissipation fin 25 such as the Guhai on one side of the fixing base 21 defines a first group of heat dissipation fins 251, and the fixing seat 21 is The heat dissipation fins 25 on the other side of the other side define a second set of heat dissipation tabs 252, and the fan 27 is located in the first group of heat dissipation sheets 251 and the second The heat dissipation fins 252 and the heat dissipation fins 25 are partially hollowed near the edge of the fan 27 1 , and the first group of heat dissipation fins 251 and the second group of heat dissipation fins 252 are coupled to the fan 27 . The two buffer spaces 26 are defined, and the first group of heat dissipation fins 251 and the second group of heat dissipation fins 252 are arc-shaped near the edge of the fan 27. Further, each of the heat dissipation fins 25 is near The edge of the fan 27 gradually approaches the fan 27 from the center to the two sides. The second embodiment is configured to hold the air inlet surface and the air outlet surface of the fan 27 by the two sets of heat dissipation fins 251, 252. The airflow on both sides of the fan 27 can be completely used for heat dissipation to achieve better heat dissipation effect. The same effect of the foregoing first embodiment can be achieved by using the two buffer spaces 26. Other uses of the second embodiment The condition and the effect that can be achieved are the same as those in the previous disclosure. M324397 [Simple description of the drawings] The first figure is a combined perspective view of the first preferred embodiment of the present creation. An exploded perspective view of the preferred embodiment. The top view of the first preferred embodiment is a perspective view of the second preferred embodiment of the present invention. The fifth figure is an exploded perspective view of the second preferred embodiment of the present invention. Top view of the preferred embodiment. [Main component symbol description] ίο 10 heat sink 15 heat sink fin 171 air inlet surface 25 heat sink fin 11 mount 13 heat pipe 16 buffer space 17 fan 172 wind surface 20 heat sink 15 21 mount 23 Heat pipe 251 first group of heat dissipation fins 252 second group of heat dissipation fins 26 buffer space 27 fan

Claims (1)

M324397 九、申請專利範圍: 1·一種散熱裝置,包含有·· 其中 -固定座’至少-熱管、複數散熱鰭片以及一風扇; 該熱官設於該固定座,並由該固定座向一側延伸,且 5 15 穿過該等散熱鰭片; 产該風扇,設於該等散熱鰭片之一側,該風扇依吹動空 氣的方向係定義-進風面以及—出風面,該風扇係以該進 =面以及該出風面的其巾—面賴該等散熱鰭片間的空 間, 錢該風扇的邊緣係局賴空,而於該 荨政”、、‘,、、曰U風扇之間定義出-緩衝空間。 > 2声依射請專利範圍第1項所述之散熱裝置,其中: 该風扇係以其進風面面對料散熱續片。 稱2項賴之散録置,其中: 的邊義呈弧狀。 各該散㈣3項所述之散«置,其中: ΐ該ίΓ 相風扇的邊緣’係由中央向兩侧漸漸靠 該至少)項之散_置,其中: 且兩端分別向該固定座之設於該固定座, 兩側之該等熱管之管:=再向上延伸,位於該固定座 於該固定座之-側的該等散數散熱鰭片’而 片,並於該固定座之χ ,、、、‘"旧片疋義出—第一組散熱鰭 之另—側的該等散熱鰭片定義出-第二 20 M324397 組散熱鰭片,該風扇位於該第一組散熱鰭片以及該第二組 散熱鰭片之間。 6.依據申請專利範圍第5項所述之散熱裝置,其中:該 第一組散熱鰭片以及該第二組散熱鰭片靠近該風扇的邊緣 5 係呈弧狀。M324397 IX. Patent application scope: 1. A heat dissipating device comprising: · a fixing seat at least - a heat pipe, a plurality of heat dissipating fins and a fan; the heat officer is disposed on the fixing seat, and the fixing seat is oriented to a side extending, and 5 15 passing through the heat dissipating fins; the fan is disposed on one side of the heat dissipating fins, and the fan is defined by the direction of the blowing air - the air inlet surface and the air outlet surface, The fan is based on the entrance surface and the towel surface of the air outlet surface, which depends on the space between the heat dissipation fins, and the edge of the fan is emptied, and in the 荨政",, ',, 曰The U-fan defines a buffer space. > 2 Sounds According to the heat dissipation device mentioned in the first paragraph of the patent scope, wherein: the fan is facing the heat sinking surface with its air inlet surface. Scattered, where: the edge of the arc is arc-shaped. Each of the scattered (four) 3 items of the scattered «set, where: ΐ the Γ Γ phase fan edge 'from the center to the sides gradually rely on the at least) Positioning, wherein: the two ends are respectively disposed on the fixing seat of the fixing seat, and the two sides are The tube of the heat pipe:=extends upwards, and the pieces of the plurality of heat-dissipating fins on the side of the fixed seat are slabs, and the shackles of the fixed seat are χ, ,,,, The heat dissipation fins on the other side of the first group of heat dissipation fins define a second 20 M324397 group of heat dissipation fins, and the fan is located between the first group of heat dissipation fins and the second group of heat dissipation fins. 6. The heat sink according to claim 5, wherein the first set of heat dissipating fins and the second set of fins are arcuate near the edge 5 of the fan.
TW096209243U 2007-06-05 2007-06-05 Heat sink TWM324397U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW096209243U TWM324397U (en) 2007-06-05 2007-06-05 Heat sink
US11/892,692 US20080302512A1 (en) 2007-06-05 2007-08-27 Thermal dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096209243U TWM324397U (en) 2007-06-05 2007-06-05 Heat sink

Publications (1)

Publication Number Publication Date
TWM324397U true TWM324397U (en) 2007-12-21

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Publication number Priority date Publication date Assignee Title
EP3832245B1 (en) * 2019-12-05 2022-02-23 ABB Schweiz AG Heat exchanger and cooled electrical assembly

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6711016B2 (en) * 2002-05-07 2004-03-23 Asustek Computer Inc. Side exhaust heat dissipation module
US6874566B1 (en) * 2003-09-19 2005-04-05 Dell Products L.P. Heat sink with intermediate fan element
US6967845B2 (en) * 2003-11-05 2005-11-22 Cpumate Inc. Integrated heat dissipating device with curved fins
US20050099774A1 (en) * 2003-11-06 2005-05-12 Kyu Sop Song Semiconductor chip cooling module with fin-fan-fin configuration
TWM282235U (en) * 2005-06-24 2005-12-01 Golden Sun News Tech Co Ltd Improved structure of a heat dissipating device using heat pipes
US7174951B1 (en) * 2005-08-30 2007-02-13 Asia Vital Component Co., Ltd. Radiator module structure
US7455102B2 (en) * 2005-12-22 2008-11-25 Golden Sun News Techniques Co., Ltd. Method for manufacturing heat pipe cooling device
CN101201676B (en) * 2006-12-15 2010-05-19 富准精密工业(深圳)有限公司 heat sink

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