TWM266545U - Heat sink structure for LED lamp - Google Patents
Heat sink structure for LED lamp Download PDFInfo
- Publication number
- TWM266545U TWM266545U TW093218439U TW93218439U TWM266545U TW M266545 U TWM266545 U TW M266545U TW 093218439 U TW093218439 U TW 093218439U TW 93218439 U TW93218439 U TW 93218439U TW M266545 U TWM266545 U TW M266545U
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- TW
- Taiwan
- Prior art keywords
- heat
- led lamp
- light
- heat dissipation
- dissipation structure
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Description
M266545 四、創作說明(1) 【新型所屬之技術領域】 本創作係關一種LED燈具散熱結構 燈組所產生之熱源藉由熱管傳導至燈j 以達有效之熱源散逸。 【先前技術】 已知,目前發光二極體較傳統燈泊 價格便宜等諸多優點,所以發光二極體 手電筒上使用。 由於發光二極體單一個所產生之亮 泡’所以使用者通常將複數個發光二極 ’藉以增加其發光亮度,如此,便可改 〇 但是,由於發光二極體係以增加電 發,效率,所以便又面臨隨電流提高而 升高之問題,雖然發光二極體係可藉由 熱’但是由於電路板係以多半為金屬、 製成之單一板體,因此其僅具有兩端面 路板上亦同時具有許多會釋出熱量之電 件、,使該電路板之熱傳導係數亦較低, 陕速傳‘散失至外界,因此,並不符合 體散熱之所需,進而使該高功率之發光 作功率無法提高。 义 【新型内容】 本創作之主要目的,係在 尤指一種可使LED 上進行外部散熱, 體積輕巧、省電、 皆被運用在燈具或 度不及一個傳統燈 體焊接於電路板上 善照明不足之缺失 流及數量以提高其 伴隨局部熱量過度 電路板之兩端面散 PCB或陶瓷材質所 可供散熱,且其電 容、電阻等電子元 而讓熱量亦不容易 高功率之發光二極 二極體之亮度及操 M266545 四、創作說明(2) 存在’使本創作設計一種可以讓LED燈組所產生之熱源傳 導至燈具上’進行外部散熱,以達有效之熱源散逸。 為達上述之目的,本創作係一種led燈具散熱結構, 係用以配置於燈具中之LED燈組,該LED燈組至少包含有一 熱管,該熱管之冷卻端穿設於燈具之反射罩上,而受熱端 係設於發光體底部接觸。 【實施方式】 兹有關本創作之技術内容及詳細說明,現配合圖式說 明如下: "月參閱『第一、二圖』所示,係本創作之立體分解、 立體外觀示意圖。如圖所示:本創作一種LED燈具散熱結 構,係用以配置於燈具中之LED燈組丄,可使LED燈組丄所 產生之熱源藉由熱管1 1傳導至燈具上進行外部散埶,以 達有效之熱源散逸。 … 上述所提之LED燈組1係包含有一熱管I】,該熱管 、i i ™冷卻端111以及一受熱端1 1 2所構成,前 :端1 1 2係配置有一電路板1 2,於電路板1 2 山口Γ 1 t數燈座1 2 Ί ,該電路板1 2與熱管1丄之受熱 ^ ▲ 2係以焊錫之方式加以組接而成; …、 先體ί ^ 2 1係分別封裝有—發光體1 2 2,而該發 接腳1 ? 3係為發光二極體(LED),使各發光體1 2 2之 2 2所J决與電路板1 2之穿孔1 2 4連接,讓發光體1 以進行Aί熱源可以傳導至熱管1 1之受熱端1 1上, 以進仃散熱處理。M266545 4. Creation Description (1) [Technical Field to which the New Type belongs] This creation relates to the heat dissipation structure of an LED lamp. The heat source generated by the lamp group is transmitted to the lamp j through a heat pipe to achieve effective heat source dissipation. [Prior art] It is known that currently, light emitting diodes have many advantages such as cheaper prices than traditional light bulbs, so light emitting diodes are used on flashlights. Due to the light bulbs produced by a single light-emitting diode, the user usually uses a plurality of light-emitting diodes to increase its light-emitting brightness, so that it can be changed. However, because the light-emitting diode system is used to increase electricity and efficiency, so Then it faces the problem of rising with the increase of current. Although the light-emitting diode system can be heated, but because the circuit board is a single board made of mostly metal, it has only two ends. There are many electrical components that release heat, which makes the circuit board's thermal conductivity coefficient low, and Shaanxi Quick Transmission 'is dissipated to the outside world. Therefore, it does not meet the needs of body heat dissipation, so that the high-power light emission is used as power. Can't improve. [New content] The main purpose of this creation is, especially, a type that allows external heat dissipation on LEDs. It is lightweight, energy-saving, and is used in lamps or less than a traditional lamp body soldered to a circuit board. Good lighting is insufficient. The lack of current and quantity can improve the heat dissipation of the high-power light-emitting diodes, which can be dissipated by PCB or ceramic materials at both ends of the circuit board with local heat overheating, and its electronic components such as capacitance and resistance. Brightness and Operation M266545 IV. Creation Instructions (2) Existence 'Make this creative design a way to allow the heat source generated by the LED lamp group to be transmitted to the lamp' for external heat dissipation to achieve effective heat source dissipation. In order to achieve the above purpose, the present invention is a kind of LED lamp heat dissipation structure, which is used for the LED lamp set arranged in the lamp. The LED lamp set includes at least a heat pipe, and the cooling end of the heat pipe is passed through the reflector of the lamp. The heated end is arranged in contact with the bottom of the luminous body. [Implementation] The technical content and detailed description of this creation are described below in conjunction with the diagrams: " Monthly refer to the "first and second pictures", which is a three-dimensional decomposition and three-dimensional appearance of this creation. As shown in the figure, this article creates a heat dissipation structure for LED lamps, which is used to arrange the LED lamp group 灯具 in the lamp, so that the heat source generated by the LED lamp group 传导 can be conducted to the lamp through the heat pipe 11 for external dissipation. To achieve an effective heat source dissipation. … The above-mentioned LED lamp group 1 includes a heat pipe I], which is composed of the heat pipe, ii ™ cooling end 111 and a heated end 1 1 2. The front: end 1 1 2 series is equipped with a circuit board 12 for the circuit. Plate 1 2 Yamaguchi Γ 1 t Number of lamp holders 1 2 Ί, the circuit board 12 and the heat pipe 1 丄 are heated ^ ▲ 2 is assembled by soldering;…, the precursor ^ 2 1 are packaged separately Yes—light-emitting body 1 2 2 and the hair pins 1 to 3 are light-emitting diodes (LEDs), so that each light-emitting body 1 2 2-2 2 is connected to the perforation 1 2 4 of the circuit board 12 Let the light source 1 to conduct A A heat source can be transmitted to the heated end 11 of the heat pipe 11 for heat dissipation treatment.
第6頁 M266545Page 6 M266545
請參閱『第三圖』所示,係本創作之組裝狀態立體示 意圖。如圖所示:當本創作於組裝時,將熱管1 1之冷卻 端1 1 1穿設於燈具反射罩2之隔板2 1所開設之穿^ 2 2上’該熱管1 1穿設於該反射罩2上時,其冷卻$丄工 1係由燈座1 2 1之方向往一側偏移,而不與燈座1 2對 應,以使該發光體1 2 2所投射之光源不會受到阻擋。 請參閱『第三、四、五圖』所示,係本創作組^狀態 之立體、仰視及剖面示意圖。如圖所示:當本創作組裝ς 燈具之反射罩2之後,係於該電路板1 2連接一電源(圖 中未不),使發光體1 2 2發亮產生投射之光源以供照明 ’當發光體1 2 2在投射光源時,係同時產生熱源,该熱 源則會傳導至熱管i i之受熱端1 1 2上,由;^熱端 2傳導至冷卻端1 1 1 ,再由冷卻端1 1 1傳導至反射罩 ^之各鋁質隔板2 1上,由於該反射罩2係裸露於室内環 境中,因此LED燈組1所產生熱源係可利用由反射罩2進、 于外。卩政熱’以使该L E D燈組1達到有效之熱源散逸,以 確保發光體1 2 2使用壽命。 請參閱『第六圖』所示,係本創作之另一實施例示意 圖。如圖所示:本實施例將發光體1 2 2配置於金屬材^ 所製成之導熱板3上,並於導熱板3底部配置有一熱管Υ 1 ’避免導熱板3及熱管11造成發光體122兩^腳工 2 3發生短路問題,所以於兩接腳1 2 3套設有_絕緣體 4 ;在前述兩接腳1 2 3透過導線連接後,受電源驅動而 點亮’此時發光體1 2 2所產生之熱源經導熱板3吸收後Please refer to the "third picture" for a three-dimensional view of the assembled state of this creation. As shown in the figure: When this work is assembled, the cooling end 1 1 1 of the heat pipe 1 1 is placed on the partition 2 1 of the reflector 2 of the lamp ^ 2 2 'The heat pipe 1 1 is placed on When the reflector 2 is on, its cooling work 1 is shifted from the direction of the lamp holder 1 2 1 to one side, and does not correspond to the lamp holder 12, so that the light source projected by the luminous body 1 2 2 does not Will be blocked. Please refer to the "three, four, and five" diagrams, which are three-dimensional, bottom-up, and cross-sectional diagrams of the creative group ^ state. As shown in the figure: After the creative assembly of the reflector 2 of the lamp, the circuit board 12 is connected to a power source (not shown in the figure), so that the luminous body 1 2 2 is illuminated to produce a projected light source for illumination. When the luminous body 1 2 2 is projecting a light source, a heat source is generated at the same time, and the heat source is transmitted to the heated end 1 1 2 of the heat pipe ii, and is transmitted from the hot end 2 to the cooling end 1 1 1 and then from the cooling end. 1 1 1 is transmitted to each of the aluminum partitions 21 of the reflection cover ^. Since the reflection cover 2 is exposed in an indoor environment, the heat source generated by the LED lamp group 1 can be taken in by the reflection cover 2 and outside.卩 政 热 'so that the LED light group 1 reaches an effective heat source to dissipate, to ensure the life of the luminous body 1 2 2. Please refer to the "sixth figure", which is a schematic diagram of another embodiment of this creation. As shown in the figure, the luminous body 1 2 2 is arranged on the heat conducting plate 3 made of metal ^ in this embodiment, and a heat pipe Υ 1 'is arranged on the bottom of the heat conducting plate 3 to avoid the luminous body caused by the heat conducting plate 3 and the heat pipe 11. 122 Two ^ foot workers 2 3 have a short circuit problem, so two pins 1 2 3 are set with _insulator 4; after the two pins 1 2 3 are connected through a wire, they are driven by the power source to light up. After the heat source 1 2 2 is absorbed by the heat transfer plate 3
M266545M266545
四、創作說明(4) 亚傳導至熱管1 1上進行散熱,以確保 壽命。 知先體1 2 2使用 請參閱『第七圖』所示,係本創作之 每 圖。如圖所示··本實施例將發光體丄2 一實施例示意 所製成之座體5上,並於座體5内埋設有:f於塑膠材質 2 2底部接觸之金屬材質所製成之導熱元丰於發光體1 元件Θ另一面對應配置有一熱管丄丄避丄再於導熱 發光體1 2 2兩接腳1 2 3發生短路問題,:官1 1造成 1 2 3套設有一絕緣體4 ; ☆前述兩接腳工2斤= 連接後,受電源驅動而點亮,此時發光體丄 匕¥線 熱源經導熱元件6吸收後並傳導至埶管2斤產生之 以碟保發光體122使用壽命。 11上進行散熱’4. Creative Instructions (4) The sub-conduction is conducted to the heat pipe 11 for heat dissipation to ensure the life. Seer Body 1 2 2 Use Please refer to the "Seventh Picture" as shown in each picture of this creation. As shown in the figure, the present embodiment: the base 5 made of the luminous body 丄 2 as shown in an embodiment, and embedded in the base 5: f made of a plastic material 2 2 a metal material in contact with the bottom The heat conduction element is richer than the light emitting element 1. The other side of the component Θ is equipped with a heat pipe correspondingly. To avoid this, there is a short circuit problem with the heat conducting light emitting element 1 2 2 and the two pins 1 2 3. The official 1 1 causes 1 2 3 sets of an insulator 4; ☆ The aforementioned two-pin workers 2 kg = After being connected, it is lit by the power supply. At this time, the light source is absorbed by the heat-conducting element 6 and transmitted to the tube 2 kg. 122 useful life. 11 for heat dissipation ’
綜上所述,本創作LED燈具散熱結構可有效改盖 =J缺點’可使LED燈組所產生之熱源藉由熱管;導Z J,進而使本創作之產生能更進步、更實用有 以須,確已符合新型專利申請之要件,要;;:以 能以僅為本創作之較佳實施例而已,當* 範圍及創作說明奎2之耗Ί ’凡依本創作申請專利 應仍屬本創作^容所作之簡早的等效變化與修錦,皆 个怎專利涵蓋之範圍内。In summary, the heat dissipation structure of the LED light fixture of this creation can effectively change the cover = J disadvantages' can make the heat source generated by the LED lamp group through the heat pipe; guide ZJ, so that the production of this creation can be more progressive, more practical and necessary , Indeed meets the requirements for a new patent application, must ;;: the best embodiment of this creation can only be used, when the scope and creation instructions Kui 2 consumption Ί 'any application for a patent under this creation should still belong to this The simple and early equivalent changes and repairs made by Rongrong Rong are covered by patents.
M266545 說明】 本創作 本創作 本創作 本創作 本創作 本創作 本創作 符號說 圖式簡單說明 【圖式簡單 第一圖,係 第二圖,係 第三圖,係 第四圖,係 第五圖,係 第六圖,係 第七圖,係 【主要元件 LED燈組1 冷卻端1 1 電路板1 2 發光體1 2 穿孔1 2 4 隔板2 1 導熱板3 座體5 之立體分解示 之立體外觀示 組裝狀態之立 組裝狀態之仰 組裝狀態之剖 之另一實施例 之再一實施例 明 熱 受 燈 接 反 穿 絕 導 意圖。 意圖。 體示意 視示意 面+意 不意圖 示意圖 管1 1 熱端1 座1 2 腳1 2 射罩2 孔2 2 緣體4 熱元件 圖 圖 圖 2M266545 Explanation] The author, the author, the author, the author, the author, the author, the symbol, the diagram, and the simple illustration [Schematic first picture, the second picture, the third picture, the fourth picture, and the fifth picture , Is the sixth figure, is the seventh figure, [the main components of the LED lamp group 1 cooling end 1 1 circuit board 1 2 light body 1 2 perforation 1 2 4 partition 2 1 heat conduction plate 3 base 5 The three-dimensional appearance shows the assembled state, the assembled state of the vertical assembly state, and another embodiment of the sectional view of the assembled state. intention. Body Schematic View Schematic + Intentional Schematic Diagram Tube 1 1 Hot End 1 Block 1 2 Feet 1 2 Shooting Cover 2 Hole 2 2 Edge Body 4 Thermal Element Figure Figure Figure 2
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW093218439U TWM266545U (en) | 2004-11-17 | 2004-11-17 | Heat sink structure for LED lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW093218439U TWM266545U (en) | 2004-11-17 | 2004-11-17 | Heat sink structure for LED lamp |
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Publication Number | Publication Date |
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TWM266545U true TWM266545U (en) | 2005-06-01 |
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TW093218439U TWM266545U (en) | 2004-11-17 | 2004-11-17 | Heat sink structure for LED lamp |
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Country | Link |
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2004
- 2004-11-17 TW TW093218439U patent/TWM266545U/en not_active IP Right Cessation
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