M261972 四、創作說明（1) 一、 〔新型所屬之技術領域〕·· 本創作係有關於一種提昇散熱效采之散熱片結構，別 係指一種可提昇散熱之結構。 二、 〔先前技術〕·· 按一般個人或筆記型電腦的散熱器結構，是將風扇固 置在散熱片上，以偏心的夾具將散熱片夾設於電腦發熱體 上’由於夾具是偏心夾固在電腦發熱體上，當需散熱時， 夾具易呈偏移歪斜，使散熱片無法與電腦發熱體直接貼觸 ，以致使電腦發熱體的熱氣仍集中在接觸面，而風扇產生 的氣流均在周圍根本無法集中吹襲，而且散熱片有未能完 全貼觸而產生間隙，造成電腦發熱體散熱器的熱氣停留其 内’所以傳統散熱片的散熱效果相當有限。 三、〔新型内容〕： =案創作人有感上述傳統散熱片之散熱效 接：別針對此問題加以改良，並長期測試、 = 乂昇散熱效果的散熱片結構。 種了 # A該散熱片結構係利甩擠盤或鍛造，，激^ τ 成為内部迴路的紹質散熱片，該散孰片底其 :基座體：經加工後，製作形成為；：J = 體部， 路，於其密閉式迴路内灌注約為轉折办密閉式迴 9〇%的散熱用媒介，使其熱氣集中在基谷量之50〜 ’再轉經片狀散熱部由風扇將熱氣排出遠吸熱端上 由上述各特徵結構、功效作一說熱效果。 下列各項優、特點： 則本創作仍具有 M261972 四、創作說明（2) 1 ·本創作運用散熱片 道的密閉式迴路，在密閉 脹冷縮原理由液體、氣體 2 ·本創作散熱片結構 加工而成為内部迴路之鋁 氣（溫度較高處）集中於 狀散熱部由風扇將其熱氣 3 ·本創作散熱片係貼 片底端基座體部的吸熱端 部由風扇將其散熱排出， 亦能提昇散熱之效能者。 四、〔實施方式〕： 、 為使本創作之技術理 並配合圖式詳細說明如下 請參閱〔第一、二圖 片1結構，包括有：一基 ζ f用掩續或鍛造一體成 散熱片，應用於個人或 政熱裝置用。 上述所提之基座體部 部“吸熱，基 通道⑴之密 ，甘4费閉式迴路1 0 0 、灌注量約為轉折式通 底端基 式迴路 、液體 ，利用 質散熱 基座體 排出， 觸於發 將熱氣 其接觸 座體部内挖 内灌注散熱 的循環散熱 擠型或鍛造 片’發熱體 部的吸熱端 提昇散熱效 熱體接觸面 集中，再轉 面積平均 設有轉折式通 用媒介，依熱 效果。 一體成型，經 接觸面上的熱 上，再轉經片 果。 上，俾讓散熱 經由片狀散熱 傳導係數佳， 念更具體明確，茲舉較佳實施例 參 所示〕，如圖所示··本創作散熱 座體部1 0及一片狀散熱部1 型μ經加彳 筆記型電腦及其週邊設備，供其2 1 〇，係與電腦發熱體接觸，藉 座體部1 〇經加工後，製作形成 閉式迴路1 〇 〇，經抽真空後， 灌注任意散熱用液體或氣體媒介 道1 0 2内容量之5 0〜90 %之散M261972 IV. Creation Instructions (1) I. [Technical Field to which the New Type belongs] ... This creation relates to a heat sink structure that enhances heat dissipation efficiency, and does not refer to a structure that can enhance heat dissipation. 2. [Previous technology] ·· According to the structure of a general personal or notebook computer radiator, the fan is fixed on the heat sink, and the heat sink is clamped on the computer heating body with an eccentric clamp. On the computer heating element, when the heat needs to be dissipated, the fixture is liable to be skewed and skewed, so that the heat sink cannot directly contact the computer heating element, so that the heat of the computer heating element is still concentrated on the contact surface, and the air flow generated by the fan is in the The surroundings cannot be blown at all, and the heat sink has not fully touched to create a gap, causing the heat of the computer heat sink to stay inside. Therefore, the traditional heat sink has a very limited heat dissipation effect. 3. [New content]: = The creator of the case feels the heat dissipation effect of the above-mentioned traditional heat sink. Do not improve this problem, and test it for a long time. Planted # A The structure of the heat sink is to squeeze the disk or forge, so that ^ τ becomes the heat sink of the internal circuit. The base of the fan is: the base body: after processing, it is formed into: = The body and the road are filled with about 90% of the heat-dissipating medium in the closed circuit in the closed circuit, so that the hot air is concentrated in 50% of the base valley. The above-mentioned characteristic structure and effect are used to describe the thermal effect on the hot-absorbing end of the hot air. The following advantages and characteristics: Then this creation still has M261972 4. Creation instructions (2) 1 · This creation uses a closed circuit of the heat sink channel, which is based on the principle of closed expansion and contraction by liquid and gas 2 · This creation heat sink structure processing The aluminum gas that becomes the internal circuit (where the temperature is higher) is concentrated in the heat-dissipating part and is heated by the fan. 3 · This creative heat sink is the heat-absorbing end of the base body of the bottom of the patch. Those who can improve the efficiency of heat dissipation. Fourth, [Embodiment]: For the technical explanation of this creation and the detailed description of the drawings, please refer to [The first and second picture 1 structure, including: a base ζ f is formed by concealing or forging into a heat sink, For personal or political heating installations. The base part mentioned above is "heat-absorbing, and the base channel is dense. The closed loop circuit is 100, the perfusion volume is about the turning bottom-end base circuit, and the liquid is discharged by mass cooling. The heat-absorbing end of the heat-generating body part of the heat-receiving end of the heat-generating body part improves the heat-conducting contact surface concentration, and the turning area is provided with a turning-type universal medium. Thermal effect. Integral molding, heat up on the contact surface, and then turn to the fruit. On the top, let the heat dissipation through the sheet heat transfer coefficient is good, the idea is more specific, and the preferred embodiment is shown in the reference], such as As shown in the picture ... The body part 10 of the heat sink and the one-piece heat sink type 1 μ notebook computer and its peripheral devices are provided for the 2 10, which are in contact with the computer heating body, and borrow the body part. 10 After processing, a closed-loop circuit 100 is produced, and after being evacuated, any liquid or gas medium channel for heat dissipation is filled with 50 to 90% of the content of the medium.
麵 第6頁 M261972 四、創作說明（3) 熱用媒介1 0 1 〔如第三圖之箭頭所示 該片狀散熱部1 1 ，係設在基座體部 基座體部i 〇之吸熱端經由片狀散熱部ϋ =，將其 源排出。 1由風扇將其熱 一請〔參閱第三圖所示〕，如圖所示：卷 經加工後形成一轉折式通道i 〇 2，在其二ς 1部1 〇 U 口上填套有軟性體1 03，使轉折式通 〇 2内容量5。〜90%的散熱用媒介i 〇丄通道1 戶 :示〕（諸如液體或氣體）；俾當基座體部J 2箭碩 ，發熱體接觸面上，而在基座體部丄〇内部灌注約=電 =通道1 0 2内容量50〜90%的散熱用媒介i 〇 ^ 、，，、:=折 的熱脹冷縮原理由液體-氣體i體 發熱體的熱氣集中在基座體部1 〇的： ^ 再轉經片狀散熱部11由風扇將其敎氣排出，、έ 到最佳散熱效果。 丹…乱排出，達 圖之實施3 f Γ圖所▲〕’如圖所妹:洙實 形成Α Φ 丁老、、片底端的基座體部1 0 a經加工後，製作 a，使往復口犬诵填首套!有軟性體1 0 3 a的往復式通道1 0 2 内灌注約Λ Λ 23為一密閉式迴路1 〇 〇a，在其 介1 01 ^ ^式通道1 〇2a内容量5〇〜9〇%的散熱用媒 鹎於電腦圖之箭頭所示〕，讓基座體部10&貼 電細發熱體接觸面上，使其熱氣集中在基座體部i 〇 第7頁 M261972 四、創作說明（4) a的吸熱端上，再轉經盆μ t AA U & & 1 氣排出，達完全散熱 片狀政熱部由風扇將其熱 f參閲〔第五圖所示〕，如圖所示：本實施例與第一 圖之實施例大致相同，所x n老 、 所不同處僅在於本實施例基座體部 ^通曾/=後為“口處填套有軟性體1 〇3b的轉 h/装二丨“ b之開放式迴路1 〇 〇b ’此基座體部1 0 ^ h ^ ^ j- 2 口承接端1 〇4b、另側為入口承接端工〇 上 讓基座㈣1。㈣觸於電腦發熱體接觸 使其熱軋集中在基座體部1 0b的吸熱端上，經此 開放式迴路1 〇 q b夕卜垃it, * UD外接冷熱父換方式，再轉經其上方的 片狀j熱W由風扇將其熱氣排出，達完全散熱。 f參閱〔第六圖所示〕，如圖所示··本實施例與第五 圖 施例大致相同，所不同處僅在於本實施例基座體部 1 c内部經加工後為其一往復式迴路i 〇 〇 c，此往復式 迴路1 0 Oc可供外接冷熱交換方式，再轉經其上方的片 狀散熱部由風扇將其熱氣排出。 二參满〔第七圖所苹J ，彳如圖所話零:丨珠實施剩翁雜^^ 圖之實施例大致㈣，所不同處僅在於該散熱片丄可設計 為如圖所不散熱片1 d可經其放置發熱源處空間，予以成 $—具有與第一圖所示相同高度的基座體部1 〇d，以及 設在上方且具不同排列密度及高度的片狀散熱部1 Id。Page 6 of page M261972 IV. Creation instructions (3) Thermal medium 1 0 1 [As shown by the arrow in the third figure, the sheet-shaped heat dissipation portion 1 1 is an endothermic portion provided on the base body portion i 〇 The end is discharged through the sheet heat sink 散热 =. 1 It is heated by a fan [see the third figure], as shown in the figure: after rolling, a turning channel i 〇2 is formed, and a soft body is filled on the second 1 〇U mouth. 1 03, make the turning-type pass 0 content content 5. ~ 90% of the heat-dissipating medium i 〇1 channel: 1) (such as liquid or gas); 俾 When the base body J 2 arrow master, the heating body contacts the surface, and the base body is perfused Approx. = Electricity = channel 1 0 2 50 ~ 90% of the heat sinking medium i 〇 ^ ,,,,: == Folding principle of thermal expansion and contraction The heat from the liquid-gas body heating element is concentrated on the base body 10: ^ Turn the sheet-shaped heat-dissipating part 11 to exhaust the radon gas through the fan, and press it to the best heat-dissipating effect. Dan ... discharged, the implementation of the figure 3 f Γ 图 所 ▲] 'As shown in the figure: sisters form A Φ Ding Lao, the base body part 10 a at the bottom, after processing, make a, reciprocate The first set of mouth dogs fill in! The reciprocating channel 1 0 2 with soft body 1 0 2 is filled with about Λ Λ 23 as a closed circuit 1 〇a, in its introduction 1 01 ^ ^ channel 1 〇2a content The amount of 50 ～ 90% of the heat-dissipating medium is shown on the arrow in the computer diagram.] Let the base body 10 contact the contact surface of the electric heating element, so that the heat is concentrated on the base body i. 7 Page M261972 Fourth, the creation instructions (4) a on the heat-absorbing end, and then turn through the basin μ t AA U & & (Shown in the figure), as shown in the figure: This embodiment is roughly the same as the embodiment of the first figure, so xn is old and the only difference is the base body of this embodiment. Set with flexible body 1 〇3b turn h / installation 丨 “b open circuit 1 OOb 'this base body part 1 0 ^ h ^ ^ j- 2 mouth receiving end 1 〇 04b, the other side is the entrance Undertake end workers 〇 on the base 1. ㈣ When it comes into contact with the heating element of the computer, its hot rolling is concentrated on the heat-absorbing end of the base body 10b. Through this open circuit 1 〇qb 夕 卜 it, * UD external cold and hot parent mode, and then turn over it The flakes of jW are exhausted by a fan to achieve complete heat dissipation. fRefer to [shown in the sixth figure], as shown in the figure. This embodiment is roughly the same as the fifth embodiment, except that the base body 1 c of this embodiment is processed to reciprocate. The type circuit i 〇c, this reciprocating circuit 10 Oc can be used for external cold and heat exchange mode, and then turned through the sheet-like heat dissipation part above it by a fan to exhaust its hot air. Two references are full [Seventh figure, Ping J, as shown in Figure zero: 丨 The implementation of the left is not very complicated ^^ The example of the figure is roughly ㈣, the only difference is that the heat sink can be designed to not dissipate heat as shown The piece 1 d can be made into the space where the heat source is placed—the base body portion 10 d having the same height as shown in the first figure, and the sheet-shaped heat radiation portion provided at the top and having different arrangement density and height. 1 Id.
M261972 圖式簡單說明 五、〔圖式簡單說明〕： 第一圖：係本創作第一實施例之立體圖 第二圖：係第一圖之前視圖 第三圖··係第一圖之散熱用媒介循環散熱示意圖 第四圖··係本創作第二實施例散熱用媒介循環散熱示意圖 第五圖：係本創作第三實施例散熱用媒介循環散熱示意圖 第六圖：係本創作第四實施例散熱用媒介循環散熱示意圖 第七圖··係本創作第五實施例之立體圖 ※圖號說明： 1 、1 d ·散熱片 10、 10a、l〇b、10c、l〇d·基座體部 100、100a·密閉式迴路 100b·開放式迴路 100c·往復式迴路 101 ·散熱用媒介 102、 102b·轉折式通道 1 0 2 a · ^ t 2 包 ‘·往.禮n 達·： 103、 103a、103b·軟性體 104b·出口承接端 105b·入口承接端 11、 lid·片狀散熱部M261972 Brief description of the drawings V. [Simplified description of the drawings]: The first picture: a perspective view of the first embodiment of this creation; the second picture: the view before the first picture; the third picture; the heat dissipation medium of the first picture Schematic diagram of cyclic heat dissipation 4th diagram ... Schematic diagram of cyclic heat dissipation of heat dissipation medium in the second embodiment of this creation. Fig. 5: Schematic diagram of cyclic heat dissipation of heat dissipation medium in the third embodiment of this creation. Schematic diagram of heat dissipation by media circulation. 7th diagram. · This is a perspective view of the fifth embodiment of this creation. ※ Drawing number description: 1, 1 d. Heat sinks 10, 10a, 10b, 10c, 10d. Base body 100. , 100a · closed circuit 100b · open circuit 100c · reciprocating circuit 101 · radiating medium 102, 102b · turning channel 1 0 2 a · ^ t 2 packs' · to. Li n da ·: 103, 103a, 103b · Soft body 104b · Outlet receiving end 105b · Inlet receiving end 11, lid · Sheet heat sink
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