TW200532423A - Heat sink structure (2) - Google Patents

Abstract

A heat sink structure (2) includes a base body and a heat dissipating fin connected above the base body. The base body and the heat dissipating fin are extruded, forged or welded to form an integral body. The bottom of the heat dissipating fin and interior of the base body are machine to form a channel. The channel is extruded with an integrally formed capillary device for form a two-layer channel loop, which is air-exhausted to form a vacuum and filled with liquid or gaseous heat dissipating medium. The gaseous heat dissipating medium fills 50% to 90% of the channel capacity. When the base body contacts the contact face of the computer heat generating parts, the heat will be concentrated onto the heat absorbing end of the base body, and then dissipated by a fan via the heat dissipating fin thereby enhancing its heat dissipating effect.

Description

200532423 V. Description of the invention (1) "Technical field to which the invention belongs": The present invention relates to an application and peripheral devices such as plasma televisions for the installation of Kunye or notebook computers, and projection 2). Heat sink structure ("previous technology") for heat-radiating devices: Current computer applications have been widely used by people. With the continuous processing of computer data, the heat generated in various areas of social life is also increasing, and it is timely to dissipate computer components. The problem to be solved during work. At present, the well-known heat sink structure used for normal computer operation is generally a metal-type personal or notebook computer type heat sink, and the base is connected above the body. There are several Korean appliances that clamp the radiator to the hairpin surface of the computer. For women, use eccentric clamps to make close contact. When the cooling fan makes the lower surface and heat, according to the principle of heat conduction, the computer computer working contact surface is transmitted to The base of the radiator passes J to it; the airflow from the radiator fan takes away the heat. In this way, the efficiency of the heat dissipation method depends on the thermal conductivity of the solid heat conductive material that is a thermal conductive solid. Because the effect is also quite limited. The "invention content" of the heat dissipation of each government heat device: The heat dissipation effect of traditional radiators due to human To develop a special piece of the title and develop a heat dissipation sheet to enhance the heat dissipation effect (the application number is 921 34274), and continue to the current two-piece body wash &, Bedan will The base of the heat sink and the fins used for heat dissipation are derived from a connection or a

Page 5 200532423 V. Description of the invention (2) With the base body, the invention finally came into being. The main feature of the present invention is that the base body portion of the heat sink structure and the fins for heat dissipation are integrated as a whole by extrusion or forging or welding. The base body portion at the bottom end of the heat sink is processed to provide a channel in the channel. There is an integrally formed capillary device, which is a double-layer channel circuit. After vacuuming, a vacuum is formed. The circuit is filled with a liquid or gaseous heat-dissipating medium that is about 50 to 90% of the channel content to make it hot. Concentrate on the heat-absorbing end of the base body, and then turn the heat-dissipating fins to exhaust the hot air from the fan to achieve the heat-dissipating effect. Compared with the conventional conventional radiator, the present invention has the following beneficial effects: a double-layered circuit is provided inside the base body of the bottom end of the heat sink of the present invention; A liquid or gaseous heat-dissipating medium is filled therein, and the heat-dissipating medium absorbs, radiates, and re-absorbs heat during the liquid-gas-liquid cyclic phase change, and absorbs the computer device through the contact surface of the base body of the heat sink The working heat is then released to the fins for heat dissipation, which changes the single heat dissipation method through metal heat conduction, which increases the heat dissipation capacity of the heat sink and improves the heat dissipation efficiency of the heat sink. # [Embodiment]: Please refer to [shown in Figs. 1 and 2], as shown in the figure: The heat sink 1 ′ of the present invention includes a base body portion 10 and heat radiation connected above the base body portion 10. With the ore sheet 11, the base body 10 and the fins for heat dissipation ^ metal aluminum can be extruded or forged or welded to form a whole, and an integrally formed capillary is extruded in the channel 102 of the base body 10. Device 12 becomes a double-layer channel circuit. The heat sink 1 is used in personal or notebook computers, projectors and plasmas.

Page 6 V. Description of the invention (3) Peripheral equipment, such as televisions, for its heat sink. The base body part mentioned above is in contact with the computer heating body. The base body part 10 absorbs heat. After the base body part 10 is processed, it is made into a closed circuit of ^ 102 in the channel 102. An integrally-formed capillary device 12 is extruded inside. In addition, the base body 10 can be used in combination with the heat-dissipating fins 丨 and can also be used solely on smaller computer devices. The fins 11 for heat dissipation are connected above the base body part 10, and the heat-absorbing end of the beautiful base body part 10 is arranged by a fan for heat dissipation through the Korean heat sink. The capillary device 12 is connected to the base body. The inner part of the channel 10 is extruded and integrated. The capillary device 12 is provided with at least one sub-piece 121 on the periphery of the round rod 120. The capillary device 12 can be cut according to different computer components. Refer to Figure 3. [Shown], as shown in the figure. The above base body portion 10 = = is a double-layered circuit with the capillary device 12 extruded, and the locking body 103 is closed at the opening of the upright / ^-end, The inside of the channel 102 is a type circuit, and a vacuum is formed in the channel 102 after being evacuated, and ^ = or a lice-shaped heat-dissipating medium 101, and the heat-insulating medium 101 enters: the content of the channel 102 is 50 to 90%. [As shown by the arrow in Figure 3]. After the installation, the flat surface of the sheet 1 is tightly connected with the computer device (such as a heating element) after installation. The heat emitted by the brain device is transmitted to the surface through the contact surface. The aluminum base body 10 on your side is conducted by metal. The way will

Si t heat fins 11, on the other hand, the heat dissipation medium 101 in the channel 102 is converted from a liquid state to a gaseous state after being heated near the contact surface of the dish, so that 200532423 V. Description of the invention (4) Absorbs the heat from the computer device. Then the gaseous heat-dissipating medium 101 is cooled at the low-temperature heat-dissipating fins 11 and then converted from the gaseous state to the liquid state, thereby releasing heat to the heat-dissipating fins. The heat-dissipating medium 101 passes through u In this way, the liquid-gas-liquid phase change cycle realizes the heat transfer process of heat absorption, heat release, and heat absorption. Finally, the airflow caused by the fan blows through the heat dissipation fins n to remove the heat, which greatly improves the heat dissipation fins in a dual heat dissipation method. Cooling efficiency. Refer to [shown in FIG. 4] in May. As shown in the figure, this embodiment is substantially the same as the embodiment of FIG. 1 except that the base body is extruded into a longitudinal channel l. 〇2a, an integrally formed capillary device 12a is extruded in the longitudinal passage 102a, and locking bodies 103a are filled in the outlets of the ends of the longitudinal passage 102a. Please refer to [shown in FIG. 5], as shown in the figure: This embodiment is substantially the same as the embodiment of FIG. 1, except that the base body portion is processed in the channel 102b and is squeezed. An integrally formed capillary device 12b is formed to form a double-layer channel circuit, and the locking body 103b is filled at the outlet of each end of the channel 10213. Referring to [shown in FIG. 6], as shown in the figure, this embodiment is substantially the same as the embodiment of FIG. 5, except that the heat sink j can be designed as shown in the figure. The height and arrangement density of the base body portion 10c of the same height as shown in FIG. 5 and the heat dissipation fins lle connected above can be set to different values according to the size of the space around the heating element. Please refer to [shown in Figure 7], as shown in the figure: This embodiment is roughly the same as the embodiment in Figure 1, except that the heat sink can be designed as

Page 8 200532423 V. Description of the invention (5) 'As shown in the figure, the base body at the bottom of the heat sink 1 d is processed or extruded into a reciprocating channel 102d, which is connected at both ends. A capillary device 12d is placed or extruded in the channel 102d, and the end of each end is filled with a locking body 103d to close, so that the reciprocating channel 102 (1 forms a vacuum after being evacuated, and is filled with about The reciprocating channel 102d with a content of 50 to 90% of the heat dissipation medium 101 [as shown by the arrow in FIG. 7] Please refer to [as shown in FIG. 8], as shown in this embodiment and the first The embodiment in figure j is roughly the same, except that in this embodiment, one end of the outlet and inlet receiving end of the base body portion 10e is connected to the channel, and the other end is connected to the open circuit 1 of the external heat and heat exchange cycle system. 〇e, depending on the space where the heat source is placed, two or more base bodies 丨 0e are connected in series to form a combination.

Page 9 200532423 Schematic description of V. [Simple description of Schematic]:

Fig. 1 is a perspective exploded view of the first embodiment of the present invention. Fig. 2 is a cross-sectional view of the front view of Fig. 1. Fig. 3 is a schematic diagram of circulating heat dissipation of the heat dissipation medium of Fig. 1. Fig. 4 is the present invention. Schematic diagram of circulatory heat dissipation of the second embodiment for heat dissipation Figure 5: A perspective exploded view of the third embodiment of the present invention Figure 6: A perspective exploded view of the fourth embodiment of the present invention Figure 7: A fifth implementation of the present invention Example Schematic diagram of circulating heat dissipation for heat dissipation Figure 8: Schematic illustration of the sixth embodiment of the present invention in series connection [illustration of drawing numbers]: I, 1 c, 1 d. Heat sinks 10, 10a, 10b, 10c, 10d 10e. Base body 1 0 e. Open circuit 1 0 1. Heat dissipation media 102, 102b. Channel 102a. Longitudinal channel 102d. Reciprocating channel 103, 103a, 103b, 103d. Locking body

II, 11c. Fins for heat dissipation 12, 12a, 12b, 12d. Capillary device 1 2 0. Round rod 121. Separator

Page 10

Claims (1)

200532423 6. Scope of patent application [: A kind of heat sink structure (2), including-a base body and a fin for heat dissipation connected above the base body, and a capillary device is extruded inside the base body to become The closed circuit of the double-layer channel forms a vacuum, and the closed circuit is used for lining, connecting, Skudai Putian, 埒 刼 ,, and fins, and it is set on the base body. The ancient JL scales. Gatschi heat ^, ^ ^ above, turn the heat-absorbing end of the base body through the heat dissipation above it, and use fins to exhaust its heat source from the wind to achieve complete heat dissipation. The heat sink structure described in item (2), wherein the base body and the fins for heat dissipation are integrated by extrusion or forging or welding. 3 · The heat sink structure as described in the first item of the scope of patent application (2) Wherein, the base body can be placed on a smaller computer device. 4 · The heat sink structure as described in item 1 of the patent application (2) wherein the periphery of the round rod in the center of the capillary device is provided with a separator. 5 · The heat sink structure (2) as described in item i of the patent application scope, wherein the heat dissipation medium may be any of liquid or gas. 6 · The heat sink structure as described in item 1 of the patent application scope (2), wherein the amount of the heat sinking medium perfusion is 50 to 7 of the content of the channel · The heat sink as described in item i of the patent application scope Structure (b), its Yin, the base body is provided with a longitudinal passage inside. 8 · The heat sink structure (2) as described in item 1 of the scope of the patent application, which requires that an extruded integrated capillary device be placed in the channel inside the base body of the bottom end of the political heat plate to form a double-layer channel. Circuit. 200532423 y ^ The heat sink structure (2) described in item 8 of the 1% patent scope. The heat sink has a base body with the same height above it. Different heights and arrangement densities can be set according to the size of the space around the heat source. Cooling fins. 1 0 · The heat sink structure (2) as described in item 1 of the scope of patent application, wherein the interior of the base body is set as a reciprocating channel with two ends intersecting. Capillary device. 1 1 · The heat sink structure as described in item 1 of the scope of patent application (2) 'wherein the end of the base body's inlet and outlet are connected to the channel at one end' and the other end is connected to the external cold and heat exchange cycle system Open loop,