TWI924140B - 晶圓收納容器處理裝置 - Google Patents

晶圓收納容器處理裝置

Info

Publication number
TWI924140B
TWI924140B TW113136513A TW113136513A TWI924140B TW I924140 B TWI924140 B TW I924140B TW 113136513 A TW113136513 A TW 113136513A TW 113136513 A TW113136513 A TW 113136513A TW I924140 B TWI924140 B TW I924140B
Authority
TW
Taiwan
Prior art keywords
gas
storage container
wafer storage
door
foup
Prior art date
Application number
TW113136513A
Other languages
English (en)
Chinese (zh)
Other versions
TW202514876A (zh
Inventor
石原淳司
宮迫久顕
西部幸伸
Original Assignee
日商芝浦機械電子裝置股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商芝浦機械電子裝置股份有限公司 filed Critical 日商芝浦機械電子裝置股份有限公司
Publication of TW202514876A publication Critical patent/TW202514876A/zh
Application granted granted Critical
Publication of TWI924140B publication Critical patent/TWI924140B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW113136513A 2023-09-28 2024-09-26 晶圓收納容器處理裝置 TWI924140B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-168678 2023-09-28
JP2023168678A JP7849131B2 (ja) 2023-09-28 2023-09-28 ウェーハ収納容器処理装置

Publications (2)

Publication Number Publication Date
TW202514876A TW202514876A (zh) 2025-04-01
TWI924140B true TWI924140B (zh) 2026-05-01

Family

ID=95085674

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113136513A TWI924140B (zh) 2023-09-28 2024-09-26 晶圓收納容器處理裝置

Country Status (5)

Country Link
US (1) US12707930B2 (enExample)
JP (2) JP7849131B2 (enExample)
KR (1) KR102937543B1 (enExample)
CN (1) CN119725186A (enExample)
TW (1) TWI924140B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7849131B2 (ja) * 2023-09-28 2026-04-21 芝浦メカトロニクス株式会社 ウェーハ収納容器処理装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111868908A (zh) * 2018-03-13 2020-10-30 信越聚合物股份有限公司 基板收纳容器
TW202129812A (zh) * 2019-09-05 2021-08-01 日商信越聚合物股份有限公司 基板收納容器
CN110870056B (zh) * 2017-07-14 2023-07-07 信越聚合物股份有限公司 基板收纳容器

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Publication number Priority date Publication date Assignee Title
JP2006005072A (ja) * 2004-06-16 2006-01-05 Ebara Corp 基板搬送保管容器及びその使用方法
JP4012190B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び開閉方法
JP2005109523A (ja) 2004-12-27 2005-04-21 Takeshiba Electric Co Ltd 半導体ウエハ等のポッド洗浄乾燥装置
WO2010137556A1 (ja) 2009-05-27 2010-12-02 ローツェ株式会社 雰囲気置換装置
US8591664B2 (en) * 2009-06-17 2013-11-26 Dynamic Micro System Integrated cleaner and dryer system
JP6106501B2 (ja) * 2013-04-12 2017-04-05 東京エレクトロン株式会社 収納容器内の雰囲気管理方法
JP6403431B2 (ja) * 2013-06-28 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム
WO2017212841A1 (ja) * 2016-06-08 2017-12-14 村田機械株式会社 容器保管装置及び容器保管方法
US10403514B1 (en) * 2018-04-12 2019-09-03 Asm Ip Holding B.V. Substrate transporting system, storage medium and substrate transporting method
JP7100243B2 (ja) * 2018-04-19 2022-07-13 シンフォニアテクノロジー株式会社 排気ノズルユニット、ロードポート、及びｅｆｅｍ
CN110534455A (zh) * 2018-05-24 2019-12-03 昕芙旎雅有限公司 基板收纳容器管理系统、装载端口、基板收纳容器管理方法
US11662373B2 (en) * 2018-05-24 2023-05-30 Sinfonia Technology Co., Ltd. Substrate storage container management system, load port, and substrate storage container management method
KR102262852B1 (ko) * 2020-02-19 2021-06-09 (주)에스티아이 풉 세정 장치의 버퍼부 및 이를 이용한 풉의 불량 유무 판단 방법
JP7371663B2 (ja) * 2021-04-27 2023-10-31 株式会社ダイフク 検査システム
JP7849131B2 (ja) * 2023-09-28 2026-04-21 芝浦メカトロニクス株式会社 ウェーハ収納容器処理装置
JP2025060236A (ja) * 2023-09-29 2025-04-10 芝浦メカトロニクス株式会社 ウェーハ収納容器洗浄装置
JP7879088B2 (ja) * 2023-09-29 2026-06-23 芝浦メカトロニクス株式会社 ウェーハ収納容器洗浄装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110870056B (zh) * 2017-07-14 2023-07-07 信越聚合物股份有限公司 基板收纳容器
CN111868908A (zh) * 2018-03-13 2020-10-30 信越聚合物股份有限公司 基板收纳容器
TW202129812A (zh) * 2019-09-05 2021-08-01 日商信越聚合物股份有限公司 基板收納容器

Also Published As

Publication number Publication date
JP2026104917A (ja) 2026-06-25
KR20250047614A (ko) 2025-04-04
US20250112070A1 (en) 2025-04-03
US12707930B2 (en) 2026-08-11
JP2025058631A (ja) 2025-04-09
TW202514876A (zh) 2025-04-01
JP7849131B2 (ja) 2026-04-21
CN119725186A (zh) 2025-03-28
KR102937543B1 (ko) 2026-03-10

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