KR102937543B1 - 웨이퍼 수납 용기 처리 장치 - Google Patents

웨이퍼 수납 용기 처리 장치

Info

Publication number
KR102937543B1
KR102937543B1 KR1020240130245A KR20240130245A KR102937543B1 KR 102937543 B1 KR102937543 B1 KR 102937543B1 KR 1020240130245 A KR1020240130245 A KR 1020240130245A KR 20240130245 A KR20240130245 A KR 20240130245A KR 102937543 B1 KR102937543 B1 KR 102937543B1
Authority
KR
South Korea
Prior art keywords
gas
door
storage container
wafer storage
foup
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020240130245A
Other languages
English (en)
Korean (ko)
Other versions
KR20250047614A (ko
Inventor
준지 이시하라
히사아키 미야사코
유키노부 니시베
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20250047614A publication Critical patent/KR20250047614A/ko
Application granted granted Critical
Publication of KR102937543B1 publication Critical patent/KR102937543B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020240130245A 2023-09-28 2024-09-25 웨이퍼 수납 용기 처리 장치 Active KR102937543B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023168678A JP7849131B2 (ja) 2023-09-28 2023-09-28 ウェーハ収納容器処理装置
JPJP-P-2023-168678 2023-09-28

Publications (2)

Publication Number Publication Date
KR20250047614A KR20250047614A (ko) 2025-04-04
KR102937543B1 true KR102937543B1 (ko) 2026-03-10

Family

ID=95085674

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020240130245A Active KR102937543B1 (ko) 2023-09-28 2024-09-25 웨이퍼 수납 용기 처리 장치

Country Status (5)

Country Link
US (1) US12707930B2 (enExample)
JP (2) JP7849131B2 (enExample)
KR (1) KR102937543B1 (enExample)
CN (1) CN119725186A (enExample)
TW (1) TWI924140B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7849131B2 (ja) * 2023-09-28 2026-04-21 芝浦メカトロニクス株式会社 ウェーハ収納容器処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017212841A1 (ja) * 2016-06-08 2017-12-14 村田機械株式会社 容器保管装置及び容器保管方法
KR102262852B1 (ko) * 2020-02-19 2021-06-09 (주)에스티아이 풉 세정 장치의 버퍼부 및 이를 이용한 풉의 불량 유무 판단 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005072A (ja) * 2004-06-16 2006-01-05 Ebara Corp 基板搬送保管容器及びその使用方法
JP4012190B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び開閉方法
JP2005109523A (ja) 2004-12-27 2005-04-21 Takeshiba Electric Co Ltd 半導体ウエハ等のポッド洗浄乾燥装置
WO2010137556A1 (ja) 2009-05-27 2010-12-02 ローツェ株式会社 雰囲気置換装置
US8591664B2 (en) * 2009-06-17 2013-11-26 Dynamic Micro System Integrated cleaner and dryer system
JP6106501B2 (ja) * 2013-04-12 2017-04-05 東京エレクトロン株式会社 収納容器内の雰囲気管理方法
JP6403431B2 (ja) * 2013-06-28 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム
KR102469954B1 (ko) * 2017-07-14 2022-11-23 신에츠 폴리머 가부시키가이샤 기판 수납 용기
JP7125000B2 (ja) * 2018-03-13 2022-08-24 信越ポリマー株式会社 基板収納容器
US10403514B1 (en) * 2018-04-12 2019-09-03 Asm Ip Holding B.V. Substrate transporting system, storage medium and substrate transporting method
JP7100243B2 (ja) * 2018-04-19 2022-07-13 シンフォニアテクノロジー株式会社 排気ノズルユニット、ロードポート、及びｅｆｅｍ
CN110534455A (zh) * 2018-05-24 2019-12-03 昕芙旎雅有限公司 基板收纳容器管理系统、装载端口、基板收纳容器管理方法
US11662373B2 (en) * 2018-05-24 2023-05-30 Sinfonia Technology Co., Ltd. Substrate storage container management system, load port, and substrate storage container management method
JP7351681B2 (ja) * 2019-09-05 2023-09-27 信越ポリマー株式会社 基板収納容器
JP7371663B2 (ja) * 2021-04-27 2023-10-31 株式会社ダイフク 検査システム
JP7849131B2 (ja) * 2023-09-28 2026-04-21 芝浦メカトロニクス株式会社 ウェーハ収納容器処理装置
JP2025060236A (ja) * 2023-09-29 2025-04-10 芝浦メカトロニクス株式会社 ウェーハ収納容器洗浄装置
JP7879088B2 (ja) * 2023-09-29 2026-06-23 芝浦メカトロニクス株式会社 ウェーハ収納容器洗浄装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017212841A1 (ja) * 2016-06-08 2017-12-14 村田機械株式会社 容器保管装置及び容器保管方法
KR102262852B1 (ko) * 2020-02-19 2021-06-09 (주)에스티아이 풉 세정 장치의 버퍼부 및 이를 이용한 풉의 불량 유무 판단 방법

Also Published As

Publication number Publication date
TWI924140B (zh) 2026-05-01
JP2026104917A (ja) 2026-06-25
KR20250047614A (ko) 2025-04-04
US20250112070A1 (en) 2025-04-03
US12707930B2 (en) 2026-08-11
JP2025058631A (ja) 2025-04-09
TW202514876A (zh) 2025-04-01
JP7849131B2 (ja) 2026-04-21
CN119725186A (zh) 2025-03-28

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