JP7849131B2 - ウェーハ収納容器処理装置 - Google Patents

ウェーハ収納容器処理装置

Info

Publication number
JP7849131B2
JP7849131B2 JP2023168678A JP2023168678A JP7849131B2 JP 7849131 B2 JP7849131 B2 JP 7849131B2 JP 2023168678 A JP2023168678 A JP 2023168678A JP 2023168678 A JP2023168678 A JP 2023168678A JP 7849131 B2 JP7849131 B2 JP 7849131B2
Authority
JP
Japan
Prior art keywords
gas
foup
door
storage container
wafer storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023168678A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025058631A5 (enExample
JP2025058631A (ja
Inventor
淳司 石原
久顕 宮迫
幸伸 西部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2023168678A priority Critical patent/JP7849131B2/ja
Priority to US18/894,512 priority patent/US12707930B2/en
Priority to CN202411338166.4A priority patent/CN119725186A/zh
Priority to KR1020240130245A priority patent/KR102937543B1/ko
Priority to TW113136513A priority patent/TWI924140B/zh
Publication of JP2025058631A publication Critical patent/JP2025058631A/ja
Publication of JP2025058631A5 publication Critical patent/JP2025058631A5/ja
Priority to JP2026064648A priority patent/JP2026104917A/ja
Application granted granted Critical
Publication of JP7849131B2 publication Critical patent/JP7849131B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023168678A 2023-09-28 2023-09-28 ウェーハ収納容器処理装置 Active JP7849131B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2023168678A JP7849131B2 (ja) 2023-09-28 2023-09-28 ウェーハ収納容器処理装置
US18/894,512 US12707930B2 (en) 2023-09-28 2024-09-24 Wafer storage container processing apparatus
KR1020240130245A KR102937543B1 (ko) 2023-09-28 2024-09-25 웨이퍼 수납 용기 처리 장치
CN202411338166.4A CN119725186A (zh) 2023-09-28 2024-09-25 晶片收纳容器处理装置
TW113136513A TWI924140B (zh) 2023-09-28 2024-09-26 晶圓收納容器處理裝置
JP2026064648A JP2026104917A (ja) 2023-09-28 2026-04-09 ウェーハ収納容器処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2023168678A JP7849131B2 (ja) 2023-09-28 2023-09-28 ウェーハ収納容器処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2026064648A Division JP2026104917A (ja) 2023-09-28 2026-04-09 ウェーハ収納容器処理装置

Publications (3)

Publication Number Publication Date
JP2025058631A JP2025058631A (ja) 2025-04-09
JP2025058631A5 JP2025058631A5 (enExample) 2025-06-06
JP7849131B2 true JP7849131B2 (ja) 2026-04-21

Family

ID=95085674

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023168678A Active JP7849131B2 (ja) 2023-09-28 2023-09-28 ウェーハ収納容器処理装置
JP2026064648A Pending JP2026104917A (ja) 2023-09-28 2026-04-09 ウェーハ収納容器処理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2026064648A Pending JP2026104917A (ja) 2023-09-28 2026-04-09 ウェーハ収納容器処理装置

Country Status (5)

Country Link
US (1) US12707930B2 (enExample)
JP (2) JP7849131B2 (enExample)
KR (1) KR102937543B1 (enExample)
CN (1) CN119725186A (enExample)
TW (1) TWI924140B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7849131B2 (ja) * 2023-09-28 2026-04-21 芝浦メカトロニクス株式会社 ウェーハ収納容器処理装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005072A (ja) 2004-06-16 2006-01-05 Ebara Corp 基板搬送保管容器及びその使用方法
WO2017212841A1 (ja) 2016-06-08 2017-12-14 村田機械株式会社 容器保管装置及び容器保管方法
KR102262852B1 (ko) 2020-02-19 2021-06-09 (주)에스티아이 풉 세정 장치의 버퍼부 및 이를 이용한 풉의 불량 유무 판단 방법
JP2022169329A (ja) 2021-04-27 2022-11-09 株式会社ダイフク 検査システム

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4012190B2 (ja) * 2004-10-26 2007-11-21 Ｔｄｋ株式会社 密閉容器の蓋開閉システム及び開閉方法
JP2005109523A (ja) 2004-12-27 2005-04-21 Takeshiba Electric Co Ltd 半導体ウエハ等のポッド洗浄乾燥装置
WO2010137556A1 (ja) 2009-05-27 2010-12-02 ローツェ株式会社 雰囲気置換装置
US8591664B2 (en) * 2009-06-17 2013-11-26 Dynamic Micro System Integrated cleaner and dryer system
JP6106501B2 (ja) * 2013-04-12 2017-04-05 東京エレクトロン株式会社 収納容器内の雰囲気管理方法
JP6403431B2 (ja) * 2013-06-28 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム
KR102469954B1 (ko) * 2017-07-14 2022-11-23 신에츠 폴리머 가부시키가이샤 기판 수납 용기
JP7125000B2 (ja) * 2018-03-13 2022-08-24 信越ポリマー株式会社 基板収納容器
US10403514B1 (en) * 2018-04-12 2019-09-03 Asm Ip Holding B.V. Substrate transporting system, storage medium and substrate transporting method
JP7100243B2 (ja) * 2018-04-19 2022-07-13 シンフォニアテクノロジー株式会社 排気ノズルユニット、ロードポート、及びｅｆｅｍ
CN110534455A (zh) * 2018-05-24 2019-12-03 昕芙旎雅有限公司 基板收纳容器管理系统、装载端口、基板收纳容器管理方法
US11662373B2 (en) * 2018-05-24 2023-05-30 Sinfonia Technology Co., Ltd. Substrate storage container management system, load port, and substrate storage container management method
JP7351681B2 (ja) * 2019-09-05 2023-09-27 信越ポリマー株式会社 基板収納容器
JP7849131B2 (ja) * 2023-09-28 2026-04-21 芝浦メカトロニクス株式会社 ウェーハ収納容器処理装置
JP2025060236A (ja) * 2023-09-29 2025-04-10 芝浦メカトロニクス株式会社 ウェーハ収納容器洗浄装置
JP7879088B2 (ja) * 2023-09-29 2026-06-23 芝浦メカトロニクス株式会社 ウェーハ収納容器洗浄装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005072A (ja) 2004-06-16 2006-01-05 Ebara Corp 基板搬送保管容器及びその使用方法
WO2017212841A1 (ja) 2016-06-08 2017-12-14 村田機械株式会社 容器保管装置及び容器保管方法
KR102262852B1 (ko) 2020-02-19 2021-06-09 (주)에스티아이 풉 세정 장치의 버퍼부 및 이를 이용한 풉의 불량 유무 판단 방법
JP2022169329A (ja) 2021-04-27 2022-11-09 株式会社ダイフク 検査システム

Also Published As

Publication number Publication date
TWI924140B (zh) 2026-05-01
JP2026104917A (ja) 2026-06-25
KR20250047614A (ko) 2025-04-04
US20250112070A1 (en) 2025-04-03
US12707930B2 (en) 2026-08-11
JP2025058631A (ja) 2025-04-09
TW202514876A (zh) 2025-04-01
CN119725186A (zh) 2025-03-28
KR102937543B1 (ko) 2026-03-10

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