TWI906477B - 薄膜形成用光硬化性組成物及其硬化物，以及成形體之製造方法 - Google Patents

薄膜形成用光硬化性組成物及其硬化物，以及成形體之製造方法

Info

Publication number
TWI906477B
TWI906477B TW111105880A TW111105880A TWI906477B TW I906477 B TWI906477 B TW I906477B TW 111105880 A TW111105880 A TW 111105880A TW 111105880 A TW111105880 A TW 111105880A TW I906477 B TWI906477 B TW I906477B
Authority
TW
Taiwan
Prior art keywords
component
aforementioned
meth
photocurable composition
acrylate
Prior art date
Application number
TW111105880A
Other languages
English (en)
Chinese (zh)
Other versions
TW202307036A (zh
Inventor
出野柚子
大竹陽介
Original Assignee
日商日產化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日產化學股份有限公司 filed Critical 日商日產化學股份有限公司
Publication of TW202307036A publication Critical patent/TW202307036A/zh
Application granted granted Critical
Publication of TWI906477B publication Critical patent/TWI906477B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F251/00—Macromolecular compounds obtained by polymerising monomers on to polysaccharides or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/372—Sulfides, e.g. R-(S)x-R'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)
TW111105880A 2021-03-26 2022-02-17 薄膜形成用光硬化性組成物及其硬化物，以及成形體之製造方法 TWI906477B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021053474 2021-03-26
JP2021-053474 2021-03-26
JP2021-185280 2021-11-12
JP2021185280 2021-11-12

Publications (2)

Publication Number Publication Date
TW202307036A TW202307036A (zh) 2023-02-16
TWI906477B true TWI906477B (zh) 2025-12-01

Family

ID=83396912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105880A TWI906477B (zh) 2021-03-26 2022-02-17 薄膜形成用光硬化性組成物及其硬化物，以及成形體之製造方法

Country Status (3)

Country Link
JP (1) JP7791509B2 (https=)
TW (1) TWI906477B (https=)
WO (1) WO2022202005A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020015827A (ja) * 2018-07-26 2020-01-30 株式会社ネオス 硬化性樹脂組成物及び自己修復性材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6423960B2 (ja) * 2014-11-04 2018-11-14 ディーダブリューエス エス．アール．エル． ステレオリソグラフィ方法および組成物
WO2016171187A1 (ja) * 2015-04-21 2016-10-27 住友化学株式会社 光硬化性樹脂組成物、これを用いる硬化膜の製造方法及び該硬化膜を含む積層体
KR101971011B1 (ko) * 2015-06-02 2019-04-22 후지필름 가부시키가이샤 하드 코트 필름, 화상 표시 소자의 전면판, 저항막식 터치 패널, 정전 용량식 터치 패널 및 화상 표시 장치
CN112292749B (zh) * 2018-06-27 2024-12-31 日产化学株式会社 压印用光固化性组合物
WO2020129902A1 (ja) * 2018-12-21 2020-06-25 日産化学株式会社 インプリント用光硬化性組成物
KR20220024459A (ko) * 2019-06-19 2022-03-03 스미토모 덴키 고교 가부시키가이샤 수지 조성물, 광파이버의 세컨더리 피복 재료, 광파이버 및 광파이버의 제조 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020015827A (ja) * 2018-07-26 2020-01-30 株式会社ネオス 硬化性樹脂組成物及び自己修復性材料

Also Published As

Publication number Publication date
TW202307036A (zh) 2023-02-16
WO2022202005A1 (ja) 2022-09-29
JP7791509B2 (ja) 2025-12-24
JPWO2022202005A1 (https=) 2022-09-29

Similar Documents

Publication Publication Date Title
KR101203301B1 (ko) 경화성 조성물 및 그의 경화물
KR102549487B1 (ko) 임프린트용 광경화성 조성물
CN112292749B (zh) 压印用光固化性组合物
JP7528361B2 (ja) 中空粒子及びその用途
WO2012133432A1 (ja) オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JP2010083744A (ja) シリカ粒子分散液およびその製造方法
KR102496908B1 (ko) 임프린트용 광경화성 조성물
WO2017163439A1 (ja) 中空粒子及びその用途
WO2019177013A9 (ja) 中空粒子分散体
KR20200128404A (ko) 폴리머를 포함하는 임프린트용 광경화성 조성물
TWI906477B (zh) 薄膜形成用光硬化性組成物及其硬化物，以及成形體之製造方法
JP7469746B2 (ja) 光硬化性組成物
TWI785132B (zh) 壓印用光硬化性組成物
CN115707741A (zh) 环状烯烃树脂用涂布剂、硬化物以及层叠物
CN118175988A (zh) 指甲或人工指甲用光固化性组合物
JP7549299B2 (ja) インプリント用光硬化性組成物
CN104736581A (zh) 光固化性硅凝胶组合物
TWI916621B (zh) 指甲或人工指甲用光硬化性組成物
TW202535980A (zh) 組成物
WO2024247756A1 (ja) シルセスキオキサン誘導体、硬化性組成物、硬化物、ハードコート剤、ハードコート、物品、及び積層体