TWI906224B - 蒸氣腔用之毛細結構片材、蒸氣腔及電子機器 - Google Patents

蒸氣腔用之毛細結構片材、蒸氣腔及電子機器

Info

Publication number
TWI906224B
TWI906224B TW109130965A TW109130965A TWI906224B TW I906224 B TWI906224 B TW I906224B TW 109130965 A TW109130965 A TW 109130965A TW 109130965 A TW109130965 A TW 109130965A TW I906224 B TWI906224 B TW I906224B
Authority
TW
Taiwan
Prior art keywords
sheet
shore
liquid storage
overlapping
electronic device
Prior art date
Application number
TW109130965A
Other languages
English (en)
Chinese (zh)
Other versions
TW202117260A (zh
Inventor
小田和範
武田利彦
高橋伸一郎
太田貴之
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202117260A publication Critical patent/TW202117260A/zh
Application granted granted Critical
Publication of TWI906224B publication Critical patent/TWI906224B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Physical Vapour Deposition (AREA)
TW109130965A 2019-10-09 2020-09-09 蒸氣腔用之毛細結構片材、蒸氣腔及電子機器 TWI906224B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-186221 2019-10-09
JP2019-186194 2019-10-09
JP2019186221 2019-10-09
JP2019186194 2019-10-09

Publications (2)

Publication Number Publication Date
TW202117260A TW202117260A (zh) 2021-05-01
TWI906224B true TWI906224B (zh) 2025-12-01

Family

ID=75437878

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109130965A TWI906224B (zh) 2019-10-09 2020-09-09 蒸氣腔用之毛細結構片材、蒸氣腔及電子機器

Country Status (4)

Country Link
JP (1) JP7745154B2 (https=)
CN (1) CN112956286B (https=)
TW (1) TWI906224B (https=)
WO (1) WO2021070544A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230156088A (ko) 2021-03-10 2023-11-13 다이니폰 인사츠 가부시키가이샤 베이퍼 챔버, 베이퍼 챔버용 윅 시트 및 전자 기기
US20240224469A1 (en) * 2021-04-27 2024-07-04 Dai Nippon Printing Co., Ltd. Vapor chamber, wick sheet for vapor chamber, and electronic apparatus

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050183847A1 (en) * 2004-02-24 2005-08-25 Shwin-Chung Wong Microchannel flat-plate heat pipe with parallel grooves for recycling coolant
US20070022603A1 (en) * 2005-07-29 2007-02-01 Delta Electronics Inc. Vapor chamber and manufacturing method thereof
US7203064B2 (en) * 2003-12-12 2007-04-10 Intel Corporation Heat exchanger with cooling channels having varying geometry
JP2010014292A (ja) * 2008-07-01 2010-01-21 Sony Corp 熱輸送デバイス、電子機器及び積層構造体
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
JP6433848B2 (ja) * 2015-05-01 2018-12-05 国立大学法人名古屋大学 熱交換器、蒸発体、および電子機器
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
JP2019143960A (ja) * 2017-11-10 2019-08-29 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266153A (ja) * 2006-03-28 2007-10-11 Sony Corp プレート型熱輸送装置及び電子機器
KR20140029633A (ko) 2012-08-29 2014-03-11 한국전자통신연구원 모세관력이 향상된 방열소자 및 그 제조방법
JP2015225709A (ja) * 2014-05-26 2015-12-14 トヨタ自動車株式会社 燃料電池用のセパレータおよび燃料電池
CN105592671A (zh) * 2016-03-11 2016-05-18 苏州市万松电气有限公司 采用热管散热器的列车供电箱
JP7145412B2 (ja) 2017-09-28 2022-10-03 大日本印刷株式会社 ベーパーチャンバおよび電子機器
JP7148889B2 (ja) 2017-10-06 2022-10-06 大日本印刷株式会社 ベーパーチャンバ、電子機器およびベーパーチャンバ用金属シート
JP6338006B1 (ja) 2017-11-02 2018-06-06 オムロン株式会社 人集結分析装置、移動先予定作成装置、人集結分析システム、車両、および、人集結分析プログラム
CN119812143A (zh) * 2019-03-11 2025-04-11 大日本印刷株式会社 蒸发室、电子设备以及蒸发室用片

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7203064B2 (en) * 2003-12-12 2007-04-10 Intel Corporation Heat exchanger with cooling channels having varying geometry
US20050183847A1 (en) * 2004-02-24 2005-08-25 Shwin-Chung Wong Microchannel flat-plate heat pipe with parallel grooves for recycling coolant
US20070022603A1 (en) * 2005-07-29 2007-02-01 Delta Electronics Inc. Vapor chamber and manufacturing method thereof
JP2010014292A (ja) * 2008-07-01 2010-01-21 Sony Corp 熱輸送デバイス、電子機器及び積層構造体
JP6433848B2 (ja) * 2015-05-01 2018-12-05 国立大学法人名古屋大学 熱交換器、蒸発体、および電子機器
US20180156545A1 (en) * 2016-12-05 2018-06-07 Microsoft Technology Licensing, Llc Vapor chamber with three-dimensional printed spanning structure
JP2019039662A (ja) * 2017-08-24 2019-03-14 大日本印刷株式会社 ベーパーチャンバ用のウィックシート、ベーパーチャンバおよびベーパーチャンバの製造方法
JP2019143960A (ja) * 2017-11-10 2019-08-29 大日本印刷株式会社 ベーパーチャンバ、電子機器、ベーパーチャンバ用金属シートおよびベーパーチャンバの製造方法

Also Published As

Publication number Publication date
JP2021092388A (ja) 2021-06-17
CN112956286A (zh) 2021-06-11
CN112956286B (zh) 2025-06-27
JP7745154B2 (ja) 2025-09-29
TW202117260A (zh) 2021-05-01
WO2021070544A1 (ja) 2021-04-15

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