TWI903037B - 表面保護片材及處理方法 - Google Patents

表面保護片材及處理方法

Info

Publication number
TWI903037B
TWI903037B TW111105241A TW111105241A TWI903037B TW I903037 B TWI903037 B TW I903037B TW 111105241 A TW111105241 A TW 111105241A TW 111105241 A TW111105241 A TW 111105241A TW I903037 B TWI903037 B TW I903037B
Authority
TW
Taiwan
Prior art keywords
water
less
weight
protective sheet
surface protective
Prior art date
Application number
TW111105241A
Other languages
English (en)
Chinese (zh)
Other versions
TW202300608A (zh
Inventor
熊倉健太
小坂尚史
清水陽介
島﨑雄太
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202300608A publication Critical patent/TW202300608A/zh
Application granted granted Critical
Publication of TWI903037B publication Critical patent/TWI903037B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW111105241A 2021-03-25 2022-02-14 表面保護片材及處理方法 TWI903037B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021052064 2021-03-25
JP2021-052064 2021-03-25
JP2021151207 2021-09-16
JP2021-151207 2021-09-16
WOPCT/JP2022/003425 2022-01-28
PCT/JP2022/003425 WO2022201857A1 (ja) 2021-03-25 2022-01-28 表面保護シートおよび処理方法

Publications (2)

Publication Number Publication Date
TW202300608A TW202300608A (zh) 2023-01-01
TWI903037B true TWI903037B (zh) 2025-11-01

Family

ID=83396767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105241A TWI903037B (zh) 2021-03-25 2022-02-14 表面保護片材及處理方法

Country Status (3)

Country Link
JP (1) JP7850702B2 (https=)
TW (1) TWI903037B (https=)
WO (1) WO2022201857A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493003B (zh) * 2008-03-13 2015-07-21 Nitto Denko Corp An adhesive composition, an adhesive layer, an adhesive member, and an image display device, and an optical film peeling method and a display panel
WO2021024864A1 (ja) * 2019-08-02 2021-02-11 日東電工株式会社 粘着シート

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX169921B (es) * 1988-10-26 1993-07-30 Kimberly Clark Co Mejoras a material de hoja con adhesivo sensible ala presion y desprendible con agua
US5284690A (en) * 1992-11-03 1994-02-08 Rohm And Haas Company Aqueous release coating composition for pressure sensitive adhesives
JP2003238911A (ja) 2002-02-15 2003-08-27 Nitto Denko Corp 防湿透明粘着テープ
JP2006241264A (ja) * 2005-03-02 2006-09-14 Kuramoto Sangyo:Kk 粘着組成物及びそれを用いた温水剥離型粘着シート
EP2379659A1 (en) * 2008-12-31 2011-10-26 3M Innovative Properties Company Stretch releasable adhesive tape
JP2015193688A (ja) 2014-03-31 2015-11-05 日東電工株式会社 薬液処理用保護シート
CN112920738B (zh) * 2018-02-05 2022-08-16 日东电工株式会社 粘合片及粘合片剥离方法
EP3831907A4 (en) 2018-07-31 2022-06-01 Nitto Denko Corporation OPTICAL PRESSURE SENSITIVE ADHESIVE COMPOSITION AND ITS USE
JP2020176242A (ja) 2019-04-22 2020-10-29 日東電工株式会社 粘着シートおよびその利用
JP7638618B2 (ja) * 2019-08-02 2025-03-04 日東電工株式会社 積層体および剥離方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI493003B (zh) * 2008-03-13 2015-07-21 Nitto Denko Corp An adhesive composition, an adhesive layer, an adhesive member, and an image display device, and an optical film peeling method and a display panel
WO2021024864A1 (ja) * 2019-08-02 2021-02-11 日東電工株式会社 粘着シート

Also Published As

Publication number Publication date
JPWO2022201857A1 (https=) 2022-09-29
TW202300608A (zh) 2023-01-01
JP7850702B2 (ja) 2026-04-23
WO2022201857A1 (ja) 2022-09-29

Similar Documents

Publication Publication Date Title
TWI727257B (zh) 黏著片材及黏著片材剝離方法
TWI854992B (zh) 光學用黏著劑組合物及其利用
CN110003806B (zh) 加强膜
TWI875969B (zh) 黏著片材及其利用
TWI861171B (zh) 黏著片材
TWI861170B (zh) 黏著片材及其利用
KR102705586B1 (ko) 점착 시트 박리 방법
JP7850704B2 (ja) 表面保護シート
TW202003741A (zh) 黏著片材
JP7850703B2 (ja) 表面保護シートおよび処理方法
TWI903037B (zh) 表面保護片材及處理方法
TWI921467B (zh) 表面保護片材及處理方法
TW202239900A (zh) 構造體、黏著片材、套組及方法
TW202339955A (zh) 表面保護片材及處理方法
CN117157372A (zh) 表面保护片材
CN117083356A (zh) 表面保护片材及处理方法
KR20250043487A (ko) 점착 시트의 박리 방법
WO2022024668A1 (ja) 付着粘着剤の除去方法、構造体および感圧接着シート