JP7850702B2 - 表面保護シートおよび処理方法 - Google Patents

表面保護シートおよび処理方法

Info

Publication number
JP7850702B2
JP7850702B2 JP2023508726A JP2023508726A JP7850702B2 JP 7850702 B2 JP7850702 B2 JP 7850702B2 JP 2023508726 A JP2023508726 A JP 2023508726A JP 2023508726 A JP2023508726 A JP 2023508726A JP 7850702 B2 JP7850702 B2 JP 7850702B2
Authority
JP
Japan
Prior art keywords
water
less
weight
adhesive
protection sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023508726A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022201857A1 (https=
Inventor
健太 熊倉
尚史 小坂
陽介 清水
雄太 島▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of JPWO2022201857A1 publication Critical patent/JPWO2022201857A1/ja
Application granted granted Critical
Publication of JP7850702B2 publication Critical patent/JP7850702B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
JP2023508726A 2021-03-25 2022-01-28 表面保護シートおよび処理方法 Active JP7850702B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2021052064 2021-03-25
JP2021052064 2021-03-25
JP2021151207 2021-09-16
JP2021151207 2021-09-16
PCT/JP2022/003425 WO2022201857A1 (ja) 2021-03-25 2022-01-28 表面保護シートおよび処理方法

Publications (2)

Publication Number Publication Date
JPWO2022201857A1 JPWO2022201857A1 (https=) 2022-09-29
JP7850702B2 true JP7850702B2 (ja) 2026-04-23

Family

ID=83396767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508726A Active JP7850702B2 (ja) 2021-03-25 2022-01-28 表面保護シートおよび処理方法

Country Status (3)

Country Link
JP (1) JP7850702B2 (https=)
TW (1) TWI903037B (https=)
WO (1) WO2022201857A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238911A (ja) 2002-02-15 2003-08-27 Nitto Denko Corp 防湿透明粘着テープ
JP2012514104A (ja) 2008-12-31 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 引き伸ばし剥離可能な接着テープ
JP2015193688A (ja) 2014-03-31 2015-11-05 日東電工株式会社 薬液処理用保護シート
WO2019151194A1 (ja) 2018-02-05 2019-08-08 日東電工株式会社 粘着シートおよび粘着シート剥離方法
WO2020027033A1 (ja) 2018-07-31 2020-02-06 日東電工株式会社 光学用粘着剤組成物およびその利用
WO2020218154A1 (ja) 2019-04-22 2020-10-29 日東電工株式会社 粘着シートおよびその利用
WO2021024864A1 (ja) 2019-08-02 2021-02-11 日東電工株式会社 粘着シート
WO2021024741A1 (ja) 2019-08-02 2021-02-11 日東電工株式会社 積層体および剥離方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX169921B (es) * 1988-10-26 1993-07-30 Kimberly Clark Co Mejoras a material de hoja con adhesivo sensible ala presion y desprendible con agua
US5284690A (en) * 1992-11-03 1994-02-08 Rohm And Haas Company Aqueous release coating composition for pressure sensitive adhesives
JP2006241264A (ja) * 2005-03-02 2006-09-14 Kuramoto Sangyo:Kk 粘着組成物及びそれを用いた温水剥離型粘着シート
JP5641634B2 (ja) * 2008-03-13 2014-12-17 日東電工株式会社 粘着剤組成物、粘着剤層、粘着部材および画像表示装置、並びに画像表示装置からの光学フィルムの剥離方法および表示パネルの取り出し方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003238911A (ja) 2002-02-15 2003-08-27 Nitto Denko Corp 防湿透明粘着テープ
JP2012514104A (ja) 2008-12-31 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 引き伸ばし剥離可能な接着テープ
JP2015193688A (ja) 2014-03-31 2015-11-05 日東電工株式会社 薬液処理用保護シート
WO2019151194A1 (ja) 2018-02-05 2019-08-08 日東電工株式会社 粘着シートおよび粘着シート剥離方法
WO2020027033A1 (ja) 2018-07-31 2020-02-06 日東電工株式会社 光学用粘着剤組成物およびその利用
WO2020218154A1 (ja) 2019-04-22 2020-10-29 日東電工株式会社 粘着シートおよびその利用
WO2021024864A1 (ja) 2019-08-02 2021-02-11 日東電工株式会社 粘着シート
WO2021024741A1 (ja) 2019-08-02 2021-02-11 日東電工株式会社 積層体および剥離方法

Also Published As

Publication number Publication date
JPWO2022201857A1 (https=) 2022-09-29
TW202300608A (zh) 2023-01-01
WO2022201857A1 (ja) 2022-09-29
TWI903037B (zh) 2025-11-01

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