TWI899592B - 電漿處理裝置 - Google Patents

電漿處理裝置

Info

Publication number
TWI899592B
TWI899592B TW112126559A TW112126559A TWI899592B TW I899592 B TWI899592 B TW I899592B TW 112126559 A TW112126559 A TW 112126559A TW 112126559 A TW112126559 A TW 112126559A TW I899592 B TWI899592 B TW I899592B
Authority
TW
Taiwan
Prior art keywords
plasma
processing chamber
waveguide
plasma processing
resonator
Prior art date
Application number
TW112126559A
Other languages
English (en)
Chinese (zh)
Other versions
TW202418344A (zh
Inventor
田村仁
池田紀彦
Original Assignee
日商日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立全球先端科技股份有限公司 filed Critical 日商日立全球先端科技股份有限公司
Publication of TW202418344A publication Critical patent/TW202418344A/zh
Application granted granted Critical
Publication of TWI899592B publication Critical patent/TWI899592B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32229—Waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32211—Means for coupling power to the plasma
    • H01J37/32247—Resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192—Microwave generated discharge
    • H01J37/32311—Circuits specially adapted for controlling the microwave discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • ing And Chemical Polishing (AREA)
TW112126559A 2022-10-19 2023-07-17 電漿處理裝置 TWI899592B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022167445 2022-10-19
JP2022-167445 2022-10-19

Publications (2)

Publication Number Publication Date
TW202418344A TW202418344A (zh) 2024-05-01
TWI899592B true TWI899592B (zh) 2025-10-01

Family

ID=90737465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112126559A TWI899592B (zh) 2022-10-19 2023-07-17 電漿處理裝置

Country Status (6)

Country Link
US (1) US12444575B2 (https=)
JP (1) JP7637315B2 (https=)
KR (1) KR102820386B1 (https=)
CN (1) CN118235528A (https=)
TW (1) TWI899592B (https=)
WO (1) WO2024084762A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI899592B (zh) * 2022-10-19 2025-10-01 日商日立全球先端科技股份有限公司 電漿處理裝置
CN119835850B (zh) * 2025-03-18 2025-05-13 深空探测实验室(天都实验室) 一种磁膨胀腔结构高能离子束发生装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874706A (en) * 1996-09-26 1999-02-23 Tokyo Electron Limited Microwave plasma processing apparatus using a hybrid microwave having two different modes of oscillation or branched microwaves forming a concentric electric field
JP2012190899A (ja) * 2011-03-09 2012-10-04 Hitachi High-Technologies Corp プラズマ処理装置
US20160141151A1 (en) * 2014-11-17 2016-05-19 Hitachi High-Technologies Corporation Plasma processing apparatus
TW202141562A (zh) * 2020-04-27 2021-11-01 日商日立全球先端科技股份有限公司 電漿處理裝置
TW202143801A (zh) * 2020-04-30 2021-11-16 日商日立全球先端科技股份有限公司 電漿處理裝置
WO2022157883A1 (ja) * 2021-01-21 2022-07-28 株式会社日立ハイテク プラズマ処理装置

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JP3469987B2 (ja) 1996-04-01 2003-11-25 株式会社日立製作所 プラズマ処理装置
US2716221A (en) 1950-09-25 1955-08-23 Philip J Allen Rotatable dielectric slab phase-shifter for waveguide
JP2569019B2 (ja) * 1986-10-20 1997-01-08 株式会社日立製作所 エッチング方法及びその装置
US5359177A (en) * 1990-11-14 1994-10-25 Mitsubishi Denki Kabushiki Kaisha Microwave plasma apparatus for generating a uniform plasma
EP0502269A1 (en) 1991-03-06 1992-09-09 Hitachi, Ltd. Method of and system for microwave plasma treatments
US5230740A (en) 1991-12-17 1993-07-27 Crystallume Apparatus for controlling plasma size and position in plasma-activated chemical vapor deposition processes comprising rotating dielectric
DE4235914A1 (de) * 1992-10-23 1994-04-28 Juergen Prof Dr Engemann Vorrichtung zur Erzeugung von Mikrowellenplasmen
KR970071945A (ko) 1996-02-20 1997-11-07 가나이 쯔도무 플라즈마처리방법 및 장치
DE19802971C2 (de) * 1998-01-27 1999-12-02 Fraunhofer Ges Forschung Plasmareaktor
US6652709B1 (en) 1999-11-02 2003-11-25 Canon Kabushiki Kaisha Plasma processing apparatus having circular waveguide, and plasma processing method
JP4441038B2 (ja) 2000-02-07 2010-03-31 東京エレクトロン株式会社 マイクロ波プラズマ処理装置
US6677549B2 (en) 2000-07-24 2004-01-13 Canon Kabushiki Kaisha Plasma processing apparatus having permeable window covered with light shielding film
CN100573827C (zh) 2001-09-27 2009-12-23 东京毅力科创株式会社 电磁场供给装置及等离子体处理装置
JP2007035411A (ja) 2005-07-26 2007-02-08 Hitachi High-Technologies Corp プラズマ処理装置
JP2007035412A (ja) 2005-07-26 2007-02-08 Hitachi High-Technologies Corp プラズマ処理装置
EP2086285A1 (en) * 2008-02-01 2009-08-05 Anton Paar GmbH Applicator and Apparatus for heating samples by microwave radiation
JP2010050046A (ja) 2008-08-25 2010-03-04 Hitachi High-Technologies Corp プラズマ処理装置
JP2012044035A (ja) 2010-08-20 2012-03-01 Hitachi High-Technologies Corp 半導体製造装置
JP2012049353A (ja) * 2010-08-27 2012-03-08 Hitachi High-Technologies Corp プラズマ処理装置
JP5690603B2 (ja) * 2011-01-26 2015-03-25 株式会社日立ハイテクノロジーズ プラズマ処理装置
CN103262663B (zh) * 2011-04-28 2016-12-14 住友理工株式会社 微波等离子体生成装置和采用该装置的磁控溅射成膜装置
JP7001456B2 (ja) 2017-12-19 2022-01-19 株式会社日立ハイテク プラズマ処理装置
JP7184254B2 (ja) * 2018-12-06 2022-12-06 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
CN113454760B (zh) * 2020-01-27 2024-03-22 株式会社日立高新技术 等离子处理装置
KR102808893B1 (ko) * 2021-02-19 2025-05-19 주식회사 히타치하이테크 플라스마 처리 장치
TWI899592B (zh) * 2022-10-19 2025-10-01 日商日立全球先端科技股份有限公司 電漿處理裝置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5874706A (en) * 1996-09-26 1999-02-23 Tokyo Electron Limited Microwave plasma processing apparatus using a hybrid microwave having two different modes of oscillation or branched microwaves forming a concentric electric field
JP2012190899A (ja) * 2011-03-09 2012-10-04 Hitachi High-Technologies Corp プラズマ処理装置
US20160141151A1 (en) * 2014-11-17 2016-05-19 Hitachi High-Technologies Corporation Plasma processing apparatus
TW202141562A (zh) * 2020-04-27 2021-11-01 日商日立全球先端科技股份有限公司 電漿處理裝置
TW202143801A (zh) * 2020-04-30 2021-11-16 日商日立全球先端科技股份有限公司 電漿處理裝置
WO2022157883A1 (ja) * 2021-01-21 2022-07-28 株式会社日立ハイテク プラズマ処理装置

Also Published As

Publication number Publication date
WO2024084762A1 (ja) 2024-04-25
US20250246410A1 (en) 2025-07-31
TW202418344A (zh) 2024-05-01
KR102820386B1 (ko) 2025-06-16
JP7637315B2 (ja) 2025-02-27
KR20240055722A (ko) 2024-04-29
US12444575B2 (en) 2025-10-14
JPWO2024084762A1 (https=) 2024-04-25
CN118235528A (zh) 2024-06-21

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