JPWO2024084762A1 - - Google Patents
Info
- Publication number
- JPWO2024084762A1 JPWO2024084762A1 JP2024505020A JP2024505020A JPWO2024084762A1 JP WO2024084762 A1 JPWO2024084762 A1 JP WO2024084762A1 JP 2024505020 A JP2024505020 A JP 2024505020A JP 2024505020 A JP2024505020 A JP 2024505020A JP WO2024084762 A1 JPWO2024084762 A1 JP WO2024084762A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32229—Waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/32247—Resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32311—Circuits specially adapted for controlling the microwave discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022167445 | 2022-10-19 | ||
| JP2022167445 | 2022-10-19 | ||
| PCT/JP2023/026919 WO2024084762A1 (ja) | 2022-10-19 | 2023-07-24 | プラズマ処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024084762A1 true JPWO2024084762A1 (https=) | 2024-04-25 |
| JP7637315B2 JP7637315B2 (ja) | 2025-02-27 |
Family
ID=90737465
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024505020A Active JP7637315B2 (ja) | 2022-10-19 | 2023-07-24 | プラズマ処理装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12444575B2 (https=) |
| JP (1) | JP7637315B2 (https=) |
| KR (1) | KR102820386B1 (https=) |
| CN (1) | CN118235528A (https=) |
| TW (1) | TWI899592B (https=) |
| WO (1) | WO2024084762A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI899592B (zh) * | 2022-10-19 | 2025-10-01 | 日商日立全球先端科技股份有限公司 | 電漿處理裝置 |
| CN119835850B (zh) * | 2025-03-18 | 2025-05-13 | 深空探测实验室(天都实验室) | 一种磁膨胀腔结构高能离子束发生装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012190899A (ja) * | 2011-03-09 | 2012-10-04 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP7139528B2 (ja) * | 2020-04-27 | 2022-09-20 | 株式会社日立ハイテク | プラズマ処理装置 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3469987B2 (ja) | 1996-04-01 | 2003-11-25 | 株式会社日立製作所 | プラズマ処理装置 |
| US2716221A (en) | 1950-09-25 | 1955-08-23 | Philip J Allen | Rotatable dielectric slab phase-shifter for waveguide |
| JP2569019B2 (ja) * | 1986-10-20 | 1997-01-08 | 株式会社日立製作所 | エッチング方法及びその装置 |
| US5359177A (en) * | 1990-11-14 | 1994-10-25 | Mitsubishi Denki Kabushiki Kaisha | Microwave plasma apparatus for generating a uniform plasma |
| EP0502269A1 (en) | 1991-03-06 | 1992-09-09 | Hitachi, Ltd. | Method of and system for microwave plasma treatments |
| US5230740A (en) | 1991-12-17 | 1993-07-27 | Crystallume | Apparatus for controlling plasma size and position in plasma-activated chemical vapor deposition processes comprising rotating dielectric |
| DE4235914A1 (de) * | 1992-10-23 | 1994-04-28 | Juergen Prof Dr Engemann | Vorrichtung zur Erzeugung von Mikrowellenplasmen |
| KR970071945A (ko) | 1996-02-20 | 1997-11-07 | 가나이 쯔도무 | 플라즈마처리방법 및 장치 |
| US5874706A (en) * | 1996-09-26 | 1999-02-23 | Tokyo Electron Limited | Microwave plasma processing apparatus using a hybrid microwave having two different modes of oscillation or branched microwaves forming a concentric electric field |
| DE19802971C2 (de) * | 1998-01-27 | 1999-12-02 | Fraunhofer Ges Forschung | Plasmareaktor |
| US6652709B1 (en) | 1999-11-02 | 2003-11-25 | Canon Kabushiki Kaisha | Plasma processing apparatus having circular waveguide, and plasma processing method |
| JP4441038B2 (ja) | 2000-02-07 | 2010-03-31 | 東京エレクトロン株式会社 | マイクロ波プラズマ処理装置 |
| US6677549B2 (en) | 2000-07-24 | 2004-01-13 | Canon Kabushiki Kaisha | Plasma processing apparatus having permeable window covered with light shielding film |
| CN100573827C (zh) | 2001-09-27 | 2009-12-23 | 东京毅力科创株式会社 | 电磁场供给装置及等离子体处理装置 |
| JP2007035411A (ja) | 2005-07-26 | 2007-02-08 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP2007035412A (ja) | 2005-07-26 | 2007-02-08 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| EP2086285A1 (en) * | 2008-02-01 | 2009-08-05 | Anton Paar GmbH | Applicator and Apparatus for heating samples by microwave radiation |
| JP2010050046A (ja) | 2008-08-25 | 2010-03-04 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP2012044035A (ja) | 2010-08-20 | 2012-03-01 | Hitachi High-Technologies Corp | 半導体製造装置 |
| JP2012049353A (ja) * | 2010-08-27 | 2012-03-08 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP5690603B2 (ja) * | 2011-01-26 | 2015-03-25 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| CN103262663B (zh) * | 2011-04-28 | 2016-12-14 | 住友理工株式会社 | 微波等离子体生成装置和采用该装置的磁控溅射成膜装置 |
| JP6442242B2 (ja) * | 2014-11-17 | 2018-12-19 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
| JP7001456B2 (ja) | 2017-12-19 | 2022-01-19 | 株式会社日立ハイテク | プラズマ処理装置 |
| JP7184254B2 (ja) * | 2018-12-06 | 2022-12-06 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| CN113454760B (zh) * | 2020-01-27 | 2024-03-22 | 株式会社日立高新技术 | 等离子处理装置 |
| WO2021220459A1 (ja) * | 2020-04-30 | 2021-11-04 | 株式会社日立ハイテク | プラズマ処理装置 |
| JP7302094B2 (ja) * | 2021-01-21 | 2023-07-03 | 株式会社日立ハイテク | プラズマ処理装置 |
| KR102808893B1 (ko) * | 2021-02-19 | 2025-05-19 | 주식회사 히타치하이테크 | 플라스마 처리 장치 |
| TWI899592B (zh) * | 2022-10-19 | 2025-10-01 | 日商日立全球先端科技股份有限公司 | 電漿處理裝置 |
-
2023
- 2023-07-17 TW TW112126559A patent/TWI899592B/zh active
- 2023-07-24 CN CN202380013048.3A patent/CN118235528A/zh active Pending
- 2023-07-24 KR KR1020247002378A patent/KR102820386B1/ko active Active
- 2023-07-24 US US18/691,299 patent/US12444575B2/en active Active
- 2023-07-24 WO PCT/JP2023/026919 patent/WO2024084762A1/ja not_active Ceased
- 2023-07-24 JP JP2024505020A patent/JP7637315B2/ja active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012190899A (ja) * | 2011-03-09 | 2012-10-04 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP7139528B2 (ja) * | 2020-04-27 | 2022-09-20 | 株式会社日立ハイテク | プラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024084762A1 (ja) | 2024-04-25 |
| US20250246410A1 (en) | 2025-07-31 |
| TW202418344A (zh) | 2024-05-01 |
| KR102820386B1 (ko) | 2025-06-16 |
| JP7637315B2 (ja) | 2025-02-27 |
| KR20240055722A (ko) | 2024-04-29 |
| TWI899592B (zh) | 2025-10-01 |
| US12444575B2 (en) | 2025-10-14 |
| CN118235528A (zh) | 2024-06-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240126 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240806 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20241003 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241204 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250121 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250214 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7637315 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |