TWI895555B - 固化性矽酮組成物、密封材料及光半導體裝置 - Google Patents

固化性矽酮組成物、密封材料及光半導體裝置

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Publication number
TWI895555B
TWI895555B TW110143940A TW110143940A TWI895555B TW I895555 B TWI895555 B TW I895555B TW 110143940 A TW110143940 A TW 110143940A TW 110143940 A TW110143940 A TW 110143940A TW I895555 B TWI895555 B TW I895555B
Authority
TW
Taiwan
Prior art keywords
groups
curable silicone
organopolysiloxane
silicone composition
component
Prior art date
Application number
TW110143940A
Other languages
English (en)
Chinese (zh)
Other versions
TW202225329A (zh
Inventor
堀江沙瓦子
竹內香須美
竹內絢哉
姜賢智
小林昭彥
Original Assignee
日商杜邦東麗特殊材料股份有限公司
南韓商杜邦特用材料韓國股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商杜邦東麗特殊材料股份有限公司, 南韓商杜邦特用材料韓國股份有限公司 filed Critical 日商杜邦東麗特殊材料股份有限公司
Publication of TW202225329A publication Critical patent/TW202225329A/zh
Application granted granted Critical
Publication of TWI895555B publication Critical patent/TWI895555B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW110143940A 2020-12-28 2021-11-25 固化性矽酮組成物、密封材料及光半導體裝置 TWI895555B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020219285A JP7578279B2 (ja) 2020-12-28 2020-12-28 硬化性シリコーン組成物、封止材、及び光半導体装置
JP2020-219285 2020-12-28

Publications (2)

Publication Number Publication Date
TW202225329A TW202225329A (zh) 2022-07-01
TWI895555B true TWI895555B (zh) 2025-09-01

Family

ID=81972270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110143940A TWI895555B (zh) 2020-12-28 2021-11-25 固化性矽酮組成物、密封材料及光半導體裝置

Country Status (6)

Country Link
US (1) US12252616B2 (https=)
JP (1) JP7578279B2 (https=)
KR (1) KR102933338B1 (https=)
CN (1) CN114686159A (https=)
DE (1) DE102021214542A1 (https=)
TW (1) TWI895555B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230044439A1 (en) * 2019-12-27 2023-02-09 Dow Toray Co., Ltd. Multilayer body and electronic component formed of same
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR20240013993A (ko) * 2022-07-22 2024-01-31 삼성디스플레이 주식회사 표시 장치
EP4605485A1 (en) * 2022-10-21 2025-08-27 Wacker Chemie AG Semiconductor device, method of fabricating the same, and silicone-based resin composition contained therein

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201040229A (en) * 2009-03-04 2010-11-16 Shinetsu Chemical Co Composition for encapsulating optical semiconductor and optical semiconductor device using same
TW201815900A (zh) * 2016-05-02 2018-05-01 橫浜橡膠股份有限公司 密著賦予劑及硬化性樹脂組成物
CN108456426A (zh) * 2017-02-17 2018-08-28 信越化学工业株式会社 加成固化性有机硅树脂组合物和光学半导体器件的晶片连接材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5060074B2 (ja) 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP4865494B2 (ja) 2006-10-17 2012-02-01 清水建設株式会社 生分解性シート
JP5972512B2 (ja) 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
US8907380B1 (en) * 2013-06-28 2014-12-09 Korea Advanced Institute Of Science Radiation tolerant dummy gate-assisted n-MOSFET, and method and apparatus for modeling channel of semiconductor device
WO2015182143A1 (ja) * 2014-05-30 2015-12-03 東レ・ダウコーニング株式会社 有機ケイ素化合物、硬化性シリコーン組成物、および半導体装置
KR101980935B1 (ko) 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자
JP2020050714A (ja) * 2018-09-25 2020-04-02 横浜ゴム株式会社 オルガノポリシロキサン、シリコーン樹脂組成物及び光半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201040229A (en) * 2009-03-04 2010-11-16 Shinetsu Chemical Co Composition for encapsulating optical semiconductor and optical semiconductor device using same
TW201815900A (zh) * 2016-05-02 2018-05-01 橫浜橡膠股份有限公司 密著賦予劑及硬化性樹脂組成物
CN108456426A (zh) * 2017-02-17 2018-08-28 信越化学工业株式会社 加成固化性有机硅树脂组合物和光学半导体器件的晶片连接材料

Also Published As

Publication number Publication date
JP7578279B2 (ja) 2024-11-06
CN114686159A (zh) 2022-07-01
KR20220094127A (ko) 2022-07-05
US20220204771A1 (en) 2022-06-30
KR102933338B1 (ko) 2026-03-05
DE102021214542A1 (de) 2022-06-30
US12252616B2 (en) 2025-03-18
JP2022104216A (ja) 2022-07-08
TW202225329A (zh) 2022-07-01

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