JP7578279B2 - 硬化性シリコーン組成物、封止材、及び光半導体装置 - Google Patents

硬化性シリコーン組成物、封止材、及び光半導体装置 Download PDF

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JP7578279B2
JP7578279B2 JP2020219285A JP2020219285A JP7578279B2 JP 7578279 B2 JP7578279 B2 JP 7578279B2 JP 2020219285 A JP2020219285 A JP 2020219285A JP 2020219285 A JP2020219285 A JP 2020219285A JP 7578279 B2 JP7578279 B2 JP 7578279B2
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groups
component
organopolysiloxane
curable silicone
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JP2022104216A5 (https=
JP2022104216A (ja
Inventor
さわ子 堀江
香須美 竹内
絢哉 竹内
ヒョンジ・カン
昭彦 小林
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DuPont Specialty Materials Korea Ltd
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DuPont Specialty Materials Korea Ltd
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Priority to JP2020219285A priority Critical patent/JP7578279B2/ja
Priority to CN202111408488.8A priority patent/CN114686159A/zh
Priority to TW110143940A priority patent/TWI895555B/zh
Priority to KR1020210166830A priority patent/KR102933338B1/ko
Priority to US17/644,623 priority patent/US12252616B2/en
Priority to DE102021214542.6A priority patent/DE102021214542A1/de
Publication of JP2022104216A publication Critical patent/JP2022104216A/ja
Publication of JP2022104216A5 publication Critical patent/JP2022104216A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2020219285A 2020-12-28 2020-12-28 硬化性シリコーン組成物、封止材、及び光半導体装置 Active JP7578279B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020219285A JP7578279B2 (ja) 2020-12-28 2020-12-28 硬化性シリコーン組成物、封止材、及び光半導体装置
CN202111408488.8A CN114686159A (zh) 2020-12-28 2021-11-24 固化性硅酮组合物、密封材料及光半导体装置
TW110143940A TWI895555B (zh) 2020-12-28 2021-11-25 固化性矽酮組成物、密封材料及光半導體裝置
KR1020210166830A KR102933338B1 (ko) 2020-12-28 2021-11-29 경화성 실리콘 조성물, 봉지재, 및 광 반도체 장치
US17/644,623 US12252616B2 (en) 2020-12-28 2021-12-16 Curable silicone composition, encapsulant and optical semiconductor device
DE102021214542.6A DE102021214542A1 (de) 2020-12-28 2021-12-16 Aushärtbare Silikonzusammensetzung, Einkapselungsmittel und optische Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020219285A JP7578279B2 (ja) 2020-12-28 2020-12-28 硬化性シリコーン組成物、封止材、及び光半導体装置

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JP2022104216A JP2022104216A (ja) 2022-07-08
JP2022104216A5 JP2022104216A5 (https=) 2023-12-06
JP7578279B2 true JP7578279B2 (ja) 2024-11-06

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US (1) US12252616B2 (https=)
JP (1) JP7578279B2 (https=)
KR (1) KR102933338B1 (https=)
CN (1) CN114686159A (https=)
DE (1) DE102021214542A1 (https=)
TW (1) TWI895555B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230044439A1 (en) * 2019-12-27 2023-02-09 Dow Toray Co., Ltd. Multilayer body and electronic component formed of same
JP7818749B2 (ja) 2021-08-31 2026-02-24 Ｄｕｒｏｐｔｉｘマテリアル株式会社 硬化性シリコーン組成物、封止材、及び光半導体装置
KR20240013993A (ko) * 2022-07-22 2024-01-31 삼성디스플레이 주식회사 표시 장치
EP4605485A1 (en) * 2022-10-21 2025-08-27 Wacker Chemie AG Semiconductor device, method of fabricating the same, and silicone-based resin composition contained therein

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015182143A1 (ja) 2014-05-30 2015-12-03 東レ・ダウコーニング株式会社 有機ケイ素化合物、硬化性シリコーン組成物、および半導体装置
JP2017200962A (ja) 2016-05-02 2017-11-09 横浜ゴム株式会社 密着付与剤及び硬化性樹脂組成物
JP2018131583A (ja) 2017-02-17 2018-08-23 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
JP2020050714A (ja) 2018-09-25 2020-04-02 横浜ゴム株式会社 オルガノポリシロキサン、シリコーン樹脂組成物及び光半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5060074B2 (ja) 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP4865494B2 (ja) 2006-10-17 2012-02-01 清水建設株式会社 生分解性シート
JP5972512B2 (ja) 2008-06-18 2016-08-17 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物及び半導体装置
JP5499774B2 (ja) * 2009-03-04 2014-05-21 信越化学工業株式会社 光半導体封止用組成物及びそれを用いた光半導体装置
US8907380B1 (en) * 2013-06-28 2014-12-09 Korea Advanced Institute Of Science Radiation tolerant dummy gate-assisted n-MOSFET, and method and apparatus for modeling channel of semiconductor device
KR101980935B1 (ko) 2015-01-27 2019-05-21 주식회사 케이씨씨 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015182143A1 (ja) 2014-05-30 2015-12-03 東レ・ダウコーニング株式会社 有機ケイ素化合物、硬化性シリコーン組成物、および半導体装置
JP2017200962A (ja) 2016-05-02 2017-11-09 横浜ゴム株式会社 密着付与剤及び硬化性樹脂組成物
JP2018131583A (ja) 2017-02-17 2018-08-23 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
JP2020050714A (ja) 2018-09-25 2020-04-02 横浜ゴム株式会社 オルガノポリシロキサン、シリコーン樹脂組成物及び光半導体装置

Also Published As

Publication number Publication date
TWI895555B (zh) 2025-09-01
CN114686159A (zh) 2022-07-01
KR20220094127A (ko) 2022-07-05
US20220204771A1 (en) 2022-06-30
KR102933338B1 (ko) 2026-03-05
DE102021214542A1 (de) 2022-06-30
US12252616B2 (en) 2025-03-18
JP2022104216A (ja) 2022-07-08
TW202225329A (zh) 2022-07-01

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