JP2022104216A5 - - Google Patents
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- JP2022104216A5 JP2022104216A5 JP2020219285A JP2020219285A JP2022104216A5 JP 2022104216 A5 JP2022104216 A5 JP 2022104216A5 JP 2020219285 A JP2020219285 A JP 2020219285A JP 2020219285 A JP2020219285 A JP 2020219285A JP 2022104216 A5 JP2022104216 A5 JP 2022104216A5
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- 125000003700 epoxy group Chemical group 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020219285A JP7578279B2 (ja) | 2020-12-28 | 2020-12-28 | 硬化性シリコーン組成物、封止材、及び光半導体装置 |
| CN202111408488.8A CN114686159A (zh) | 2020-12-28 | 2021-11-24 | 固化性硅酮组合物、密封材料及光半导体装置 |
| TW110143940A TWI895555B (zh) | 2020-12-28 | 2021-11-25 | 固化性矽酮組成物、密封材料及光半導體裝置 |
| KR1020210166830A KR102933338B1 (ko) | 2020-12-28 | 2021-11-29 | 경화성 실리콘 조성물, 봉지재, 및 광 반도체 장치 |
| US17/644,623 US12252616B2 (en) | 2020-12-28 | 2021-12-16 | Curable silicone composition, encapsulant and optical semiconductor device |
| DE102021214542.6A DE102021214542A1 (de) | 2020-12-28 | 2021-12-16 | Aushärtbare Silikonzusammensetzung, Einkapselungsmittel und optische Halbleitervorrichtung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020219285A JP7578279B2 (ja) | 2020-12-28 | 2020-12-28 | 硬化性シリコーン組成物、封止材、及び光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022104216A JP2022104216A (ja) | 2022-07-08 |
| JP2022104216A5 true JP2022104216A5 (https=) | 2023-12-06 |
| JP7578279B2 JP7578279B2 (ja) | 2024-11-06 |
Family
ID=81972270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020219285A Active JP7578279B2 (ja) | 2020-12-28 | 2020-12-28 | 硬化性シリコーン組成物、封止材、及び光半導体装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12252616B2 (https=) |
| JP (1) | JP7578279B2 (https=) |
| KR (1) | KR102933338B1 (https=) |
| CN (1) | CN114686159A (https=) |
| DE (1) | DE102021214542A1 (https=) |
| TW (1) | TWI895555B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230044439A1 (en) * | 2019-12-27 | 2023-02-09 | Dow Toray Co., Ltd. | Multilayer body and electronic component formed of same |
| JP7818749B2 (ja) | 2021-08-31 | 2026-02-24 | Ｄｕｒｏｐｔｉｘマテリアル株式会社 | 硬化性シリコーン組成物、封止材、及び光半導体装置 |
| KR20240013993A (ko) * | 2022-07-22 | 2024-01-31 | 삼성디스플레이 주식회사 | 표시 장치 |
| EP4605485A1 (en) * | 2022-10-21 | 2025-08-27 | Wacker Chemie AG | Semiconductor device, method of fabricating the same, and silicone-based resin composition contained therein |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5060074B2 (ja) | 2006-05-11 | 2012-10-31 | 東レ・ダウコーニング株式会社 | 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置 |
| JP4865494B2 (ja) | 2006-10-17 | 2012-02-01 | 清水建設株式会社 | 生分解性シート |
| JP5972512B2 (ja) | 2008-06-18 | 2016-08-17 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
| JP5499774B2 (ja) * | 2009-03-04 | 2014-05-21 | 信越化学工業株式会社 | 光半導体封止用組成物及びそれを用いた光半導体装置 |
| US8907380B1 (en) * | 2013-06-28 | 2014-12-09 | Korea Advanced Institute Of Science | Radiation tolerant dummy gate-assisted n-MOSFET, and method and apparatus for modeling channel of semiconductor device |
| WO2015182143A1 (ja) * | 2014-05-30 | 2015-12-03 | 東レ・ダウコーニング株式会社 | 有機ケイ素化合物、硬化性シリコーン組成物、および半導体装置 |
| KR101980935B1 (ko) | 2015-01-27 | 2019-05-21 | 주식회사 케이씨씨 | 접착 촉진제, 이를 포함하는 조성물 및 상기 조성물을 이용한 광학 소자 |
| JP6575429B2 (ja) * | 2016-05-02 | 2019-09-18 | 横浜ゴム株式会社 | 密着付与剤及び硬化性樹脂組成物 |
| JP6702224B2 (ja) * | 2017-02-17 | 2020-05-27 | 信越化学工業株式会社 | 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材 |
| JP2020050714A (ja) * | 2018-09-25 | 2020-04-02 | 横浜ゴム株式会社 | オルガノポリシロキサン、シリコーン樹脂組成物及び光半導体装置 |
-
2020
- 2020-12-28 JP JP2020219285A patent/JP7578279B2/ja active Active
-
2021
- 2021-11-24 CN CN202111408488.8A patent/CN114686159A/zh active Pending
- 2021-11-25 TW TW110143940A patent/TWI895555B/zh active
- 2021-11-29 KR KR1020210166830A patent/KR102933338B1/ko active Active
- 2021-12-16 US US17/644,623 patent/US12252616B2/en active Active
- 2021-12-16 DE DE102021214542.6A patent/DE102021214542A1/de active Pending
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