TWI888519B - 樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置 - Google Patents

樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置 Download PDF

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TWI888519B
TWI888519B TW110111002A TW110111002A TWI888519B TW I888519 B TWI888519 B TW I888519B TW 110111002 A TW110111002 A TW 110111002A TW 110111002 A TW110111002 A TW 110111002A TW I888519 B TWI888519 B TW I888519B
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Taiwan
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resin composition
resin
mass
component
group
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TW110111002A
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TW202202575A (zh
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池平秀
阪內啓之
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日商味之素股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW110111002A 2020-03-31 2021-03-26 樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置 TWI888519B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-063137 2020-03-31
JP2020063137A JP7424167B2 (ja) 2020-03-31 2020-03-31 樹脂組成物、樹脂組成物の硬化物、樹脂シート、プリント配線板、半導体チップパッケージ及び半導体装置

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Publication Number Publication Date
TW202202575A TW202202575A (zh) 2022-01-16
TWI888519B true TWI888519B (zh) 2025-07-01

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TW110111002A TWI888519B (zh) 2020-03-31 2021-03-26 樹脂組成物、樹脂組成物之硬化物、樹脂薄片、印刷配線板、半導體晶片封裝及半導體裝置

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JP (2) JP7424167B2 (enExample)
KR (1) KR20210122174A (enExample)
CN (1) CN113462276B (enExample)
TW (1) TWI888519B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118076697A (zh) * 2021-10-14 2024-05-24 味之素株式会社 树脂组合物
KR20240137592A (ko) * 2022-02-03 2024-09-20 아지노모토 가부시키가이샤 수지 조성물
JP7521560B2 (ja) * 2022-08-02 2024-07-24 味の素株式会社 樹脂シート
JP2025123063A (ja) * 2024-02-09 2025-08-22 味の素株式会社 樹脂組成物
CN118599460B (zh) * 2024-08-07 2024-10-29 武汉市三选科技有限公司 一种晶片黏结薄膜、存储器芯片及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201522409A (zh) * 2008-11-28 2015-06-16 Ajinomoto Kk 樹脂組成物
TW201718691A (zh) * 2015-08-24 2017-06-01 信越化學工業股份有限公司 熱硬化性樹脂組成物
CN109456672A (zh) * 2017-09-06 2019-03-12 味之素株式会社 树脂组合物
TW201942246A (zh) * 2012-09-03 2019-11-01 日商味之素股份有限公司 熱硬化性環氧樹脂組成物、絕緣層形成用接著薄膜、絕緣層形成用預浸體、印刷配線板用絕緣體、多層印刷配線板及半導體裝置

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CN103764713B (zh) * 2011-08-31 2016-08-24 日立化成株式会社 树脂组合物、树脂片、带金属箔的树脂片、树脂固化物片、结构体、以及动力用或光源用半导体装置
JP5344022B2 (ja) * 2011-11-16 2013-11-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP6052868B2 (ja) * 2012-05-11 2016-12-27 エア・ウォーター株式会社 エポキシ樹脂の硬化剤、製法、およびその用途
TWI694109B (zh) * 2013-06-12 2020-05-21 日商味之素股份有限公司 樹脂組成物
JP6672616B2 (ja) * 2014-06-30 2020-03-25 味の素株式会社 樹脂組成物、接着フィルム、プリント配線板及び半導体装置
JP6766360B2 (ja) 2016-01-15 2020-10-14 住友ベークライト株式会社 樹脂組成物
JP7154732B2 (ja) * 2016-03-31 2022-10-18 味の素株式会社 樹脂組成物
JP2017179185A (ja) 2016-03-31 2017-10-05 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP6927717B2 (ja) 2016-03-31 2021-09-01 積水化学工業株式会社 絶縁材料及び電子部品
JP6891427B2 (ja) 2016-09-09 2021-06-18 住友ベークライト株式会社 樹脂シート
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
JP2018083893A (ja) 2016-11-24 2018-05-31 日立化成株式会社 封止材用固形樹脂組成物及びそれを用いた再配置ウエハー、半導体パッケージ、その製造方法
JP7067140B2 (ja) * 2017-03-29 2022-05-16 味の素株式会社 樹脂組成物
JP2019173009A (ja) 2018-03-28 2019-10-10 積水化学工業株式会社 硬化体、樹脂材料及び多層プリント配線板
JP7424743B2 (ja) * 2018-09-04 2024-01-30 味の素株式会社 樹脂組成物、樹脂インク、樹脂インク層、樹脂シート及び半導体チップパッケージ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201522409A (zh) * 2008-11-28 2015-06-16 Ajinomoto Kk 樹脂組成物
TW201942246A (zh) * 2012-09-03 2019-11-01 日商味之素股份有限公司 熱硬化性環氧樹脂組成物、絕緣層形成用接著薄膜、絕緣層形成用預浸體、印刷配線板用絕緣體、多層印刷配線板及半導體裝置
TW201718691A (zh) * 2015-08-24 2017-06-01 信越化學工業股份有限公司 熱硬化性樹脂組成物
CN109456672A (zh) * 2017-09-06 2019-03-12 味之素株式会社 树脂组合物

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KR20210122174A (ko) 2021-10-08
JP7647825B2 (ja) 2025-03-18
JP2023160985A (ja) 2023-11-02
CN113462276B (zh) 2024-06-21
CN113462276A (zh) 2021-10-01
JP2021161205A (ja) 2021-10-11
TW202202575A (zh) 2022-01-16
JP7424167B2 (ja) 2024-01-30

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