TWI885245B - 樹脂密封裝置以及樹脂密封方法 - Google Patents

樹脂密封裝置以及樹脂密封方法 Download PDF

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Publication number
TWI885245B
TWI885245B TW111107344A TW111107344A TWI885245B TW I885245 B TWI885245 B TW I885245B TW 111107344 A TW111107344 A TW 111107344A TW 111107344 A TW111107344 A TW 111107344A TW I885245 B TWI885245 B TW I885245B
Authority
TW
Taiwan
Prior art keywords
resin
mold
film
upper mold
cavity
Prior art date
Application number
TW111107344A
Other languages
English (en)
Chinese (zh)
Other versions
TW202249128A (zh
Inventor
田上秀作
柳澤誠
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW202249128A publication Critical patent/TW202249128A/zh
Application granted granted Critical
Publication of TWI885245B publication Critical patent/TWI885245B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW111107344A 2021-06-02 2022-03-01 樹脂密封裝置以及樹脂密封方法 TWI885245B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-092689 2021-06-02
JP2021092689A JP7553953B2 (ja) 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法

Publications (2)

Publication Number Publication Date
TW202249128A TW202249128A (zh) 2022-12-16
TWI885245B true TWI885245B (zh) 2025-06-01

Family

ID=84324077

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111107344A TWI885245B (zh) 2021-06-02 2022-03-01 樹脂密封裝置以及樹脂密封方法

Country Status (3)

Country Link
JP (1) JP7553953B2 (enExample)
TW (1) TWI885245B (enExample)
WO (1) WO2022254776A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831670B (zh) * 2023-04-12 2024-02-01 頎邦科技股份有限公司 散熱片的取放治具
JP2025032602A (ja) * 2023-08-28 2025-03-12 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005219297A (ja) * 2004-02-04 2005-08-18 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP5663785B2 (ja) * 2010-12-17 2015-02-04 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP5817044B2 (ja) * 2011-12-14 2015-11-18 アピックヤマダ株式会社 樹脂封止装置および樹脂封止方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740572B2 (ja) * 1986-11-14 1995-05-01 株式会社村田製作所 電子部品の樹脂外装方法
JP3378374B2 (ja) * 1993-09-14 2003-02-17 株式会社東芝 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2004146556A (ja) 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
JP2010092983A (ja) 2008-10-06 2010-04-22 Renesas Technology Corp 半導体装置およびその製造方法ならびに半導体製造装置
WO2016196189A1 (en) 2015-05-31 2016-12-08 Skyworks Solutions, Inc. Shielded module having compression overmold

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005219297A (ja) * 2004-02-04 2005-08-18 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP5663785B2 (ja) * 2010-12-17 2015-02-04 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP5817044B2 (ja) * 2011-12-14 2015-11-18 アピックヤマダ株式会社 樹脂封止装置および樹脂封止方法

Also Published As

Publication number Publication date
JP2022185184A (ja) 2022-12-14
TW202249128A (zh) 2022-12-16
JP7553953B2 (ja) 2024-09-19
WO2022254776A1 (ja) 2022-12-08

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