JP7553953B2 - 樹脂封止装置及び樹脂封止方法 - Google Patents

樹脂封止装置及び樹脂封止方法 Download PDF

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Publication number
JP7553953B2
JP7553953B2 JP2021092689A JP2021092689A JP7553953B2 JP 7553953 B2 JP7553953 B2 JP 7553953B2 JP 2021092689 A JP2021092689 A JP 2021092689A JP 2021092689 A JP2021092689 A JP 2021092689A JP 7553953 B2 JP7553953 B2 JP 7553953B2
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Japan
Prior art keywords
resin
pressing member
film
cavity
mold
Prior art date
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Active
Application number
JP2021092689A
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English (en)
Japanese (ja)
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JP2022185184A5 (enExample
JP2022185184A (ja
Inventor
秀作 田上
誠 柳澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
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Apic Yamada Corp
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Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2021092689A priority Critical patent/JP7553953B2/ja
Priority to PCT/JP2022/002512 priority patent/WO2022254776A1/ja
Priority to TW111107344A priority patent/TWI885245B/zh
Publication of JP2022185184A publication Critical patent/JP2022185184A/ja
Publication of JP2022185184A5 publication Critical patent/JP2022185184A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2021092689A 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法 Active JP7553953B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2021092689A JP7553953B2 (ja) 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法
PCT/JP2022/002512 WO2022254776A1 (ja) 2021-06-02 2022-01-25 樹脂封止装置及び樹脂封止方法
TW111107344A TWI885245B (zh) 2021-06-02 2022-03-01 樹脂密封裝置以及樹脂密封方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021092689A JP7553953B2 (ja) 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法

Publications (3)

Publication Number Publication Date
JP2022185184A JP2022185184A (ja) 2022-12-14
JP2022185184A5 JP2022185184A5 (enExample) 2023-06-14
JP7553953B2 true JP7553953B2 (ja) 2024-09-19

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JP2021092689A Active JP7553953B2 (ja) 2021-06-02 2021-06-02 樹脂封止装置及び樹脂封止方法

Country Status (3)

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JP (1) JP7553953B2 (enExample)
TW (1) TWI885245B (enExample)
WO (1) WO2022254776A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831670B (zh) * 2023-04-12 2024-02-01 頎邦科技股份有限公司 散熱片的取放治具
JP2025032602A (ja) * 2023-08-28 2025-03-12 アピックヤマダ株式会社 圧縮成形装置及び圧縮成形方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146556A (ja) 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
JP2010092983A (ja) 2008-10-06 2010-04-22 Renesas Technology Corp 半導体装置およびその製造方法ならびに半導体製造装置
US20180315717A1 (en) 2015-05-31 2018-11-01 Skyworks Solutions, Inc. Shielded module having compression overmold

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740572B2 (ja) * 1986-11-14 1995-05-01 株式会社村田製作所 電子部品の樹脂外装方法
JP3378374B2 (ja) * 1993-09-14 2003-02-17 株式会社東芝 樹脂封止型半導体装置の製造方法、樹脂封止型半導体装置及び封止用樹脂シート
JP2005219297A (ja) * 2004-02-04 2005-08-18 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP5663785B2 (ja) * 2010-12-17 2015-02-04 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP5817044B2 (ja) * 2011-12-14 2015-11-18 アピックヤマダ株式会社 樹脂封止装置および樹脂封止方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004146556A (ja) 2002-10-24 2004-05-20 Towa Corp 樹脂封止方法、樹脂封止装置、及び樹脂シート
JP2010092983A (ja) 2008-10-06 2010-04-22 Renesas Technology Corp 半導体装置およびその製造方法ならびに半導体製造装置
US20180315717A1 (en) 2015-05-31 2018-11-01 Skyworks Solutions, Inc. Shielded module having compression overmold

Also Published As

Publication number Publication date
TW202249128A (zh) 2022-12-16
WO2022254776A1 (ja) 2022-12-08
JP2022185184A (ja) 2022-12-14
TWI885245B (zh) 2025-06-01

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