TWI881957B - 密封劑、硬化體、有機電致發光顯示裝置、及裝置之製造方法 - Google Patents

密封劑、硬化體、有機電致發光顯示裝置、及裝置之製造方法 Download PDF

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Publication number
TWI881957B
TWI881957B TW109101593A TW109101593A TWI881957B TW I881957 B TWI881957 B TW I881957B TW 109101593 A TW109101593 A TW 109101593A TW 109101593 A TW109101593 A TW 109101593A TW I881957 B TWI881957 B TW I881957B
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TW
Taiwan
Prior art keywords
sealant
polymerizable monomer
mass
group
polymerizable
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TW109101593A
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English (en)
Chinese (zh)
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TW202035638A (zh
Inventor
石田泰則
栗村啓之
山下幸彦
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日商電化股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
    • C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/12—Esters of monohydric alcohols or phenols
    • C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/52—Amides or imides
    • C08F20/54—Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F20/56—Acrylamide; Methacrylamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Sealing Material Composition (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW109101593A 2019-01-17 2020-01-16 密封劑、硬化體、有機電致發光顯示裝置、及裝置之製造方法 TWI881957B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019005937 2019-01-17
JP2019-005937 2019-01-17

Publications (2)

Publication Number Publication Date
TW202035638A TW202035638A (zh) 2020-10-01
TWI881957B true TWI881957B (zh) 2025-05-01

Family

ID=71613334

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109101593A TWI881957B (zh) 2019-01-17 2020-01-16 密封劑、硬化體、有機電致發光顯示裝置、及裝置之製造方法

Country Status (5)

Country Link
JP (2) JP7197609B2 (enrdf_load_stackoverflow)
KR (1) KR102772994B1 (enrdf_load_stackoverflow)
CN (1) CN113227169B (enrdf_load_stackoverflow)
TW (1) TWI881957B (enrdf_load_stackoverflow)
WO (1) WO2020149384A1 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020196669A1 (ja) * 2019-03-27 2020-10-01 デンカ株式会社 組成物
KR20230090319A (ko) * 2020-10-20 2023-06-21 덴카 주식회사 밀봉제, 경화체, 유기 전계발광 표시장치 및 유기 전계발광 표시장치의 제조 방법
JP7136485B2 (ja) * 2020-10-30 2022-09-13 株式会社コバヤシ 光硬化性組成物
JP2023137002A (ja) * 2022-03-17 2023-09-29 日本ケミコン株式会社 封口体及び電解コンデンサ
JP2024001665A (ja) 2022-06-22 2024-01-10 株式会社トッパンＴｏｍｏｅｇａｗａオプティカルフィルム 光学フィルム、偏光板及び画像表示装置
JP2025126423A (ja) * 2024-02-19 2025-08-29 デンカ株式会社 組成物、硬化体、および、表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268072A (ja) * 2002-03-20 2003-09-25 Sakamoto Yakuhin Kogyo Co Ltd 活性エネルギー線硬化型エポキシ樹脂系固形組成物
JP2006265351A (ja) * 2005-03-23 2006-10-05 Asahi Kasei Corp 感光性組成物

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04253757A (ja) * 1991-02-04 1992-09-09 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料
JPH08109231A (ja) * 1994-10-13 1996-04-30 Nippon Kayaku Co Ltd モータ類回転子のバランス用活性エネルギー線硬化性樹脂組成物及びそれらを用いてバランス修正された回転子
JPH1074583A (ja) 1996-08-30 1998-03-17 Sanyo Electric Co Ltd 有機ｅｌディスプレイ及び有機ｅｌディスプレイの 製造方法
JP2001124903A (ja) 1999-10-26 2001-05-11 Seed Co Ltd 光硬化性樹脂製レンズ
JP2001307873A (ja) 2000-04-21 2001-11-02 Toppan Printing Co Ltd 有機エレクトロルミネッセンス表示素子およびその製造方法
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP2006291072A (ja) 2005-04-12 2006-10-26 Sekisui Chem Co Ltd 光硬化型樹脂組成物、有機エレクトロルミネッセンス素子用接着剤、有機エレクトロルミネッセンス表示素子、及び、有機エレクトロルミネッセンス表示素子の製造方法
JP2007128023A (ja) * 2005-10-06 2007-05-24 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP2009037812A (ja) 2007-07-31 2009-02-19 Sumitomo Chemical Co Ltd 有機ｅｌ装置およびその製造方法
JP2010163566A (ja) 2009-01-16 2010-07-29 Three M Innovative Properties Co エポキシ樹脂組成物
US8932952B2 (en) 2010-04-30 2015-01-13 Sumco Corporation Method for polishing silicon wafer and polishing liquid therefor
JP2013122903A (ja) * 2011-11-10 2013-06-20 Nitto Denko Corp 有機ｅｌデバイス、および、有機ｅｌデバイスの製造方法
JP5916220B2 (ja) * 2012-07-19 2016-05-11 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
SG10201706103VA (en) * 2012-07-26 2017-09-28 Denki Kagaku Kogyo Kk Resin composition
JP6519970B2 (ja) 2014-01-06 2019-05-29 セイコーエプソン株式会社 画像表示装置、プロジェクター及びその制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003268072A (ja) * 2002-03-20 2003-09-25 Sakamoto Yakuhin Kogyo Co Ltd 活性エネルギー線硬化型エポキシ樹脂系固形組成物
JP2006265351A (ja) * 2005-03-23 2006-10-05 Asahi Kasei Corp 感光性組成物

Also Published As

Publication number Publication date
JP7385722B2 (ja) 2023-11-22
JPWO2020149384A1 (ja) 2021-11-25
CN113227169A (zh) 2021-08-06
JP7197609B2 (ja) 2022-12-27
KR20210114412A (ko) 2021-09-23
KR102772994B1 (ko) 2025-02-27
TW202035638A (zh) 2020-10-01
JP2023022039A (ja) 2023-02-14
CN113227169B (zh) 2023-10-31
WO2020149384A1 (ja) 2020-07-23

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