TWI873282B - α線遮蔽膜形成用組成物、α線遮蔽膜、積層體、半導體裝置 - Google Patents

α線遮蔽膜形成用組成物、α線遮蔽膜、積層體、半導體裝置 Download PDF

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Publication number
TWI873282B
TWI873282B TW110103169A TW110103169A TWI873282B TW I873282 B TWI873282 B TW I873282B TW 110103169 A TW110103169 A TW 110103169A TW 110103169 A TW110103169 A TW 110103169A TW I873282 B TWI873282 B TW I873282B
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TW
Taiwan
Prior art keywords
ray shielding
shielding film
group
composition
mass
Prior art date
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TW110103169A
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English (en)
Chinese (zh)
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TW202136338A (zh
Inventor
横山憲文
荒山恭平
宮田哲志
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日商富士軟片股份有限公司
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Publication of TW202136338A publication Critical patent/TW202136338A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
TW110103169A 2020-01-30 2021-01-28 α線遮蔽膜形成用組成物、α線遮蔽膜、積層體、半導體裝置 TWI873282B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-013879 2020-01-30
JP2020013879 2020-01-30

Publications (2)

Publication Number Publication Date
TW202136338A TW202136338A (zh) 2021-10-01
TWI873282B true TWI873282B (zh) 2025-02-21

Family

ID=77079373

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110103169A TWI873282B (zh) 2020-01-30 2021-01-28 α線遮蔽膜形成用組成物、α線遮蔽膜、積層體、半導體裝置

Country Status (4)

Country Link
JP (1) JP7528127B2 (https=)
CN (1) CN115023475A (https=)
TW (1) TWI873282B (https=)
WO (1) WO2021153558A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201924031A (zh) * 2017-11-09 2019-06-16 日商富士軟片股份有限公司 裝置、有機層形成用組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6012744A (ja) * 1983-07-01 1985-01-23 Hitachi Ltd 半導体装置
JPS62108555A (ja) * 1985-11-06 1987-05-19 Hitachi Ltd 半導体装置
JPS6489450A (en) * 1987-09-30 1989-04-03 Hitachi Ltd Semiconductor device
JPH01266725A (ja) * 1988-04-18 1989-10-24 Hitachi Ltd 半導体素子の製造方法
JPH0211631A (ja) * 1988-06-30 1990-01-16 Nippon Steel Chem Co Ltd 半導体保護用樹脂及び半導体
JPH04285662A (ja) * 1991-03-14 1992-10-09 Hitachi Chem Co Ltd 耐熱樹脂ペーストおよびこれを用いたｉｃ
JPH07219225A (ja) * 1994-02-03 1995-08-18 Hitachi Ltd 感光性樹脂組成物
JP3462713B2 (ja) * 1996-06-17 2003-11-05 株式会社日立製作所 半導体装置、その製造方法および表面保護膜
JP3922318B2 (ja) * 1997-09-30 2007-05-30 日本ゼオン株式会社 難燃性樹脂組成物
JPH11217440A (ja) * 1998-02-05 1999-08-10 Hitachi Chem Co Ltd フルオロアルキル基含有ポリシロキサン、低誘電率樹脂組成物及び物品
JPWO2012153772A1 (ja) * 2011-05-09 2014-07-31 クラレリビング株式会社 放射線遮蔽材
CN108761612B (zh) * 2012-08-23 2021-04-06 Ａｇｃ株式会社 近红外线截止滤波器和固体摄像装置
WO2017018459A1 (ja) * 2015-07-29 2017-02-02 日立化成株式会社 接着剤組成物、硬化物、半導体装置及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201924031A (zh) * 2017-11-09 2019-06-16 日商富士軟片股份有限公司 裝置、有機層形成用組成物

Also Published As

Publication number Publication date
TW202136338A (zh) 2021-10-01
JP7528127B2 (ja) 2024-08-05
CN115023475A (zh) 2022-09-06
WO2021153558A1 (ja) 2021-08-05
JPWO2021153558A1 (https=) 2021-08-05

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