TWI869882B - 積層陶瓷電子零件 - Google Patents

積層陶瓷電子零件 Download PDF

Info

Publication number
TWI869882B
TWI869882B TW112121999A TW112121999A TWI869882B TW I869882 B TWI869882 B TW I869882B TW 112121999 A TW112121999 A TW 112121999A TW 112121999 A TW112121999 A TW 112121999A TW I869882 B TWI869882 B TW I869882B
Authority
TW
Taiwan
Prior art keywords
electrode layer
layer
face
layers
green
Prior art date
Application number
TW112121999A
Other languages
English (en)
Chinese (zh)
Other versions
TW202405837A (zh
Inventor
佐藤恒
Original Assignee
日商京瓷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商京瓷股份有限公司 filed Critical 日商京瓷股份有限公司
Publication of TW202405837A publication Critical patent/TW202405837A/zh
Application granted granted Critical
Publication of TWI869882B publication Critical patent/TWI869882B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/224Housing; Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
TW112121999A 2022-06-16 2023-06-13 積層陶瓷電子零件 TWI869882B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022097492 2022-06-16
JP2022-097492 2022-06-16

Publications (2)

Publication Number Publication Date
TW202405837A TW202405837A (zh) 2024-02-01
TWI869882B true TWI869882B (zh) 2025-01-11

Family

ID=89191049

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112121999A TWI869882B (zh) 2022-06-16 2023-06-13 積層陶瓷電子零件

Country Status (5)

Country Link
US (1) US20250329495A1 (https=)
JP (1) JPWO2023243504A1 (https=)
CN (1) CN119317986A (https=)
TW (1) TWI869882B (https=)
WO (1) WO2023243504A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119920625A (zh) * 2025-03-06 2025-05-02 广东风华高新科技股份有限公司 一种多层陶瓷电容器及制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093374A (ja) * 2011-10-24 2013-05-16 Murata Mfg Co Ltd 電子部品
JP2017017310A (ja) * 2015-06-26 2017-01-19 株式会社村田製作所 実装基板
JP2020057738A (ja) * 2018-10-04 2020-04-09 株式会社村田製作所 電子部品、回路基板、および電子部品の回路基板への実装方法
TW202109574A (zh) * 2019-01-28 2021-03-01 美商Avx公司 具有超寬頻效能的多層陶瓷電容器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01118424U (https=) * 1988-02-02 1989-08-10
JPH08316086A (ja) * 1995-05-19 1996-11-29 Murata Mfg Co Ltd 積層セラミック電子部品
JP4581194B2 (ja) * 2000-07-13 2010-11-17 パナソニック株式会社 チップ型電子部品
JP2007042743A (ja) * 2005-08-01 2007-02-15 Tdk Corp 積層電子部品
JP2013051392A (ja) * 2011-08-02 2013-03-14 Murata Mfg Co Ltd 積層セラミック電子部品
KR102089694B1 (ko) * 2014-04-30 2020-03-16 삼성전기주식회사 적층 세라믹 전자부품
KR102499465B1 (ko) * 2017-12-06 2023-02-14 삼성전기주식회사 적층형 커패시터
KR102191250B1 (ko) * 2018-10-10 2020-12-15 삼성전기주식회사 적층 세라믹 전자부품
KR102880989B1 (ko) * 2020-12-09 2025-11-04 삼성전기주식회사 적층형 전자 부품

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013093374A (ja) * 2011-10-24 2013-05-16 Murata Mfg Co Ltd 電子部品
JP2017017310A (ja) * 2015-06-26 2017-01-19 株式会社村田製作所 実装基板
JP2020057738A (ja) * 2018-10-04 2020-04-09 株式会社村田製作所 電子部品、回路基板、および電子部品の回路基板への実装方法
TW202109574A (zh) * 2019-01-28 2021-03-01 美商Avx公司 具有超寬頻效能的多層陶瓷電容器

Also Published As

Publication number Publication date
US20250329495A1 (en) 2025-10-23
CN119317986A (zh) 2025-01-14
JPWO2023243504A1 (https=) 2023-12-21
WO2023243504A1 (ja) 2023-12-21
TW202405837A (zh) 2024-02-01

Similar Documents

Publication Publication Date Title
CN103050278B (zh) 多层陶瓷电容器及其制备方法
JP7764674B2 (ja) キャパシタ部品
KR101971870B1 (ko) 전자부품의 제조 방법
US9974183B2 (en) Multilayer ceramic electronic component and board having the same
KR101107236B1 (ko) 세라믹 전자부품
EP2669915B1 (en) Laminated chip electronic component, board for mounting the same and packing unit
JP5304159B2 (ja) 積層セラミックコンデンサの製造方法
JP7696860B2 (ja) 積層セラミック電子部品およびその製造方法
US8971015B2 (en) Electronic component
JP2014187216A (ja) 積層セラミックコンデンサの製造方法
JP7196946B2 (ja) 積層セラミック電子部品の製造方法
CN103597563B (zh) 层叠陶瓷电子部件的制造方法
TWI869882B (zh) 積層陶瓷電子零件
JP2012009556A (ja) セラミック電子部品及びその製造方法
JP2000340448A (ja) 積層セラミックコンデンサ
KR20190121223A (ko) 커패시터 부품 및 그 제조 방법
JP7746404B2 (ja) 積層セラミック電子部品及びその製造方法
JP7602637B2 (ja) 積層セラミック電子部品およびその製造方法
US12106905B2 (en) Ceramic electronic component including bonding layer between body and sintered external electrode
JP7143907B2 (ja) 積層セラミック電子部品の製造方法
TWI869872B (zh) 積層陶瓷電子零件及積層陶瓷電子零件之製造方法
KR102946063B1 (ko) 적층형 전자 부품
US20260120955A1 (en) Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor
JP4661815B2 (ja) 電子部品の製造方法
KR20140013289A (ko) 세라믹 전자 부품 및 그 제조 방법