TWI864357B - 用於半導體構件用樹脂組合物之中空樹脂粒子 - Google Patents

用於半導體構件用樹脂組合物之中空樹脂粒子 Download PDF

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Publication number
TWI864357B
TWI864357B TW110147435A TW110147435A TWI864357B TW I864357 B TWI864357 B TW I864357B TW 110147435 A TW110147435 A TW 110147435A TW 110147435 A TW110147435 A TW 110147435A TW I864357 B TWI864357 B TW I864357B
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TW
Taiwan
Prior art keywords
resin particles
hollow resin
hollow
monomer
semiconductor components
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TW110147435A
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English (en)
Chinese (zh)
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TW202235153A (zh
Inventor
松浦春彦
岡本光一朗
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日商積水化成品工業股份有限公司
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Publication of TW202235153A publication Critical patent/TW202235153A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/12—Polymerisation in non-solvents
    • C08F2/16—Aqueous medium
    • C08F2/22—Emulsion polymerisation
    • C08F2/24—Emulsion polymerisation with the aid of emulsifying agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/285—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
    • C08F220/286—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW110147435A 2020-12-17 2021-12-17 用於半導體構件用樹脂組合物之中空樹脂粒子 TWI864357B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-209332 2020-12-17
JP2020209332A JP7503487B2 (ja) 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子

Publications (2)

Publication Number Publication Date
TW202235153A TW202235153A (zh) 2022-09-16
TWI864357B true TWI864357B (zh) 2024-12-01

Family

ID=82059080

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TW110147435A TWI864357B (zh) 2020-12-17 2021-12-17 用於半導體構件用樹脂組合物之中空樹脂粒子

Country Status (5)

Country Link
JP (1) JP7503487B2 (enExample)
KR (1) KR102886838B1 (enExample)
CN (1) CN116685611B (enExample)
TW (1) TWI864357B (enExample)
WO (1) WO2022130938A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062901A1 (ja) * 2023-09-19 2025-03-27 積水化成品工業株式会社 中空樹脂粒子、その用途、およびその製造方法
WO2025205284A1 (ja) * 2024-03-29 2025-10-02 積水化成品工業株式会社 中空樹脂粒子とその用途
JP7784595B1 (ja) * 2024-09-10 2025-12-11 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000311518A (ja) * 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JP2000313818A (ja) * 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP5401553B2 (ja) * 2009-09-29 2014-01-29 積水化成品工業株式会社 光拡散用単中空粒子
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
TW201843193A (zh) * 2017-03-30 2018-12-16 日商新日鐵住金化學股份有限公司 可溶性多官能乙烯基芳香族共聚合物、其製造方法、硬化性樹脂組成物及其硬化物、硬化性複合材料、硬化複合材料、積層體、帶有樹脂的金屬箔以及電路基板材料用清漆

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5824748A (en) * 1996-06-03 1998-10-20 Minnesota Mining And Manufacturing Company Composite pressure sensitive adhesive microspheres
JP4448930B2 (ja) 2000-09-04 2010-04-14 財団法人新産業創造研究機構 中空高分子微粒子及びその製造法
JP5576752B2 (ja) * 2009-09-29 2014-08-20 積水化成品工業株式会社 単中空粒子及びその製造方法
JP6231030B2 (ja) * 2014-09-30 2017-11-15 積水化成品工業株式会社 重合体粒子、重合体粒子の製造方法、及びその用途
JP6513273B1 (ja) 2018-08-31 2019-05-15 三井化学株式会社 樹脂粒子
EP4053180A4 (en) * 2019-10-29 2023-11-22 Sekisui Kasei Co., Ltd. HOLLOW RESIN PARTICLE AND PRODUCTION METHOD THEREFOR

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000313818A (ja) * 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2000311518A (ja) * 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JP5401553B2 (ja) * 2009-09-29 2014-01-29 積水化成品工業株式会社 光拡散用単中空粒子
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
TW201843193A (zh) * 2017-03-30 2018-12-16 日商新日鐵住金化學股份有限公司 可溶性多官能乙烯基芳香族共聚合物、其製造方法、硬化性樹脂組成物及其硬化物、硬化性複合材料、硬化複合材料、積層體、帶有樹脂的金屬箔以及電路基板材料用清漆

Also Published As

Publication number Publication date
WO2022130938A1 (ja) 2022-06-23
CN116685611B (zh) 2025-10-14
KR102886838B1 (ko) 2025-11-14
JP2022096298A (ja) 2022-06-29
CN116685611A (zh) 2023-09-01
JP7503487B2 (ja) 2024-06-20
TW202235153A (zh) 2022-09-16
KR20230096101A (ko) 2023-06-29

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