CN116685611B - 用于半导体构件用树脂组合物的中空树脂颗粒 - Google Patents

用于半导体构件用树脂组合物的中空树脂颗粒

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Publication number
CN116685611B
CN116685611B CN202180084299.1A CN202180084299A CN116685611B CN 116685611 B CN116685611 B CN 116685611B CN 202180084299 A CN202180084299 A CN 202180084299A CN 116685611 B CN116685611 B CN 116685611B
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China
Prior art keywords
hollow resin
resin particles
hollow
monomer
semiconductor member
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CN202180084299.1A
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English (en)
Chinese (zh)
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CN116685611A (zh
Inventor
松浦春彦
冈本光一朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Kasei Co Ltd
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Sekisui Plastics Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/12—Polymerisation in non-solvents
    • C08F2/16—Aqueous medium
    • C08F2/22—Emulsion polymerisation
    • C08F2/24—Emulsion polymerisation with the aid of emulsifying agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36—Divinylbenzene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/285—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
    • C08F220/286—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202180084299.1A 2020-12-17 2021-11-26 用于半导体构件用树脂组合物的中空树脂颗粒 Active CN116685611B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-209332 2020-12-17
JP2020209332A JP7503487B2 (ja) 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子
PCT/JP2021/043435 WO2022130938A1 (ja) 2020-12-17 2021-11-26 半導体部材用樹脂組成物に用いる中空樹脂粒子

Publications (2)

Publication Number Publication Date
CN116685611A CN116685611A (zh) 2023-09-01
CN116685611B true CN116685611B (zh) 2025-10-14

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CN202180084299.1A Active CN116685611B (zh) 2020-12-17 2021-11-26 用于半导体构件用树脂组合物的中空树脂颗粒

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Country Link
JP (1) JP7503487B2 (enExample)
KR (1) KR102886838B1 (enExample)
CN (1) CN116685611B (enExample)
TW (1) TWI864357B (enExample)
WO (1) WO2022130938A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062901A1 (ja) * 2023-09-19 2025-03-27 積水化成品工業株式会社 中空樹脂粒子、その用途、およびその製造方法
WO2025205284A1 (ja) * 2024-03-29 2025-10-02 積水化成品工業株式会社 中空樹脂粒子とその用途
JP7784595B1 (ja) * 2024-09-10 2025-12-11 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000311518A (ja) * 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JP2000313818A (ja) * 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
TW472070B (en) * 1996-06-03 2002-01-11 Minnesota Mining & Mfg Composite pressure sensitive adhesive microspheres
JP5401553B2 (ja) * 2009-09-29 2014-01-29 積水化成品工業株式会社 光拡散用単中空粒子
CN114630847A (zh) * 2019-10-29 2022-06-14 积水化成品工业株式会社 中空树脂颗粒及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4448930B2 (ja) 2000-09-04 2010-04-14 財団法人新産業創造研究機構 中空高分子微粒子及びその製造法
JP5576752B2 (ja) * 2009-09-29 2014-08-20 積水化成品工業株式会社 単中空粒子及びその製造方法
JP6231030B2 (ja) * 2014-09-30 2017-11-15 積水化成品工業株式会社 重合体粒子、重合体粒子の製造方法、及びその用途
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
CN110461891B (zh) * 2017-03-30 2022-08-30 日铁化学材料株式会社 可溶性多官能乙烯基芳香族共聚合物、其制造方法以及硬化性树脂组合物及其应用
JP6513273B1 (ja) 2018-08-31 2019-05-15 三井化学株式会社 樹脂粒子

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW472070B (en) * 1996-06-03 2002-01-11 Minnesota Mining & Mfg Composite pressure sensitive adhesive microspheres
JP2000313818A (ja) * 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2000311518A (ja) * 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JP5401553B2 (ja) * 2009-09-29 2014-01-29 積水化成品工業株式会社 光拡散用単中空粒子
CN114630847A (zh) * 2019-10-29 2022-06-14 积水化成品工业株式会社 中空树脂颗粒及其制造方法

Also Published As

Publication number Publication date
TWI864357B (zh) 2024-12-01
WO2022130938A1 (ja) 2022-06-23
KR102886838B1 (ko) 2025-11-14
JP2022096298A (ja) 2022-06-29
CN116685611A (zh) 2023-09-01
JP7503487B2 (ja) 2024-06-20
TW202235153A (zh) 2022-09-16
KR20230096101A (ko) 2023-06-29

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