JP7503487B2 - 半導体部材用樹脂組成物に用いる中空樹脂粒子 - Google Patents

半導体部材用樹脂組成物に用いる中空樹脂粒子 Download PDF

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JP7503487B2
JP7503487B2 JP2020209332A JP2020209332A JP7503487B2 JP 7503487 B2 JP7503487 B2 JP 7503487B2 JP 2020209332 A JP2020209332 A JP 2020209332A JP 2020209332 A JP2020209332 A JP 2020209332A JP 7503487 B2 JP7503487 B2 JP 7503487B2
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resin particles
hollow resin
hollow
monomer
weight
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JP2022096298A (ja
JP2022096298A5 (enExample
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春彦 松浦
光一朗 岡本
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Sekisui Kasei Co Ltd
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Sekisui Kasei Co Ltd
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Priority to JP2020209332A priority Critical patent/JP7503487B2/ja
Priority to CN202180084299.1A priority patent/CN116685611B/zh
Priority to KR1020237018450A priority patent/KR102886838B1/ko
Priority to PCT/JP2021/043435 priority patent/WO2022130938A1/ja
Priority to TW110147435A priority patent/TWI864357B/zh
Publication of JP2022096298A publication Critical patent/JP2022096298A/ja
Publication of JP2022096298A5 publication Critical patent/JP2022096298A5/ja
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/12Polymerisation in non-solvents
    • C08F2/16Aqueous medium
    • C08F2/22Emulsion polymerisation
    • C08F2/24Emulsion polymerisation with the aid of emulsifying agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/26Esters containing oxygen in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02Monomers containing only one unsaturated aliphatic radical
    • C08F212/04Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06Hydrocarbons
    • C08F212/08Styrene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36Divinylbenzene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/285Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety
    • C08F220/286Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing a polyether chain in the alcohol moiety and containing polyethylene oxide in the alcohol moiety, e.g. methoxy polyethylene glycol (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/062Polyethers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Graft Or Block Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2020209332A 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子 Active JP7503487B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020209332A JP7503487B2 (ja) 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子
CN202180084299.1A CN116685611B (zh) 2020-12-17 2021-11-26 用于半导体构件用树脂组合物的中空树脂颗粒
KR1020237018450A KR102886838B1 (ko) 2020-12-17 2021-11-26 반도체 부재용 수지 조성물에 사용되는 중공 수지 입자
PCT/JP2021/043435 WO2022130938A1 (ja) 2020-12-17 2021-11-26 半導体部材用樹脂組成物に用いる中空樹脂粒子
TW110147435A TWI864357B (zh) 2020-12-17 2021-12-17 用於半導體構件用樹脂組合物之中空樹脂粒子

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JP2020209332A JP7503487B2 (ja) 2020-12-17 2020-12-17 半導体部材用樹脂組成物に用いる中空樹脂粒子

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JP2022096298A JP2022096298A (ja) 2022-06-29
JP2022096298A5 JP2022096298A5 (enExample) 2023-07-07
JP7503487B2 true JP7503487B2 (ja) 2024-06-20

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JP (1) JP7503487B2 (enExample)
KR (1) KR102886838B1 (enExample)
CN (1) CN116685611B (enExample)
TW (1) TWI864357B (enExample)
WO (1) WO2022130938A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062901A1 (ja) * 2023-09-19 2025-03-27 積水化成品工業株式会社 中空樹脂粒子、その用途、およびその製造方法
WO2025205284A1 (ja) * 2024-03-29 2025-10-02 積水化成品工業株式会社 中空樹脂粒子とその用途
JP7784595B1 (ja) * 2024-09-10 2025-12-11 積水化成品工業株式会社 中空樹脂粒子、その製造方法、およびその用途

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000311518A (ja) 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
WO2011040376A1 (ja) 2009-09-29 2011-04-07 積水化成品工業株式会社 光拡散用単中空粒子
JP2011094124A (ja) 2009-09-29 2011-05-12 Sekisui Plastics Co Ltd 単中空粒子及びその製造方法
JP2016069619A (ja) 2014-09-30 2016-05-09 積水化成品工業株式会社 重合体粒子、重合体粒子の製造方法、及びその用途
WO2021085189A1 (ja) 2019-10-29 2021-05-06 積水化成品工業株式会社 中空樹脂粒子およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5824748A (en) * 1996-06-03 1998-10-20 Minnesota Mining And Manufacturing Company Composite pressure sensitive adhesive microspheres
JP4448930B2 (ja) 2000-09-04 2010-04-14 財団法人新産業創造研究機構 中空高分子微粒子及びその製造法
WO2018159080A1 (ja) * 2017-03-02 2018-09-07 パナソニックIpマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
CN110461891B (zh) * 2017-03-30 2022-08-30 日铁化学材料株式会社 可溶性多官能乙烯基芳香族共聚合物、其制造方法以及硬化性树脂组合物及其应用
JP6513273B1 (ja) 2018-08-31 2019-05-15 三井化学株式会社 樹脂粒子

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000313818A (ja) 1999-03-03 2000-11-14 Jsr Corp 架橋樹脂粒子、有機絶縁材用組成物、有機絶縁材、封止材、および回路基板
JP2000311518A (ja) 1999-04-28 2000-11-07 Jsr Corp 有機絶縁材用組成物、有機絶縁材、封止材および回路基板
WO2011040376A1 (ja) 2009-09-29 2011-04-07 積水化成品工業株式会社 光拡散用単中空粒子
JP2011094124A (ja) 2009-09-29 2011-05-12 Sekisui Plastics Co Ltd 単中空粒子及びその製造方法
JP2016069619A (ja) 2014-09-30 2016-05-09 積水化成品工業株式会社 重合体粒子、重合体粒子の製造方法、及びその用途
WO2021085189A1 (ja) 2019-10-29 2021-05-06 積水化成品工業株式会社 中空樹脂粒子およびその製造方法

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TWI864357B (zh) 2024-12-01
WO2022130938A1 (ja) 2022-06-23
CN116685611B (zh) 2025-10-14
KR102886838B1 (ko) 2025-11-14
JP2022096298A (ja) 2022-06-29
CN116685611A (zh) 2023-09-01
TW202235153A (zh) 2022-09-16
KR20230096101A (ko) 2023-06-29

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