TWI864328B - 組合物及其硬化體 - Google Patents

組合物及其硬化體 Download PDF

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Publication number
TWI864328B
TWI864328B TW110133805A TW110133805A TWI864328B TW I864328 B TWI864328 B TW I864328B TW 110133805 A TW110133805 A TW 110133805A TW 110133805 A TW110133805 A TW 110133805A TW I864328 B TWI864328 B TW I864328B
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Taiwan
Prior art keywords
composition
aromatic
mass
vinyl compound
less
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TW110133805A
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English (en)
Chinese (zh)
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TW202219151A (zh
Inventor
荒井亨
八木梓
大貫俊
山本翔太
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日商電化股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms
    • C08L23/0838—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms with monomers including an aromatic carbocyclic ring
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
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    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
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    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
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    • C08F2800/00—Copolymer characterised by the proportions of the comonomers expressed
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    • C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/003—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW110133805A 2020-09-11 2021-09-10 組合物及其硬化體 TWI864328B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020153333 2020-09-11
JP2020-153333 2020-09-11
JP2021096917 2021-06-09
JP2021-096917 2021-06-09

Publications (2)

Publication Number Publication Date
TW202219151A TW202219151A (zh) 2022-05-16
TWI864328B true TWI864328B (zh) 2024-12-01

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Country Status (7)

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US (1) US12359049B2 (https=)
EP (1) EP4212562B1 (https=)
JP (1) JP7428815B2 (https=)
KR (1) KR102890823B1 (https=)
CN (1) CN115667393A (https=)
TW (1) TWI864328B (https=)
WO (1) WO2022054885A1 (https=)

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Publication number Priority date Publication date Assignee Title
CN118599040A (zh) * 2020-07-15 2024-09-06 电化株式会社 组合物及固化体
CN117858798B (zh) * 2021-10-14 2024-12-17 电化株式会社 包含绝缘层的多层结构体
KR20240089572A (ko) * 2021-12-01 2024-06-20 아사히 가세이 가부시키가이샤 수지 섬유 시트, 프리프레그, 및 프리프레그의 제조 방법
KR20240099475A (ko) * 2022-01-19 2024-06-28 덴카 주식회사 공중합체, 조성물, 바니시 및 그 경화체
TWI895714B (zh) * 2022-03-28 2025-09-01 日商電化股份有限公司 組合物、硬化體、積層體、單層銅箔積層板、多層銅箔積層板、單層軟性銅箔積層板、多層軟性銅箔積層板基板及溶液
CN119343387A (zh) * 2022-07-11 2025-01-21 电化株式会社 清漆及其固化体
TWI835402B (zh) * 2022-11-11 2024-03-11 南亞塑膠工業股份有限公司 樹脂組成物
TWI818811B (zh) 2022-11-21 2023-10-11 南亞塑膠工業股份有限公司 樹脂組成物
CN120858123A (zh) * 2023-03-15 2025-10-28 电化株式会社 组合物及其固化体
WO2025028516A1 (ja) * 2023-08-02 2025-02-06 デンカ株式会社 未硬化シート及びその硬化体
JP2025167197A (ja) * 2024-04-25 2025-11-07 デンカ株式会社 樹脂組成物および複合材料セット
JP2025167199A (ja) * 2024-04-25 2025-11-07 デンカ株式会社 樹脂組成物および複合材料セット

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TW200724621A (en) * 2005-10-04 2007-07-01 Hitachi Chemical Co Ltd High stability varnish of a low dielectric loss tangent resin composition and wiring board material using thereof
JP2009161743A (ja) * 2007-12-10 2009-07-23 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた高周波用電気絶縁材料
JP2010280771A (ja) * 2009-06-03 2010-12-16 Denki Kagaku Kogyo Kk 後硬化性樹脂組成物及びそれを用いた電気絶縁材料

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JPS51124187A (en) 1975-04-23 1976-10-29 Nippon Telegr & Teleph Corp <Ntt> Preparation of polyethylene having low dielectric loss
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