TWI859665B - 可撓裝置用膜狀接著劑、可撓裝置用接著片、及可撓裝置之製造方法 - Google Patents

可撓裝置用膜狀接著劑、可撓裝置用接著片、及可撓裝置之製造方法 Download PDF

Info

Publication number
TWI859665B
TWI859665B TW111148003A TW111148003A TWI859665B TW I859665 B TWI859665 B TW I859665B TW 111148003 A TW111148003 A TW 111148003A TW 111148003 A TW111148003 A TW 111148003A TW I859665 B TWI859665 B TW I859665B
Authority
TW
Taiwan
Prior art keywords
film
flexible device
adhesive
film adhesive
mass
Prior art date
Application number
TW111148003A
Other languages
English (en)
Chinese (zh)
Other versions
TW202328386A (zh
Inventor
坂井小雪
Original Assignee
日商古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司
Publication of TW202328386A publication Critical patent/TW202328386A/zh
Application granted granted Critical
Publication of TWI859665B publication Critical patent/TWI859665B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW111148003A 2022-01-13 2022-12-14 可撓裝置用膜狀接著劑、可撓裝置用接著片、及可撓裝置之製造方法 TWI859665B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022003640 2022-01-13
JP2022-003640 2022-01-13

Publications (2)

Publication Number Publication Date
TW202328386A TW202328386A (zh) 2023-07-16
TWI859665B true TWI859665B (zh) 2024-10-21

Family

ID=87278885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111148003A TWI859665B (zh) 2022-01-13 2022-12-14 可撓裝置用膜狀接著劑、可撓裝置用接著片、及可撓裝置之製造方法

Country Status (5)

Country Link
JP (1) JP7445086B2 (https=)
KR (1) KR102846920B1 (https=)
CN (1) CN118139939A (https=)
TW (1) TWI859665B (https=)
WO (1) WO2023136018A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226796A (ja) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
TW200932861A (en) * 2007-10-18 2009-08-01 Hitachi Chemical Co Ltd Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body
JP2017110128A (ja) * 2015-12-17 2017-06-22 Dic株式会社 熱硬化性接着シート、物品及び物品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265960A (ja) * 1998-03-18 1999-09-28 Hitachi Chem Co Ltd 金属製補強材付き半導体装置
JP6615150B2 (ja) * 2017-05-01 2019-12-04 古河電気工業株式会社 接着フィルム、半導体ウェハ加工用テープ、半導体パッケージおよびその製造方法
TWI859255B (zh) 2019-06-14 2024-10-21 日商琳得科股份有限公司 裝置密封用黏著片

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002226796A (ja) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
TW200932861A (en) * 2007-10-18 2009-08-01 Hitachi Chemical Co Ltd Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body
JP2017110128A (ja) * 2015-12-17 2017-06-22 Dic株式会社 熱硬化性接着シート、物品及び物品の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
期刊 横山直樹 等6人 "ハロゲンフリー難燃性FPC接着剤用エポキシ／フェノキシ／シクロフェノキシホスファーゼン(CPP)混合硬化物のモルフォロジーと特性" 日本接着学会誌 45 巻 9 号 2009 p. 330-337. *

Also Published As

Publication number Publication date
KR102846920B1 (ko) 2025-08-20
KR20240121211A (ko) 2024-08-08
WO2023136018A1 (ja) 2023-07-20
CN118139939A (zh) 2024-06-04
JP7445086B2 (ja) 2024-03-06
TW202328386A (zh) 2023-07-16
JPWO2023136018A1 (https=) 2023-07-20

Similar Documents

Publication Publication Date Title
JP5435685B2 (ja) 封止用樹脂フィルム
CN101578344B (zh) 光波导用粘接剂组合物、使用其的光波导用粘接薄膜和光波导用粘附粘接片、以及使用它们的光学装置
TWI541312B (zh) 用於半導體裝置之黏合劑膜
TWI674972B (zh) 零件封裝用薄膜之製造方法
JP5180162B2 (ja) 電子部品封止用シート状エポキシ樹脂組成物およびそれにより得られた電子部品装置集合体ならびに電子部品装置
JP7188070B2 (ja) 放熱絶縁シートおよび該シート硬化物を絶縁層とする積層構造体
TWI787242B (zh) 樹脂組成物及樹脂薄片
JP7155245B2 (ja) ダイボンディングフィルム、ダイシングダイボンディングシート、及び半導体チップの製造方法
WO2017145624A1 (ja) 接着フィルム及びダイシング・ダイボンディングフィルム
JP7099453B2 (ja) 封止用フィルム、封止構造体及び封止構造体の製造方法
TWI859665B (zh) 可撓裝置用膜狀接著劑、可撓裝置用接著片、及可撓裝置之製造方法
TWI841538B (zh) 含硬化性接合材的積層體的製造方法
TWI847428B (zh) 可撓裝置用樹脂組成物、可撓裝置用膜狀接著劑、可撓裝置用接著片、及可撓裝置之製造方法
TWI867381B (zh) 可撓式裝置用基材/接著劑層一體型片材、及可撓式裝置之製造方法
KR102953880B1 (ko) 플렉시블 디바이스용 수지 조성물, 플렉시블 디바이스용 필름형 접착제, 플렉시블 디바이스용 접착 시트 및 플렉시블 디바이스의 제조 방법
WO2017078039A1 (ja) 熱硬化性樹脂フィルム、第１保護膜形成用シート及び第１保護膜の形成方法
WO2017061364A1 (ja) 熱硬化性樹脂フィルム及び第１保護膜形成用シート
TWI876401B (zh) 能量射線硬化型膜狀透明接著劑、含有其之裝置及該裝置之製造方法
TW202313804A (zh) 樹脂薄片