WO2023136018A1 - フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法 - Google Patents

フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法 Download PDF

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Publication number
WO2023136018A1
WO2023136018A1 PCT/JP2022/045722 JP2022045722W WO2023136018A1 WO 2023136018 A1 WO2023136018 A1 WO 2023136018A1 JP 2022045722 W JP2022045722 W JP 2022045722W WO 2023136018 A1 WO2023136018 A1 WO 2023136018A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
film
flexible
mass
flexible device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/045722
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English (en)
French (fr)
Japanese (ja)
Inventor
小雪 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2023516606A priority Critical patent/JP7445086B2/ja
Priority to KR1020247014080A priority patent/KR102846920B1/ko
Priority to CN202280071136.4A priority patent/CN118139939A/zh
Publication of WO2023136018A1 publication Critical patent/WO2023136018A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Definitions

  • a numerical range represented using “ ⁇ ” means a range including the numerical values described before and after " ⁇ " as lower and upper limits.
  • the storage modulus E' is determined as follows.
  • a film adhesive is laminated at 70° C. using a laminator to a thickness of 0.5 mm, and cured under conditions (i) or (ii) described below.
  • the obtained cured product sample is cut into a width of 5 mm to obtain a measurement sample.
  • a measurement sample is measured using a dynamic viscoelasticity measuring device RSAIII (manufactured by TA Instruments) under tension conditions with a chuck distance of 20 mm and a frequency of 10 Hz, a measurement temperature range of -40 ° C. to 250 ° C., and a heating rate of 5 ° C./
  • the temperature is raised under the condition of min, and the storage elastic modulus at 23°C is determined.
  • the term "storage elastic modulus” simply refers to the storage elastic modulus at room temperature (23°C).
  • the curing agent is preferably a photocationic polymerization initiator or a latent curing agent.
  • the film-like adhesive is energy ray-curable.
  • Energy rays include light rays such as ultraviolet rays, or ionizing radiation such as electron beams.
  • latent curing agents include dicyandiamide compounds, imidazole compounds, curing catalyst complex polyhydric phenol compounds, hydrazide compounds, boron trifluoride-amine complexes, amine imide compounds, polyamine salts, modified products thereof, and microcapsule-type products. can be mentioned. These may be used individually by 1 type, or may be used in combination of 2 or more type. It is more preferable to use an imidazole compound from the viewpoint of having better latent potential (property of exhibiting curability by heating and having excellent stability at room temperature) and faster curing speed.
  • the film adhesive of the present invention may contain an inorganic filler.
  • inorganic fillers include silica, clay, gypsum, calcium carbonate, barium sulfate, alumina (aluminum oxide), beryllium oxide, magnesium oxide, silicon carbide, silicon nitride, aluminum nitride, ceramics such as boron nitride, aluminum, copper , silver, gold, nickel, chromium, lead, tin, zinc, palladium, solder and other metals or alloys, carbon nanotubes, graphene and other carbons, and various inorganic powders.
  • Silane coupling agents include, for example, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropylmethyldimethoxysilane.
  • the film adhesive of the present invention is used at a temperature of 10° C. or less before use (before the curing reaction). preferably stored. Moreover, when the film-like adhesive of the present invention is of the energy ray-curable type, it is preferably stored in the dark before use. There is no particular limitation on the temperature conditions during the light-shielded storage, and it may be room temperature or refrigeration.
  • the thickness of the flexible base material is usually 1 to 1000 ⁇ m, preferably 5 to 800 ⁇ m, more preferably 5 to 400 ⁇ m, more preferably 5 to 200 ⁇ m, and more preferably 10 to 100 ⁇ m.
  • the thickness can be measured by a contact/linear gauge method (tabletop contact thickness measuring device).
  • the adhesive sheet of the present invention is produced by preparing a composition (varnish) by mixing each constituent component of the film-like adhesive of the present invention, and coating this composition on a flexible substrate. , can be dried and formed as desired.
  • room temperature means 23° C.
  • MEK is methyl ethyl ketone
  • PET is polyethylene terephthalate
  • UV ultraviolet light.
  • % and “parts” are based on mass unless otherwise specified.
  • Example 1 In a 1000 ml separable flask, 50 parts by mass of ST-3000 (trade name, hydrogenated bisphenol A liquid epoxy resin, manufactured by Nippon Steel Chemical & Materials Co., Ltd.) as a compound having a cyclic ether group, and YP-50 as a polymer component. (trade name, phenoxy resin, manufactured by Nippon Steel Chemical & Materials Co., Ltd.) 50 parts by mass and 30 parts by mass of MEK were heated and stirred at a temperature of 110° C. for 2 hours to obtain a resin varnish.
  • ST-3000 hydrogenated bisphenol A liquid epoxy resin, manufactured by Nippon Steel Chemical & Materials Co., Ltd.
  • YP-50 a polymer component
  • Example 3 A film adhesive with a release film was obtained in the same manner as in Example 1, except that the amount of the compound having a cyclic ether group was 35 parts by mass and the amount of the polymer component was 65 parts by mass.
  • Example 6 A film-like adhesive with a release film was obtained in the same manner as in Example 1, except that 2 parts by mass of 2E4MZ (trade name, imidazole-based thermosetting agent, manufactured by Shikoku Kasei Kogyo Co., Ltd.) was used as the curing agent.
  • 2E4MZ trade name, imidazole-based thermosetting agent, manufactured by Shikoku Kasei Kogyo Co., Ltd.
  • Example 11 25 parts by mass of ST-3000 (trade name, hydrogenated bisphenol A liquid epoxy resin, manufactured by Nippon Steel Chemical & Materials Co., Ltd.) and EPPN-501H (trade name, triphenylmethane type epoxy resin) as compounds having a cyclic ether group. , manufactured by Nippon Kayaku Co., Ltd.) was 25 parts by mass, and a film-like adhesive with a release film was obtained in the same manner as in Example 1, except that the thickness of the adhesive layer was 10 ⁇ m.
  • ST-3000 trade name, hydrogenated bisphenol A liquid epoxy resin, manufactured by Nippon Steel Chemical & Materials Co., Ltd.
  • EPPN-501H trade name, triphenylmethane type epoxy resin
  • Example 16 A film-like adhesive with a release film was obtained in the same manner as in Example 1, except that 50 parts by mass of BMI-5000 (trade name, bismaleimide resin, manufactured by Designer Molecules, Inc.) was used as the polymer component.
  • BMI-5000 trade name, bismaleimide resin, manufactured by Designer Molecules, Inc.
  • the polymer component is YX7200B35 (mixed solution of phenoxy resin and solvent, 143 parts by mass manufactured by Mitsubishi Chemical Corporation (50 parts by mass as phenoxy resin), and the curing agent is SI-B3 (trade name, thermal cationic polymerization initiator, Sanshin Chemical Kogyo Co., Ltd.) was 2 parts by mass, and a film-like adhesive with a release film was obtained in the same manner as in Example 1, except that the thickness of the adhesive layer was 15 ⁇ m.
  • Tg was defined as the temperature at which the maximum value of tan ⁇ was obtained, and when there were two or more maximum values, the temperature at which the maximum value was obtained on the lowest temperature side was taken as Tg. Table 1 shows the measurement results.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
PCT/JP2022/045722 2022-01-13 2022-12-12 フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法 Ceased WO2023136018A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2023516606A JP7445086B2 (ja) 2022-01-13 2022-12-12 フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法
KR1020247014080A KR102846920B1 (ko) 2022-01-13 2022-12-12 플렉시블 디바이스용 필름형 접착제, 플렉시블 디바이스용 접착 시트 및 플렉시블 디바이스의 제조 방법
CN202280071136.4A CN118139939A (zh) 2022-01-13 2022-12-12 柔性器件用膜状粘接剂、柔性器件用粘接片以及柔性器件的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022003640 2022-01-13
JP2022-003640 2022-01-13

Publications (1)

Publication Number Publication Date
WO2023136018A1 true WO2023136018A1 (ja) 2023-07-20

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PCT/JP2022/045722 Ceased WO2023136018A1 (ja) 2022-01-13 2022-12-12 フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法

Country Status (5)

Country Link
JP (1) JP7445086B2 (https=)
KR (1) KR102846920B1 (https=)
CN (1) CN118139939A (https=)
TW (1) TWI859665B (https=)
WO (1) WO2023136018A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265960A (ja) * 1998-03-18 1999-09-28 Hitachi Chem Co Ltd 金属製補強材付き半導体装置
JP2002226796A (ja) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
JP2017110128A (ja) * 2015-12-17 2017-06-22 Dic株式会社 熱硬化性接着シート、物品及び物品の製造方法
JP2018188540A (ja) * 2017-05-01 2018-11-29 古河電気工業株式会社 接着フィルム、半導体ウェハ加工用テープ、半導体パッケージおよびその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101130377B1 (ko) * 2007-10-18 2012-03-27 히다치 가세고교 가부시끼가이샤 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
TWI859255B (zh) 2019-06-14 2024-10-21 日商琳得科股份有限公司 裝置密封用黏著片

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11265960A (ja) * 1998-03-18 1999-09-28 Hitachi Chem Co Ltd 金属製補強材付き半導体装置
JP2002226796A (ja) * 2001-01-29 2002-08-14 Hitachi Chem Co Ltd ウェハ貼着用粘着シート及び半導体装置
JP2017110128A (ja) * 2015-12-17 2017-06-22 Dic株式会社 熱硬化性接着シート、物品及び物品の製造方法
JP2018188540A (ja) * 2017-05-01 2018-11-29 古河電気工業株式会社 接着フィルム、半導体ウェハ加工用テープ、半導体パッケージおよびその製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
YOKOYAMA NAOKI, OSAMU AMESAWA, KATSUYUKI AIDA, ,YUKIKO OGURA, KOJI NITTA,,SHINYA TAKAHASHI, TOMOYUKI KASEMURA: "Morphologies and Properties of Cured Epoxy/Phenoxy/Cycrophenoxyphosphazen (CPP) Blends as Adhesives for Flexible Printed Circuits (FPCs)", JOURNAL OF THE ADHESION SOCIETY OF JAPAN, vol. 45, no. 9, 1 January 2009 (2009-01-01), pages 330 - 337, XP093078793 *

Also Published As

Publication number Publication date
KR102846920B1 (ko) 2025-08-20
KR20240121211A (ko) 2024-08-08
CN118139939A (zh) 2024-06-04
JP7445086B2 (ja) 2024-03-06
TW202328386A (zh) 2023-07-16
TWI859665B (zh) 2024-10-21
JPWO2023136018A1 (https=) 2023-07-20

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