TWI853218B - 載台裝置、微影設備、及物品製造方法 - Google Patents

載台裝置、微影設備、及物品製造方法 Download PDF

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Publication number
TWI853218B
TWI853218B TW111106723A TW111106723A TWI853218B TW I853218 B TWI853218 B TW I853218B TW 111106723 A TW111106723 A TW 111106723A TW 111106723 A TW111106723 A TW 111106723A TW I853218 B TWI853218 B TW I853218B
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TW
Taiwan
Prior art keywords
stage
interferometer
scale
axis direction
laser
Prior art date
Application number
TW111106723A
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English (en)
Chinese (zh)
Other versions
TW202236028A (zh
Inventor
岩谷聡
Original Assignee
日商佳能股份有限公司
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Publication of TW202236028A publication Critical patent/TW202236028A/zh
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Publication of TWI853218B publication Critical patent/TWI853218B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02019—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different points on same face of object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02021—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different faces of object, e.g. opposite faces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02055—Reduction or prevention of errors; Testing; Calibration
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/12—Reflex reflectors
    • G02B5/122—Reflex reflectors cube corner, trihedral or triple reflector type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G02B5/1809—Diffraction gratings with pitch less than or comparable to the wavelength
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/15—Cat eye, i.e. reflection always parallel to incoming beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0891—Ultraviolet [UV] mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW111106723A 2021-03-05 2022-02-24 載台裝置、微影設備、及物品製造方法 TWI853218B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-035636 2021-03-05
JP2021035636A JP7625444B2 (ja) 2021-03-05 2021-03-05 ステージ装置、リソグラフィー装置および物品製造方法

Publications (2)

Publication Number Publication Date
TW202236028A TW202236028A (zh) 2022-09-16
TWI853218B true TWI853218B (zh) 2024-08-21

Family

ID=81326231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111106723A TWI853218B (zh) 2021-03-05 2022-02-24 載台裝置、微影設備、及物品製造方法

Country Status (6)

Country Link
US (1) US12386274B2 (https=)
EP (2) EP4273597A3 (https=)
JP (1) JP7625444B2 (https=)
KR (1) KR20220125681A (https=)
CN (1) CN115097697A (https=)
TW (1) TWI853218B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7625444B2 (ja) 2021-03-05 2025-02-03 キヤノン株式会社 ステージ装置、リソグラフィー装置および物品製造方法
TWI866681B (zh) * 2023-12-08 2024-12-11 均華精密工業股份有限公司 同向式多軸作業設備

Citations (4)

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US20050190375A1 (en) * 2004-02-27 2005-09-01 Canon Kabushiki Kaisha Stage apparatus and control method therefor
CN101356623A (zh) * 2006-01-19 2009-01-28 株式会社尼康 移动体驱动方法及移动体驱动系统、图案形成方法及图案形成装置、曝光方法及曝光装置、以及元件制造方法
US20120032067A1 (en) * 2010-06-09 2012-02-09 Nikon Corporation Two dimensional encoder system and method
US20140049782A1 (en) * 2010-03-30 2014-02-20 Zygo Corporation Interferometric encoder systems

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JPH07270122A (ja) * 1994-03-30 1995-10-20 Canon Inc 変位検出装置、該変位検出装置を備えた露光装置およびデバイスの製造方法
US5757160A (en) * 1996-12-23 1998-05-26 Svg Lithography Systems, Inc. Moving interferometer wafer stage
JP2004510129A (ja) * 2000-05-17 2004-04-02 ザイゴ　コーポレイション 干渉装置および干渉方法
TW527526B (en) 2000-08-24 2003-04-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
JP3762307B2 (ja) * 2001-02-15 2006-04-05 キヤノン株式会社 レーザ干渉干渉計システムを含む露光装置
EP1931947A2 (en) * 2005-09-21 2008-06-18 Koninklijke Philips Electronics N.V. System for detecting motion of a body
US7636165B2 (en) * 2006-03-21 2009-12-22 Asml Netherlands B.V. Displacement measurement systems lithographic apparatus and device manufacturing method
US8194232B2 (en) 2007-07-24 2012-06-05 Nikon Corporation Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, position control method and position control system, and device manufacturing method
WO2009098891A1 (ja) * 2008-02-08 2009-08-13 Nikon Corporation 位置計測システム及び位置計測方法、移動体装置、移動体駆動方法、露光装置及び露光方法、パターン形成装置、並びにデバイス製造方法
JP2009302490A (ja) * 2008-06-17 2009-12-24 Canon Inc 露光装置及びデバイス製造方法
JP2013101084A (ja) 2011-11-09 2013-05-23 Nikon Corp 位置検出方法及び装置、エンコーダ装置、並びに露光装置
JP2014086476A (ja) * 2012-10-22 2014-05-12 Canon Inc リソグラフィー装置、それを用いた物品の製造方法
JP6094313B2 (ja) * 2013-03-28 2017-03-15 株式会社ニコン エンコーダ、駆動装置、ステージ装置及び露光装置
EP3207339B1 (en) * 2014-10-13 2019-07-24 Zygo Corporation Interferometric encoder systems
JP7625444B2 (ja) 2021-03-05 2025-02-03 キヤノン株式会社 ステージ装置、リソグラフィー装置および物品製造方法

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Publication number Priority date Publication date Assignee Title
US20050190375A1 (en) * 2004-02-27 2005-09-01 Canon Kabushiki Kaisha Stage apparatus and control method therefor
CN101356623A (zh) * 2006-01-19 2009-01-28 株式会社尼康 移动体驱动方法及移动体驱动系统、图案形成方法及图案形成装置、曝光方法及曝光装置、以及元件制造方法
CN102566317A (zh) * 2006-01-19 2012-07-11 株式会社尼康 曝光方法、曝光装置及元件制造方法
US20140049782A1 (en) * 2010-03-30 2014-02-20 Zygo Corporation Interferometric encoder systems
US20120032067A1 (en) * 2010-06-09 2012-02-09 Nikon Corporation Two dimensional encoder system and method

Also Published As

Publication number Publication date
CN115097697A (zh) 2022-09-23
US12386274B2 (en) 2025-08-12
KR20220125681A (ko) 2022-09-14
EP4273597A3 (en) 2023-11-29
US20220283518A1 (en) 2022-09-08
JP7625444B2 (ja) 2025-02-03
EP4273597A2 (en) 2023-11-08
EP4053497A1 (en) 2022-09-07
TW202236028A (zh) 2022-09-16
JP2022135679A (ja) 2022-09-15
EP4053497B1 (en) 2023-09-20

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