TWI851809B - 柔性電子元件用覆金屬積層板及使用其的柔性電子元件 - Google Patents
柔性電子元件用覆金屬積層板及使用其的柔性電子元件 Download PDFInfo
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- TWI851809B TWI851809B TW109130838A TW109130838A TWI851809B TW I851809 B TWI851809 B TW I851809B TW 109130838 A TW109130838 A TW 109130838A TW 109130838 A TW109130838 A TW 109130838A TW I851809 B TWI851809 B TW I851809B
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
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- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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| TWI819440B (zh) * | 2021-12-21 | 2023-10-21 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
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| JP2011097007A (ja) * | 2009-09-30 | 2011-05-12 | Dainippon Printing Co Ltd | フレキシブルデバイス用基板、フレキシブルデバイス用薄膜トランジスタ基板およびフレキシブルデバイス |
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| TWI397136B (zh) * | 2006-01-12 | 2013-05-21 | 新日鐵住金化學股份有限公司 | Ｃｏｆ用積層板及ｃｏｆ薄膜載帶以及電子裝置 |
| JP2007245393A (ja) * | 2006-03-14 | 2007-09-27 | Toyobo Co Ltd | 金属樹脂積層体 |
| JP2008177502A (ja) * | 2007-01-22 | 2008-07-31 | Toyobo Co Ltd | フォールデッド型半導体装置 |
| JP2009241484A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Steel Chem Co Ltd | チップオンフィルム用フレキシブル金属張積層板及びその製造方法 |
| CN102576735B (zh) * | 2009-09-30 | 2016-01-20 | 大日本印刷株式会社 | 挠性装置用基板、挠性装置用薄膜晶体管基板、挠性装置、薄膜元件用基板、薄膜元件、薄膜晶体管、薄膜元件用基板的制造方法、薄膜元件的制造方法及薄膜晶体管的制造方法 |
| JP2011138683A (ja) * | 2009-12-28 | 2011-07-14 | Dainippon Printing Co Ltd | 電子素子 |
| JP5822641B2 (ja) | 2011-10-14 | 2015-11-24 | 新日鉄住金マテリアルズ株式会社 | 有機ｅｌ用被膜付きステンレス箔 |
| JP2016132744A (ja) * | 2015-01-21 | 2016-07-25 | 東レ・デュポン株式会社 | ポリイミドフィルム |
| JP6937557B2 (ja) * | 2015-09-30 | 2021-09-22 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルムの製造方法 |
| JP2017073345A (ja) | 2015-10-09 | 2017-04-13 | 新日鉄住金マテリアルズ株式会社 | 有機ｅｌ素子用積層体及びその製造方法 |
| JP6655938B2 (ja) * | 2015-10-09 | 2020-03-04 | 日鉄ケミカル＆マテリアル株式会社 | 有機ｅｌ素子用金属積層基板及びその製造方法 |
| JP7301495B2 (ja) * | 2017-03-30 | 2023-07-03 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP7212480B2 (ja) * | 2017-09-29 | 2023-01-25 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミドフィルム、金属張積層板及び回路基板 |
| JP2019119113A (ja) * | 2017-12-28 | 2019-07-22 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板及び回路基板 |
| JP6722332B2 (ja) | 2019-05-29 | 2020-07-15 | 日本電産株式会社 | モータ |
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