TWI849244B - 遮蔽電磁波用之糊料 - Google Patents

遮蔽電磁波用之糊料 Download PDF

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Publication number
TWI849244B
TWI849244B TW109135276A TW109135276A TWI849244B TW I849244 B TWI849244 B TW I849244B TW 109135276 A TW109135276 A TW 109135276A TW 109135276 A TW109135276 A TW 109135276A TW I849244 B TWI849244 B TW I849244B
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TW
Taiwan
Prior art keywords
paste
mass
resin
electromagnetic waves
shielding
Prior art date
Application number
TW109135276A
Other languages
English (en)
Chinese (zh)
Other versions
TW202124552A (zh
Inventor
橋本大佑
尤蘭達 卡波格里斯
Original Assignee
日商納美仕股份有限公司
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Application filed by 日商納美仕股份有限公司 filed Critical 日商納美仕股份有限公司
Publication of TW202124552A publication Critical patent/TW202124552A/zh
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Publication of TWI849244B publication Critical patent/TWI849244B/zh

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
TW109135276A 2019-10-17 2020-10-13 遮蔽電磁波用之糊料 TWI849244B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962916417P 2019-10-17 2019-10-17
US62/916,417 2019-10-17

Publications (2)

Publication Number Publication Date
TW202124552A TW202124552A (zh) 2021-07-01
TWI849244B true TWI849244B (zh) 2024-07-21

Family

ID=75537959

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109135276A TWI849244B (zh) 2019-10-17 2020-10-13 遮蔽電磁波用之糊料

Country Status (3)

Country Link
JP (1) JPWO2021075265A1 (enrdf_load_stackoverflow)
TW (1) TWI849244B (enrdf_load_stackoverflow)
WO (1) WO2021075265A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4137548A1 (en) 2021-08-18 2023-02-22 Henkel AG & Co. KGaA Emi shielding adhesive composition and its use
WO2024190477A1 (ja) * 2023-03-15 2024-09-19 日東電工株式会社 低分子量の(メタ)アクリル系重合体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102349364A (zh) * 2009-01-15 2012-02-08 3M创新有限公司 屏蔽电磁波的凝胶状组合物
CN108353523A (zh) * 2015-11-25 2018-07-31 株式会社巴川制纸所 匹配型电磁波吸收体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017216337A (ja) * 2016-05-31 2017-12-07 Jnc株式会社 電磁波抑制コーティング剤、電磁波抑制シート、電磁波シールド部品、電子機器
JP7000113B2 (ja) * 2017-10-24 2022-02-04 株式会社巴川製紙所 電磁波吸収体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102349364A (zh) * 2009-01-15 2012-02-08 3M创新有限公司 屏蔽电磁波的凝胶状组合物
CN108353523A (zh) * 2015-11-25 2018-07-31 株式会社巴川制纸所 匹配型电磁波吸收体

Also Published As

Publication number Publication date
WO2021075265A1 (ja) 2021-04-22
JPWO2021075265A1 (enrdf_load_stackoverflow) 2021-04-22
TW202124552A (zh) 2021-07-01

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