TWI843947B - 接著劑用組成物及膜狀接著劑、以及使用有膜狀接著劑之半導體封裝及其製造方法 - Google Patents

接著劑用組成物及膜狀接著劑、以及使用有膜狀接著劑之半導體封裝及其製造方法 Download PDF

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Publication number
TWI843947B
TWI843947B TW110118462A TW110118462A TWI843947B TW I843947 B TWI843947 B TW I843947B TW 110118462 A TW110118462 A TW 110118462A TW 110118462 A TW110118462 A TW 110118462A TW I843947 B TWI843947 B TW I843947B
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Taiwan
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adhesive
film
inorganic filler
phenoxy resin
epoxy resin
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TW110118462A
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English (en)
Chinese (zh)
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TW202204558A (zh
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森田稔
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日商古河電氣工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B80/00—Assemblies of multiple devices comprising at least one memory device covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/344—Dispositions of die-attach connectors, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
TW110118462A 2020-07-30 2021-05-21 接著劑用組成物及膜狀接著劑、以及使用有膜狀接著劑之半導體封裝及其製造方法 TWI843947B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-129493 2020-07-30
JP2020129493 2020-07-30

Publications (2)

Publication Number Publication Date
TW202204558A TW202204558A (zh) 2022-02-01
TWI843947B true TWI843947B (zh) 2024-06-01

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TW110118462A TWI843947B (zh) 2020-07-30 2021-05-21 接著劑用組成物及膜狀接著劑、以及使用有膜狀接著劑之半導體封裝及其製造方法

Country Status (7)

Country Link
US (1) US20230108567A1 (https=)
JP (1) JP7042986B1 (https=)
KR (1) KR102655890B1 (https=)
CN (1) CN115461423B (https=)
MY (1) MY202084A (https=)
TW (1) TWI843947B (https=)
WO (1) WO2022024510A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118696105A (zh) * 2022-03-30 2024-09-24 古河电气工业株式会社 导热性膜状粘接剂用组合物和导热性膜状粘接剂、以及使用导热性膜状粘接剂的半导体封装及其制造方法
JP2025011977A (ja) * 2023-07-12 2025-01-24 日東シンコー株式会社 セラミックシート及び半導体装置
WO2025204162A1 (ja) * 2024-03-26 2025-10-02 ナミックス株式会社 樹脂組成物、それを用いた熱硬化性フィルム、熱硬化性フィルムの硬化物、及び半導体装置

Citations (4)

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JP2008124141A (ja) * 2006-11-09 2008-05-29 Shin Etsu Chem Co Ltd ダイシング・ダイボンド用接着フィルム
CN104245874A (zh) * 2012-04-26 2014-12-24 古河电气工业株式会社 膜状接合剂用组合物及其制造方法、膜状接合剂和使用了膜状接合剂的半导体封装及其制造方法
TW201918536A (zh) * 2017-11-07 2019-05-16 日商古河電氣工業股份有限公司 薄膜狀接著劑、使用薄膜狀接著劑之半導體封裝體之製造方法
JP2020061423A (ja) * 2018-10-05 2020-04-16 日東電工株式会社 ダイシングダイボンドフィルム

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JPS5322609U (https=) 1976-08-05 1978-02-25
JP4421422B2 (ja) * 2004-08-20 2010-02-24 信越化学工業株式会社 ダイアタッチ可能な半導体チップの製造方法
JP2009167372A (ja) * 2008-01-21 2009-07-30 Sekisui Chem Co Ltd 電気部品用接着剤
JP2012049388A (ja) * 2010-08-27 2012-03-08 Shin Etsu Chem Co Ltd 半導体ウエハ保護膜形成用シート
KR101856557B1 (ko) * 2011-03-16 2018-05-10 후루카와 덴키 고교 가부시키가이샤 고열전도성 필름상 접착제용 조성물, 고열전도성 필름상 접착제, 및 그것을 사용한 반도체 패키지와 그 제조 방법
JP6624825B2 (ja) * 2014-09-25 2019-12-25 日東電工株式会社 熱剥離型粘着シート
JP6690356B2 (ja) * 2016-03-29 2020-04-28 味の素株式会社 熱硬化性樹脂組成物
JP6339619B2 (ja) * 2016-03-31 2018-06-06 古河電気工業株式会社 電子デバイスパッケージ用テープ
MY192601A (en) * 2016-03-31 2022-08-29 Furukawa Electric Co Ltd Tape for electronic device packaging
KR20180116756A (ko) * 2017-04-17 2018-10-25 닛토덴코 가부시키가이샤 다이싱 다이 본드 필름
JP7019333B2 (ja) * 2017-04-17 2022-02-15 日東電工株式会社 ダイシングダイボンドフィルム
JP6615150B2 (ja) * 2017-05-01 2019-12-04 古河電気工業株式会社 接着フィルム、半導体ウェハ加工用テープ、半導体パッケージおよびその製造方法
JP6889398B2 (ja) 2017-07-20 2021-06-18 昭和電工マテリアルズ株式会社 放熱性ダイボンディングフィルム及びダイシングダイボンディングフィルム
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JP2008124141A (ja) * 2006-11-09 2008-05-29 Shin Etsu Chem Co Ltd ダイシング・ダイボンド用接着フィルム
CN104245874A (zh) * 2012-04-26 2014-12-24 古河电气工业株式会社 膜状接合剂用组合物及其制造方法、膜状接合剂和使用了膜状接合剂的半导体封装及其制造方法
TW201918536A (zh) * 2017-11-07 2019-05-16 日商古河電氣工業股份有限公司 薄膜狀接著劑、使用薄膜狀接著劑之半導體封裝體之製造方法
JP2020061423A (ja) * 2018-10-05 2020-04-16 日東電工株式会社 ダイシングダイボンドフィルム

Also Published As

Publication number Publication date
KR102655890B1 (ko) 2024-04-11
CN115461423B (zh) 2024-07-05
US20230108567A1 (en) 2023-04-06
WO2022024510A1 (ja) 2022-02-03
JP7042986B1 (ja) 2022-03-28
KR20230046274A (ko) 2023-04-05
TW202204558A (zh) 2022-02-01
JPWO2022024510A1 (https=) 2022-02-03
CN115461423A (zh) 2022-12-09
MY202084A (en) 2024-04-03

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