TWI841850B - 檢查資料製作方法、檢查資料製作裝置及檢查裝置 - Google Patents

檢查資料製作方法、檢查資料製作裝置及檢查裝置 Download PDF

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Publication number
TWI841850B
TWI841850B TW110121908A TW110121908A TWI841850B TW I841850 B TWI841850 B TW I841850B TW 110121908 A TW110121908 A TW 110121908A TW 110121908 A TW110121908 A TW 110121908A TW I841850 B TWI841850 B TW I841850B
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TW
Taiwan
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TW110121908A
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English (en)
Chinese (zh)
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TW202220542A (zh
Inventor
水嶋孝智
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日商山葉發動機股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW110121908A 2020-07-02 2021-06-16 檢查資料製作方法、檢查資料製作裝置及檢查裝置 TWI841850B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2020/026087 2020-07-02
PCT/JP2020/026087 WO2022003919A1 (ja) 2020-07-02 2020-07-02 検査データ作成方法、検査データ作成装置および検査装置

Publications (2)

Publication Number Publication Date
TW202220542A TW202220542A (zh) 2022-05-16
TWI841850B true TWI841850B (zh) 2024-05-11

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TW110121908A TWI841850B (zh) 2020-07-02 2021-06-16 檢查資料製作方法、檢查資料製作裝置及檢查裝置

Country Status (3)

Country Link
JP (1) JP7448655B2 (https=)
TW (1) TWI841850B (https=)
WO (1) WO2022003919A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250117565A1 (en) * 2022-03-08 2025-04-10 Mitsubishi Electric Corporation Design assistance device, learning device and non-transitory computer readable storage medium
JP2025041398A (ja) * 2023-09-13 2025-03-26 株式会社東芝 情報処理装置及び情報処理方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW217483B (https=) * 1991-02-22 1993-12-11 Cyberoptics Corp
JP2004151057A (ja) * 2002-11-01 2004-05-27 Omron Corp 部品コード変換テーブルの登録方法、変換テーブル登録装置、部品コード変換テーブルの登録用プログラムおよび記憶媒体
JP2004340832A (ja) * 2003-05-16 2004-12-02 Matsushita Electric Ind Co Ltd 回路基板の外観検査方法及び回路基板の外観検査装置
JP2006250609A (ja) * 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd 回路実装基板の外観検査方法
JP2019100917A (ja) * 2017-12-05 2019-06-24 パナソニックＩｐマネジメント株式会社 検査プログラム生成システム、検査プログラムの生成方法、及び検査プログラムの生成用プログラム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788517B2 (ja) * 2006-07-28 2011-10-05 オムロン株式会社 基板外観検査用の検査基準データの設定方法およびこの方法を用いた基板外観検査装置
JP2015143951A (ja) * 2014-01-31 2015-08-06 オムロン株式会社 物体判別装置、画像センサ、物体判別方法
JP6792638B2 (ja) * 2016-12-09 2020-11-25 株式会社Ｆｕｊｉ 装着ジョブデータの作成方法および作成装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW217483B (https=) * 1991-02-22 1993-12-11 Cyberoptics Corp
JP2004151057A (ja) * 2002-11-01 2004-05-27 Omron Corp 部品コード変換テーブルの登録方法、変換テーブル登録装置、部品コード変換テーブルの登録用プログラムおよび記憶媒体
JP2004340832A (ja) * 2003-05-16 2004-12-02 Matsushita Electric Ind Co Ltd 回路基板の外観検査方法及び回路基板の外観検査装置
JP2006250609A (ja) * 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd 回路実装基板の外観検査方法
JP2019100917A (ja) * 2017-12-05 2019-06-24 パナソニックＩｐマネジメント株式会社 検査プログラム生成システム、検査プログラムの生成方法、及び検査プログラムの生成用プログラム

Also Published As

Publication number Publication date
JPWO2022003919A1 (https=) 2022-01-06
TW202220542A (zh) 2022-05-16
WO2022003919A1 (ja) 2022-01-06
JP7448655B2 (ja) 2024-03-12

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