JP7448655B2 - 検査データ作成方法、検査データ作成装置および検査装置 - Google Patents

検査データ作成方法、検査データ作成装置および検査装置 Download PDF

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JP7448655B2
JP7448655B2 JP2022532968A JP2022532968A JP7448655B2 JP 7448655 B2 JP7448655 B2 JP 7448655B2 JP 2022532968 A JP2022532968 A JP 2022532968A JP 2022532968 A JP2022532968 A JP 2022532968A JP 7448655 B2 JP7448655 B2 JP 7448655B2
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JPWO2022003919A5 (https=
JPWO2022003919A1 (https=
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孝智 水嶋
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022532968A 2020-07-02 2020-07-02 検査データ作成方法、検査データ作成装置および検査装置 Active JP7448655B2 (ja)

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PCT/JP2020/026087 WO2022003919A1 (ja) 2020-07-02 2020-07-02 検査データ作成方法、検査データ作成装置および検査装置

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JPWO2022003919A1 JPWO2022003919A1 (https=) 2022-01-06
JPWO2022003919A5 JPWO2022003919A5 (https=) 2023-01-04
JP7448655B2 true JP7448655B2 (ja) 2024-03-12

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JP (1) JP7448655B2 (https=)
TW (1) TWI841850B (https=)
WO (1) WO2022003919A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20250117565A1 (en) * 2022-03-08 2025-04-10 Mitsubishi Electric Corporation Design assistance device, learning device and non-transitory computer readable storage medium
JP2025041398A (ja) * 2023-09-13 2025-03-26 株式会社東芝 情報処理装置及び情報処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004340832A (ja) 2003-05-16 2004-12-02 Matsushita Electric Ind Co Ltd 回路基板の外観検査方法及び回路基板の外観検査装置
JP2006250609A (ja) 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd 回路実装基板の外観検査方法
JP2019100917A (ja) 2017-12-05 2019-06-24 パナソニックＩｐマネジメント株式会社 検査プログラム生成システム、検査プログラムの生成方法、及び検査プログラムの生成用プログラム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5278634A (en) * 1991-02-22 1994-01-11 Cyberoptics Corporation High precision component alignment sensor system
JP3906780B2 (ja) * 2002-11-01 2007-04-18 オムロン株式会社 部品コード変換テーブルに対するデータ登録方法、基板検査データの作成装置、登録処理用のプログラムおよびその記憶媒体
JP4788517B2 (ja) * 2006-07-28 2011-10-05 オムロン株式会社 基板外観検査用の検査基準データの設定方法およびこの方法を用いた基板外観検査装置
JP2015143951A (ja) * 2014-01-31 2015-08-06 オムロン株式会社 物体判別装置、画像センサ、物体判別方法
JP6792638B2 (ja) * 2016-12-09 2020-11-25 株式会社Ｆｕｊｉ 装着ジョブデータの作成方法および作成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004340832A (ja) 2003-05-16 2004-12-02 Matsushita Electric Ind Co Ltd 回路基板の外観検査方法及び回路基板の外観検査装置
JP2006250609A (ja) 2005-03-09 2006-09-21 Matsushita Electric Ind Co Ltd 回路実装基板の外観検査方法
JP2019100917A (ja) 2017-12-05 2019-06-24 パナソニックＩｐマネジメント株式会社 検査プログラム生成システム、検査プログラムの生成方法、及び検査プログラムの生成用プログラム

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TWI841850B (zh) 2024-05-11
JPWO2022003919A1 (https=) 2022-01-06
TW202220542A (zh) 2022-05-16
WO2022003919A1 (ja) 2022-01-06

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