JPWO2022003919A1 - - Google Patents
Info
- Publication number
- JPWO2022003919A1 JPWO2022003919A1 JP2022532968A JP2022532968A JPWO2022003919A1 JP WO2022003919 A1 JPWO2022003919 A1 JP WO2022003919A1 JP 2022532968 A JP2022532968 A JP 2022532968A JP 2022532968 A JP2022532968 A JP 2022532968A JP WO2022003919 A1 JPWO2022003919 A1 JP WO2022003919A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/026087 WO2022003919A1 (ja) | 2020-07-02 | 2020-07-02 | 検査データ作成方法、検査データ作成装置および検査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022003919A1 true JPWO2022003919A1 (https=) | 2022-01-06 |
| JPWO2022003919A5 JPWO2022003919A5 (https=) | 2023-01-04 |
| JP7448655B2 JP7448655B2 (ja) | 2024-03-12 |
Family
ID=79315842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022532968A Active JP7448655B2 (ja) | 2020-07-02 | 2020-07-02 | 検査データ作成方法、検査データ作成装置および検査装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7448655B2 (https=) |
| TW (1) | TWI841850B (https=) |
| WO (1) | WO2022003919A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250117565A1 (en) * | 2022-03-08 | 2025-04-10 | Mitsubishi Electric Corporation | Design assistance device, learning device and non-transitory computer readable storage medium |
| JP2025041398A (ja) * | 2023-09-13 | 2025-03-26 | 株式会社東芝 | 情報処理装置及び情報処理方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340832A (ja) * | 2003-05-16 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 回路基板の外観検査方法及び回路基板の外観検査装置 |
| JP2006250609A (ja) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | 回路実装基板の外観検査方法 |
| JP2019100917A (ja) * | 2017-12-05 | 2019-06-24 | パナソニックＩｐマネジメント株式会社 | 検査プログラム生成システム、検査プログラムの生成方法、及び検査プログラムの生成用プログラム |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5278634A (en) * | 1991-02-22 | 1994-01-11 | Cyberoptics Corporation | High precision component alignment sensor system |
| JP3906780B2 (ja) * | 2002-11-01 | 2007-04-18 | オムロン株式会社 | 部品コード変換テーブルに対するデータ登録方法、基板検査データの作成装置、登録処理用のプログラムおよびその記憶媒体 |
| JP4788517B2 (ja) * | 2006-07-28 | 2011-10-05 | オムロン株式会社 | 基板外観検査用の検査基準データの設定方法およびこの方法を用いた基板外観検査装置 |
| JP2015143951A (ja) * | 2014-01-31 | 2015-08-06 | オムロン株式会社 | 物体判別装置、画像センサ、物体判別方法 |
| JP6792638B2 (ja) * | 2016-12-09 | 2020-11-25 | 株式会社Ｆｕｊｉ | 装着ジョブデータの作成方法および作成装置 |
-
2020
- 2020-07-02 JP JP2022532968A patent/JP7448655B2/ja active Active
- 2020-07-02 WO PCT/JP2020/026087 patent/WO2022003919A1/ja not_active Ceased
-
2021
- 2021-06-16 TW TW110121908A patent/TWI841850B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004340832A (ja) * | 2003-05-16 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 回路基板の外観検査方法及び回路基板の外観検査装置 |
| JP2006250609A (ja) * | 2005-03-09 | 2006-09-21 | Matsushita Electric Ind Co Ltd | 回路実装基板の外観検査方法 |
| JP2019100917A (ja) * | 2017-12-05 | 2019-06-24 | パナソニックＩｐマネジメント株式会社 | 検査プログラム生成システム、検査プログラムの生成方法、及び検査プログラムの生成用プログラム |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI841850B (zh) | 2024-05-11 |
| TW202220542A (zh) | 2022-05-16 |
| WO2022003919A1 (ja) | 2022-01-06 |
| JP7448655B2 (ja) | 2024-03-12 |
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