TWI840341B - 用於基板支撐件的處理套組 - Google Patents
用於基板支撐件的處理套組 Download PDFInfo
- Publication number
- TWI840341B TWI840341B TW108101940A TW108101940A TWI840341B TW I840341 B TWI840341 B TW I840341B TW 108101940 A TW108101940 A TW 108101940A TW 108101940 A TW108101940 A TW 108101940A TW I840341 B TWI840341 B TW I840341B
- Authority
- TW
- Taiwan
- Prior art keywords
- edge ring
- upper edge
- substrate support
- lower edge
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
- H01J2237/3343—Problems associated with etching
- H01J2237/3344—Problems associated with etching isotropy
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862619473P | 2018-01-19 | 2018-01-19 | |
| US62/619,473 | 2018-01-19 | ||
| US16/249,716 | 2019-01-16 | ||
| US16/249,716 US11387134B2 (en) | 2018-01-19 | 2019-01-16 | Process kit for a substrate support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201941354A TW201941354A (zh) | 2019-10-16 |
| TWI840341B true TWI840341B (zh) | 2024-05-01 |
Family
ID=67300133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108101940A TWI840341B (zh) | 2018-01-19 | 2019-01-18 | 用於基板支撐件的處理套組 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11387134B2 (https=) |
| JP (1) | JP7382329B2 (https=) |
| KR (1) | KR102711327B1 (https=) |
| CN (1) | CN111587481B (https=) |
| TW (1) | TWI840341B (https=) |
| WO (1) | WO2019143858A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| CN118380372A (zh) | 2017-11-21 | 2024-07-23 | 朗姆研究公司 | 底部边缘环和中部边缘环 |
| CN118398464A (zh) | 2018-08-13 | 2024-07-26 | 朗姆研究公司 | 可更换和/或可折叠的用于等离子鞘调整的并入边缘环定位和定心功能的边缘环组件 |
| CN118431063A (zh) * | 2019-08-05 | 2024-08-02 | 朗姆研究公司 | 用于衬底处理系统的边缘环系统 |
| KR102077975B1 (ko) * | 2019-10-15 | 2020-02-14 | 주식회사 기가레인 | 플라즈마 처리 수직도가 향상된 플라즈마 처리 장치 |
| KR102905595B1 (ko) | 2020-03-23 | 2025-12-29 | 램 리써치 코포레이션 | 기판 프로세싱 시스템들에서의 중간-링 부식 보상 |
| US11380575B2 (en) * | 2020-07-27 | 2022-07-05 | Applied Materials, Inc. | Film thickness uniformity improvement using edge ring and bias electrode geometry |
| WO2022076227A1 (en) | 2020-10-05 | 2022-04-14 | Lam Research Corporation | Moveable edge rings for plasma processing systems |
| US20220108908A1 (en) * | 2020-10-06 | 2022-04-07 | Applied Materials, Inc. | Shadow ring kit for plasma etch wafer singulation process |
| CN120565385A (zh) | 2021-09-08 | 2025-08-29 | 北京屹唐半导体科技股份有限公司 | 用于清洁等离子体加工设备的聚焦环的导电构件 |
| CN217387074U (zh) * | 2021-12-03 | 2022-09-06 | 朗姆研究公司 | 用于衬底处理系统中增强屏蔽的宽覆盖边缘环 |
| CN120418925A (zh) * | 2022-12-20 | 2025-08-01 | 朗姆研究公司 | 用于控制衬底凹口附近的等离子体沉积或蚀刻的下等离子体排除区域环 |
| JP2024090654A (ja) * | 2022-12-23 | 2024-07-04 | 住友大阪セメント株式会社 | 静電チャック部材及び静電チャック装置 |
| JP7529008B2 (ja) * | 2022-12-23 | 2024-08-06 | 住友大阪セメント株式会社 | 静電チャック部材及び静電チャック装置 |
| US12412769B2 (en) | 2023-05-16 | 2025-09-09 | Applied Materials, Inc. | Electrostatic chucks with hybrid pucks to improve thermal performance and leakage current stability |
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| US8270141B2 (en) * | 2009-11-20 | 2012-09-18 | Applied Materials, Inc. | Electrostatic chuck with reduced arcing |
| US20150179412A1 (en) * | 2013-12-20 | 2015-06-25 | Lam Research Corporation | Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamber |
| US20160365228A1 (en) * | 2013-05-07 | 2016-12-15 | Lam Research Corporation | Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface |
| US20170287753A1 (en) * | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for aligning measurement device in substrate processing systems |
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| US11581167B2 (en) | 2021-06-18 | 2023-02-14 | Applied Materials, Inc. | Process kit having tall deposition ring and smaller diameter electrostatic chuck (ESC) for PVD chamber |
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-
2019
- 2019-01-16 US US16/249,716 patent/US11387134B2/en active Active
- 2019-01-17 CN CN201980008203.6A patent/CN111587481B/zh active Active
- 2019-01-17 WO PCT/US2019/014076 patent/WO2019143858A1/en not_active Ceased
- 2019-01-17 JP JP2020539696A patent/JP7382329B2/ja active Active
- 2019-01-17 KR KR1020207023788A patent/KR102711327B1/ko active Active
- 2019-01-18 TW TW108101940A patent/TWI840341B/zh active
-
2022
- 2022-07-11 US US29/845,733 patent/USD1115719S1/en active Active
- 2022-07-11 US US29/845,736 patent/USD1115720S1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090186487A1 (en) * | 2005-08-08 | 2009-07-23 | Lam Research Corporation | Edge ring assembly with dielectric spacer ring |
| US8270141B2 (en) * | 2009-11-20 | 2012-09-18 | Applied Materials, Inc. | Electrostatic chuck with reduced arcing |
| US20160365228A1 (en) * | 2013-05-07 | 2016-12-15 | Lam Research Corporation | Component of a plasma processing apparatus having a protective in situ formed layer on a plasma exposed surface |
| US20150179412A1 (en) * | 2013-12-20 | 2015-06-25 | Lam Research Corporation | Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamber |
| US20170287753A1 (en) * | 2016-03-29 | 2017-10-05 | Lam Research Corporation | Systems and methods for aligning measurement device in substrate processing systems |
Also Published As
| Publication number | Publication date |
|---|---|
| USD1115720S1 (en) | 2026-03-03 |
| JP7382329B2 (ja) | 2023-11-16 |
| US11387134B2 (en) | 2022-07-12 |
| TW201941354A (zh) | 2019-10-16 |
| KR20200101993A (ko) | 2020-08-28 |
| USD1115719S1 (en) | 2026-03-03 |
| WO2019143858A1 (en) | 2019-07-25 |
| CN111587481A (zh) | 2020-08-25 |
| CN111587481B (zh) | 2024-12-06 |
| US20190229007A1 (en) | 2019-07-25 |
| KR102711327B1 (ko) | 2024-09-26 |
| JP2021511663A (ja) | 2021-05-06 |
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