TWI839491B - 圖像顯示裝置之製造方法及圖像顯示裝置 - Google Patents
圖像顯示裝置之製造方法及圖像顯示裝置 Download PDFInfo
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- TWI839491B TWI839491B TW109109389A TW109109389A TWI839491B TW I839491 B TWI839491 B TW I839491B TW 109109389 A TW109109389 A TW 109109389A TW 109109389 A TW109109389 A TW 109109389A TW I839491 B TWI839491 B TW I839491B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/225—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier working in avalanche mode, e.g. avalanche photodiodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/833—Transparent materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
- H10H29/012—Manufacture or treatment of active-matrix LED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
- H10H29/036—Manufacture or treatment of packages
- H10H29/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/30—Active-matrix LED displays
- H10H29/39—Connection of the pixel electrodes to the driving transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/30—Active-matrix LED displays
- H10H29/41—Insulating layers formed between the driving transistors and the LEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
- H10H29/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
- H10H29/034—Manufacture or treatment of coatings
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019055382 | 2019-03-22 | ||
| JP2019-055382 | 2019-03-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202105710A TW202105710A (zh) | 2021-02-01 |
| TWI839491B true TWI839491B (zh) | 2024-04-21 |
Family
ID=72514662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109109389A TWI839491B (zh) | 2019-03-22 | 2020-03-20 | 圖像顯示裝置之製造方法及圖像顯示裝置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11476308B2 (https=) |
| EP (1) | EP3944343B1 (https=) |
| JP (2) | JP7507373B2 (https=) |
| KR (1) | KR102816943B1 (https=) |
| CN (1) | CN113439343A (https=) |
| TW (1) | TWI839491B (https=) |
| WO (1) | WO2020196271A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7647012B2 (ja) | 2020-06-18 | 2025-03-18 | 日亜化学工業株式会社 | 画像表示装置の製造方法および画像表示装置 |
| KR20220077207A (ko) * | 2020-11-30 | 2022-06-09 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| JP7782462B2 (ja) * | 2020-12-11 | 2025-12-09 | ソニーグループ株式会社 | 発光装置の製造方法 |
| US20230187591A1 (en) * | 2021-12-15 | 2023-06-15 | Meta Platforms Technologies, Llc | P-side-up micro-leds |
| TWI852561B (zh) * | 2023-05-17 | 2024-08-11 | 國立清華大學 | 全無機上轉換顯示器 |
| KR20250001025A (ko) | 2023-06-27 | 2025-01-06 | 삼성디스플레이 주식회사 | 화소 및 이를 구비하는 표시 장치 |
| TWI880562B (zh) * | 2023-12-29 | 2025-04-11 | 南韓商樂金顯示科技股份有限公司 | 顯示裝置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100197054A1 (en) * | 2007-10-04 | 2010-08-05 | Canon Kabushiki Kaisha | Method for manufacturing light emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002141492A (ja) | 2000-10-31 | 2002-05-17 | Canon Inc | 発光ダイオードディスプレイパネル及びその製造方法 |
| JP3681992B2 (ja) | 2001-06-13 | 2005-08-10 | 日本電信電話株式会社 | 半導体集積回路の製造方法 |
| JP4887587B2 (ja) | 2001-08-01 | 2012-02-29 | ソニー株式会社 | 画像表示装置及びその製造方法 |
| EP1488456B1 (en) | 2002-03-20 | 2013-01-16 | TPO Hong Kong Holding Limited | Active matrix display devices, and their manufacture |
| JP2004304161A (ja) | 2003-03-14 | 2004-10-28 | Sony Corp | 発光素子、発光装置、画像表示装置、発光素子の製造方法及び画像表示装置の製造方法 |
| JP4852322B2 (ja) * | 2006-03-03 | 2012-01-11 | ローム株式会社 | 窒化物半導体発光素子及びその製造方法 |
| JP2008147608A (ja) | 2006-10-27 | 2008-06-26 | Canon Inc | Ledアレイの製造方法とledアレイ、及びledプリンタ |
| JP4827698B2 (ja) | 2006-10-27 | 2011-11-30 | キヤノン株式会社 | 発光素子の形成方法 |
| WO2008155940A1 (ja) | 2007-06-20 | 2008-12-24 | Kyocera Corporation | 発光装置およびその製造方法ならびに画像形成装置 |
| US20090078963A1 (en) * | 2007-07-09 | 2009-03-26 | Salah Khodja | Nano-optoelectronic chip structure and method |
| US9431589B2 (en) * | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
| US9093356B2 (en) | 2010-12-28 | 2015-07-28 | Nichia Corporation | Semiconductor light emitting element |
| JP6007046B2 (ja) * | 2012-09-27 | 2016-10-12 | シャープ株式会社 | 表示装置 |
| TWI635330B (zh) * | 2014-01-14 | 2018-09-11 | 美國麻省理工學院 | 用於形成積體電路之方法及相關積體電路 |
| US9105813B1 (en) | 2014-05-30 | 2015-08-11 | Mikro Mesa Technology Co., Ltd. | Micro-light-emitting diode |
| CN105405943A (zh) | 2015-05-21 | 2016-03-16 | 美科米尚技术有限公司 | 微型发光二极管 |
| JP6245319B1 (ja) | 2016-06-30 | 2017-12-13 | 富士ゼロックス株式会社 | 発光部品、プリントヘッド、画像形成装置及び半導体積層基板 |
| US10157572B2 (en) * | 2016-11-01 | 2018-12-18 | Innolux Corporation | Pixel driver circuitry for a display device |
| TWI584491B (zh) * | 2016-11-03 | 2017-05-21 | 友達光電股份有限公司 | 發光裝置與其製作方法 |
| KR102605174B1 (ko) * | 2016-12-19 | 2023-11-22 | 엘지디스플레이 주식회사 | 발광 다이오드 디스플레이 장치 |
| KR102772357B1 (ko) | 2016-12-20 | 2025-02-21 | 엘지디스플레이 주식회사 | 발광 다이오드 칩 및 이를 포함하는 발광 다이오드 디스플레이 장치 |
| US10847553B2 (en) * | 2017-01-13 | 2020-11-24 | Massachusetts Institute Of Technology | Method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display |
| JP2018205456A (ja) | 2017-06-01 | 2018-12-27 | 株式会社ブイ・テクノロジー | フルカラーled表示パネル |
| US10522524B2 (en) | 2017-06-30 | 2019-12-31 | Lg Display Co., Ltd. | Display device and method for fabricating the same |
| KR101902566B1 (ko) | 2017-07-25 | 2018-09-28 | 엘지디스플레이 주식회사 | 발광 표시 장치 및 이의 제조 방법 |
| JP6798952B2 (ja) | 2017-08-31 | 2020-12-09 | 京セラ株式会社 | 半導体装置、発光装置および半導体装置の製造方法 |
| WO2019049360A1 (ja) | 2017-09-11 | 2019-03-14 | 凸版印刷株式会社 | 表示装置及び表示装置基板 |
| JP6975603B2 (ja) | 2017-09-27 | 2021-12-01 | 京セラ株式会社 | 発光装置 |
| JP6870592B2 (ja) * | 2017-11-24 | 2021-05-12 | 豊田合成株式会社 | 発光装置 |
| TWI688933B (zh) | 2018-07-16 | 2020-03-21 | 友達光電股份有限公司 | 顯示裝置 |
-
2020
- 2020-03-19 JP JP2021509314A patent/JP7507373B2/ja active Active
- 2020-03-19 EP EP20778215.2A patent/EP3944343B1/en active Active
- 2020-03-19 CN CN202080014086.7A patent/CN113439343A/zh active Pending
- 2020-03-19 KR KR1020217025067A patent/KR102816943B1/ko active Active
- 2020-03-19 WO PCT/JP2020/012313 patent/WO2020196271A1/ja not_active Ceased
- 2020-03-19 US US16/824,041 patent/US11476308B2/en active Active
- 2020-03-20 TW TW109109389A patent/TWI839491B/zh active
-
2022
- 2022-09-13 US US17/943,543 patent/US12527119B2/en active Active
-
2024
- 2024-04-05 JP JP2024061506A patent/JP7594231B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100197054A1 (en) * | 2007-10-04 | 2010-08-05 | Canon Kabushiki Kaisha | Method for manufacturing light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102816943B1 (ko) | 2025-06-04 |
| US11476308B2 (en) | 2022-10-18 |
| JP2024088732A (ja) | 2024-07-02 |
| EP3944343A4 (en) | 2022-12-07 |
| EP3944343A1 (en) | 2022-01-26 |
| JPWO2020196271A1 (https=) | 2020-10-01 |
| CN113439343A (zh) | 2021-09-24 |
| WO2020196271A1 (ja) | 2020-10-01 |
| JP7507373B2 (ja) | 2024-06-28 |
| KR20210143729A (ko) | 2021-11-29 |
| US12527119B2 (en) | 2026-01-13 |
| JP7594231B2 (ja) | 2024-12-04 |
| TW202105710A (zh) | 2021-02-01 |
| US20230006001A1 (en) | 2023-01-05 |
| US20200303471A1 (en) | 2020-09-24 |
| EP3944343B1 (en) | 2026-05-06 |
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