TWI836369B - 焊劑及電子裝置之製造方法 - Google Patents

焊劑及電子裝置之製造方法 Download PDF

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Publication number
TWI836369B
TWI836369B TW111108824A TW111108824A TWI836369B TW I836369 B TWI836369 B TW I836369B TW 111108824 A TW111108824 A TW 111108824A TW 111108824 A TW111108824 A TW 111108824A TW I836369 B TWI836369 B TW I836369B
Authority
TW
Taiwan
Prior art keywords
flux
solder
acid
organic solvent
substrate
Prior art date
Application number
TW111108824A
Other languages
English (en)
Chinese (zh)
Other versions
TW202241626A (zh
Inventor
須川靖久
山裕之
Original Assignee
日商千住金屬工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021201805A external-priority patent/JP7328311B2/ja
Application filed by 日商千住金屬工業股份有限公司 filed Critical 日商千住金屬工業股份有限公司
Publication of TW202241626A publication Critical patent/TW202241626A/zh
Application granted granted Critical
Publication of TWI836369B publication Critical patent/TWI836369B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/268—Pb as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C11/00—Alloys based on lead
    • C22C11/06—Alloys based on lead with tin as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW111108824A 2021-03-12 2022-03-10 焊劑及電子裝置之製造方法 TWI836369B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021-040416 2021-03-12
JP2021040415 2021-03-12
JP2021040416 2021-03-12
JP2021-040415 2021-03-12
JP2021-201805 2021-12-13
JP2021201805A JP7328311B2 (ja) 2021-03-12 2021-12-13 フラックスおよび電子デバイスの製造方法

Publications (2)

Publication Number Publication Date
TW202241626A TW202241626A (zh) 2022-11-01
TWI836369B true TWI836369B (zh) 2024-03-21

Family

ID=83226783

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108824A TWI836369B (zh) 2021-03-12 2022-03-10 焊劑及電子裝置之製造方法

Country Status (4)

Country Link
JP (1) JP2022184949A (ja)
KR (1) KR20230150882A (ja)
TW (1) TWI836369B (ja)
WO (1) WO2022191227A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04220192A (ja) * 1990-12-14 1992-08-11 Senju Metal Ind Co Ltd 低残渣はんだペースト
JPH08213746A (ja) * 1995-02-03 1996-08-20 Sony Corp フラツクス
TW299265B (ja) * 1995-06-19 1997-03-01 Chisumi Kinzoku Kogyo Kk
JP2001284787A (ja) * 2001-01-25 2001-10-12 Matsushita Electric Ind Co Ltd 半田ボールの搭載用フラックス
JP2016093816A (ja) * 2014-11-12 2016-05-26 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
JP2017035731A (ja) * 2015-08-10 2017-02-16 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003051668A (ja) 2001-08-06 2003-02-21 Tdk Corp 電子部品の製造方法と製造装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04220192A (ja) * 1990-12-14 1992-08-11 Senju Metal Ind Co Ltd 低残渣はんだペースト
JPH08213746A (ja) * 1995-02-03 1996-08-20 Sony Corp フラツクス
TW299265B (ja) * 1995-06-19 1997-03-01 Chisumi Kinzoku Kogyo Kk
JP2001284787A (ja) * 2001-01-25 2001-10-12 Matsushita Electric Ind Co Ltd 半田ボールの搭載用フラックス
JP2016093816A (ja) * 2014-11-12 2016-05-26 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
JP2017035731A (ja) * 2015-08-10 2017-02-16 荒川化学工業株式会社 鉛フリーはんだペースト用フラックス及び鉛フリーはんだペースト

Also Published As

Publication number Publication date
TW202241626A (zh) 2022-11-01
KR20230150882A (ko) 2023-10-31
WO2022191227A1 (ja) 2022-09-15
JP2022184949A (ja) 2022-12-13

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