TWI831873B - 基材黏接性良好的聚胺甲酸酯樹脂及使用此樹脂之黏接劑組成物 - Google Patents
基材黏接性良好的聚胺甲酸酯樹脂及使用此樹脂之黏接劑組成物 Download PDFInfo
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- TWI831873B TWI831873B TW108142675A TW108142675A TWI831873B TW I831873 B TWI831873 B TW I831873B TW 108142675 A TW108142675 A TW 108142675A TW 108142675 A TW108142675 A TW 108142675A TW I831873 B TWI831873 B TW I831873B
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- Prior art keywords
- mass
- diisocyanate
- polyurethane resin
- parts
- polycarbonate polyol
- Prior art date
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- 229920005749 polyurethane resin Polymers 0.000 title claims abstract description 48
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 21
- 239000000203 mixture Substances 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 title abstract description 12
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- 239000011347 resin Substances 0.000 title abstract description 5
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- 229920000515 polycarbonate Polymers 0.000 claims abstract description 47
- 229920005862 polyol Polymers 0.000 claims abstract description 35
- 150000003077 polyols Chemical class 0.000 claims abstract description 30
- 125000005442 diisocyanate group Chemical group 0.000 claims abstract description 22
- 239000004970 Chain extender Substances 0.000 claims abstract description 14
- 238000007334 copolymerization reaction Methods 0.000 claims abstract description 8
- 230000009477 glass transition Effects 0.000 claims abstract description 7
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- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 8
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 8
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 7
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
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- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 2
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- JQZRVMZHTADUSY-UHFFFAOYSA-L di(octanoyloxy)tin Chemical compound [Sn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O JQZRVMZHTADUSY-UHFFFAOYSA-L 0.000 description 1
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
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- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
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- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
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- 239000005056 polyisocyanate Substances 0.000 description 1
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- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
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- 238000010992 reflux Methods 0.000 description 1
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- 239000000600 sorbitol Substances 0.000 description 1
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- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/0847—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers
- C08G18/0852—Manufacture of polymers in the presence of non-reactive compounds in the presence of liquid diluents in the presence of solvents for the polymers the solvents being organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/44—Polycarbonates
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/6607—Compounds of groups C08G18/42, C08G18/48, or C08G18/52 with compounds of group C08G18/32 or polyamines of C08G18/38 with compounds of group C08G18/3203
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- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
-
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7628—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring containing at least one isocyanate or isothiocyanate group linked to the aromatic ring by means of an aliphatic group
- C08G18/7642—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring containing at least one isocyanate or isothiocyanate group linked to the aromatic ring by means of an aliphatic group containing at least two isocyanate or isothiocyanate groups linked to the aromatic ring by means of an aliphatic group having a primary carbon atom next to the isocyanate or isothiocyanate groups, e.g. xylylene diisocyanate or homologues substituted on the aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G18/8029—Masked aromatic polyisocyanates
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Abstract
本發明提供耐熱性優異且對各種基材之黏接性良好的聚胺甲酸酯樹脂、及使用該樹脂之黏接劑組成物。一種聚胺甲酸酯樹脂,其特徵為:含有作為共聚合成分之聚碳酸酯多元醇(A)、有機二異氰酸酯(B)、及鏈伸長劑(C);聚碳酸酯多元醇(A)中,含有60莫耳%以上之特定結構;且玻璃轉移溫度在50℃以上。
Description
本發明關於使用了具特定骨架之聚碳酸酯二醇及有機二異氰酸酯的對各種基材之黏接性良好的聚胺甲酸酯樹脂、及使用該樹脂之黏接劑組成物。
一直以來,聚胺甲酸酯樹脂已廣泛使用作為例如聚對苯二甲酸乙二酯薄膜、聚碳酸酯薄膜等基材之間的黏接劑。這是因為其可設計廣泛的物性、形態、硬化樣式,而且在耐藥品性等化學性質方面亦優異(專利文獻1)。
[先前技術文獻]
[專利文獻]
[專利文獻1]日本特開2013-245312號公報
[發明所欲解決之課題]
但,上述之黏接劑係藉由在構成成分中含有大量的直鏈脂肪族骨架,而使塗膜柔軟化、使反應性提升,然而因為該柔軟性而會產生因熱負荷、熱水處理等導致流出、分解從而造成密接性降低的問題。此外,會發揮密接性之基材係有限制,基材選擇性係成為問題。
本發明係為了解決上述習知技術的問題而成。亦即本發明關於耐熱性優異,且對各種基材之黏接性良好的聚胺甲酸酯樹脂,及使用該樹脂之黏接劑組成物。
[解決課題之手段]
本案發明人們針對上述要因進行了各種研究之後,發現使用有以具有特定骨架之聚碳酸酯二醇作為主原料之聚胺甲酸酯樹脂的黏接劑組成物,對各種基材之黏接性及耐熱性優異而完成本發明。亦即,本發明由以下構成所構成。
一種聚胺甲酸酯樹脂,其特徵為:含有作為共聚合成分之聚碳酸酯多元醇(A)、有機二異氰酸酯(B)、及鏈伸長劑(C);聚碳酸酯多元醇(A)中含有60莫耳%以上之下述通式(1)表示之結構;且玻璃轉移溫度在50℃以上。
[化1]
(通式(1)中,n表示1~20之整數。)
該有機二異氰酸酯(B)宜為異佛酮二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯、或六亞基二異氰酸酯,該鏈伸長劑(C)宜為碳數7以下的二元醇化合物。
含有上述聚胺甲酸酯樹脂及交聯劑之黏接劑組成物。
[發明之效果]
本發明之聚胺甲酸酯樹脂、及其黏接劑組成物對各種基材係黏接性優異,耐熱性、流出性亦優異,因此適於網版印墨用之黏結劑、裝飾成形用之黏結劑等。
本發明之聚胺甲酸酯樹脂含有作為共聚合成分之聚碳酸酯多元醇(A)、有機二異氰酸酯(B)、及鏈伸長劑(C)。
<聚碳酸酯多元醇(A)>
本發明中使用之聚碳酸酯多元醇(A)必須包含以下述通式(1)表示之結構。關於含量,當聚碳酸酯多元醇(A)整體作為100莫耳%時,須含有60莫耳%以上之通式(1)表示之結構,宜為70莫耳%以上,更宜為75莫耳%以上,更甚宜為80莫耳%以上,又更甚宜為90莫耳%以上,特宜為95莫耳%以上,100莫耳%亦可。藉由含有通式(1)表示之結構,可賦予聚胺甲酸酯樹脂柔軟性,並可展現優異的黏接性及耐熱性。
[化1]
通式(1)中,n表示1~20之整數。n宜為2以上,更宜為3以上,更甚宜為5以上。又,宜為18以下,更宜為15以下,更甚宜為10以下。若落在該範圍內,所得之聚胺甲酸酯樹脂的凝聚力提高,可展現優異的黏接性及耐熱性。
就含有以通式(1)表示之結構之聚碳酸酯多元醇以外的聚碳酸酯多元醇(A)而言,可使用脂肪族聚碳酸酯多元醇、脂環族聚碳酸酯多元醇、或芳香族聚碳酸酯多元醇。這些聚碳酸酯多元醇在以聚碳酸酯多元醇(A)整體作為100莫耳%時,宜為40莫耳%以下,更宜為30莫耳%以下,更甚宜為20莫耳%以下,又更甚宜為10莫耳%以下,特宜為5莫耳%以下,0莫耳%亦可。
就脂肪族聚碳酸酯多元醇而言,並無特別限定,可使用藉由丁二醇、戊二醇、己二醇、聚己內酯、聚四氫呋喃、丙二醇、新戊二醇等直鏈或分支的脂肪族二元醇與碳酸二酯等之反應所得的聚碳酸酯二醇。就脂環族聚碳酸酯多元醇而言,並無特別限定,可使用藉由異山梨醇等之脂環族二元醇與碳酸二酯等之反應所得的聚碳酸酯二醇。就芳香族聚碳酸酯二醇而言,並無特別限定,可使用藉由苯二甲醇、萘二甲醇等之芳香族二元醇與碳酸二酯等之反應所得的聚碳酸酯二醇。可使用由上述二元醇之中一種或組合2種以上之原料構成之聚碳酸酯二醇。
聚碳酸酯多元醇(A)之數目平均分子量宜為300~2,500,更宜為500~1,500。若數目平均分子量在該下限值以上,所得之聚胺甲酸酯樹脂的凝聚力提高,可展現優異的黏接性、耐熱性。又,若在該上限值以下,可適度地確保胺甲酸脂鍵結數,可展現優異的黏接性、耐熱性。
藉由下述算式算出聚碳酸酯二醇(A)之數目平均分子量。
數目平均分子量=(56.1×1000×價數)/羥基價[mgKOH/g]
在上式中,價數係為1分子中之羥基數,[mgKOH/g]係為羥基價之單位。
<有機二異氰酸酯(B)>
在本發明所用之有機二異氰酸酯(B)可列舉:四亞基二異氰酸酯、六亞基二異氰酸酯(HDI)、2-甲基-1,5-戊二異氰酸酯、十亞基二異氰酸酯、3-甲基-1,5-戊二異氰酸酯、離胺酸二異氰酸酯等脂肪族二異氰酸酯;異佛酮二異氰酸酯(IPDI)、氫化甲苯二異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化二甲苯二異氰酸酯、氫化四甲基二甲苯二異氰酸酯、環己基二異氰酸酯等脂環族二異氰酸酯;2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯(MDI)、2,4’-二苯基甲烷二異氰酸酯、2,2’-二苯基甲烷二異氰酸酯、1,5-萘二異氰酸酯、1,4-萘二異氰酸酯、鄰苯二異氰酸酯、對苯二異氰酸酯、間苯二異氰酸酯、鄰二甲苯二異氰酸酯、間二甲苯二異氰酸酯、對二甲苯二異氰酸酯、四甲基二甲苯二異氰酸酯、4,4’-二苯基醚二異氰酸酯、2-硝基聯苯-4,4’-二異氰酸酯、2,2’-二苯基丙烷-4,4’-二異氰酸酯、3,3’-二甲基二苯基甲烷-4,4’-二異氰酸酯、4,4’-二苯基丙烷二異氰酸酯、3,3’-二甲氧基聯苯-4,4’-二異氰酸酯等芳香族二異氰酸酯。又,包含上述有機二異氰酸酯之2種類以上之混合物,可列舉如這些有機二異氰酸酯之胺甲酸脂改性物、脲甲酸酯改性物、尿素改性物、縮二脲改性物、脲二酮改性物、脲酮亞胺改性物、異氰尿酸酯改性物、碳二亞胺改性物等。本發明中有機二異氰酸酯宜為六亞基二異氰酸酯、異佛酮二異氰酸酯、或4,4’-二苯基甲烷二異氰酸酯,此外,特宜為所得之聚胺甲酸酯樹脂之溶劑溶解性良好,且製造時之凝膠化疑慮小,耐候性及樹脂之機械強度優異的異佛酮二異氰酸酯。
有機二異氰酸酯(B)之共聚合量,相對於100質量份之聚碳酸酯多元醇(A)宜為1質量份以上,更宜為2質量份以上,更甚宜為5質量份以上,特宜為10質量份以上。又,宜為60質量份以下,更宜為50質量份以下,更甚宜為45質量份以下,特宜為40質量份以下。藉由落在上述範圍內,可獲得黏接性及耐熱性優異的聚胺甲酸酯樹脂。
<鏈伸長劑(C)>
本發明中所用之鏈伸長劑(C),只要為延伸聚胺甲酸酯樹脂之分子鏈之物則無特別限定,含有與有機二異氰酸酯(B)反應之基之物較為理想。就鏈伸長劑(C)而言,並不特別限定,從製造時之凝膠化、反應性的觀點來看,多元醇化合物較為理想,二元醇化合物更為理想。就二元醇化合物而言,脂肪族二元醇化合物、芳香族二元醇化合物、或脂環族二元醇化合物中之任一者均可,脂肪族二元醇化合物較為理想。其中尤以碳數為10以下之直鏈或分支的脂肪族二元醇化合物較為理想,碳數為7以下之直鏈或分支的脂肪族二元醇化合物更為理想。下限並不特別限定,碳數為2以上之直鏈或分支的脂肪族二元醇化合物較為理想,碳數為3以上之直鏈或分支的脂肪族二元醇化合物更為理想。具體而言,可列舉如乙二醇、1,2-丙二醇、1,3-丙二醇、1,2-丁二醇、1,3-丁二醇、1,4-丁二醇、1,5-戊二醇、1,6-己二醇、3-甲基-1,5-戊二醇、新戊二醇、2-乙基-4-丁基-1,3-丙二醇、二乙二醇、二丙二醇、新戊二醇等。在本發明中,從反應性、耐熱性的觀點來看新戊二醇或1,6-己二醇較為理想。
鏈伸長劑(C)之共聚合量,相對於100質量份之聚碳酸酯多元醇(A)宜為1質量份以上,更宜為2質量份以上,更甚宜為3質量份以上,特宜為4質量份以上。又,宜為20質量份以下,更宜為15質量份以下,更甚宜為10質量份以下,特宜為8質量份以下。藉由落在上述範圍內,可獲得黏接性及耐熱性優異的聚胺甲酸酯樹脂。
<聚胺甲酸酯樹脂>
本發明之聚胺甲酸酯樹脂的玻璃轉移溫度須在50℃以上。宜為55℃以上,更宜為60℃以上。藉由落在上述下限值以上,可抑制因熱負荷所致之與基材間的黏接性降低,可抑制流出的發生。又,宜為120℃以下,更宜為110℃以下,更甚宜為100℃以下,特宜為95℃以下。藉由落在上述上限值以下,可抑制對基材之黏接性降低。
本發明之聚胺甲酸酯樹脂的數目平均分子量宜為5,000~50,000,更宜為8,000~30,000,更甚宜為12,000~22,000。藉由使數目平均分子量落在上述下限值以上,可抑制因聚胺甲酸酯樹脂之凝聚力降低所致之黏接性降低、因熱負荷所致之與基材間的黏接性降低。又,藉由使數目平均分子量落在上述上限值以下,會抑制聚胺甲酸酯樹脂之溶液(清漆)黏度的上升,使處理變得容易。
令聚胺甲酸酯樹脂為100質量%時,聚碳酸酯多元醇(A)、有機二異氰酸酯(B)及鏈伸長劑(C)之合計量宜為80質量%以上,更宜為90質量%以上,更甚宜為95質量%,特宜為99質量%以上,100質量%亦可。藉由落在上述範圍內,可展現優異的黏接性及耐熱性。
就本發明中所用之聚胺甲酸酯樹脂的合成方法而言,可將含有特定骨架之聚碳酸酯二醇(A)與有機二異氰酸酯(B)、鏈伸長劑(C)一併裝入反應容器中,亦可分開裝入。按系統內之聚碳酸酯二醇(A)及鏈伸長劑(C)之羥基價的合計、及有機二異氰酸酯(B)之異氰酸酯基的合計,異氰酸酯基/羥基之官能基的比例在1以下來進行反應的話,較為理想。在0.99以下更為理想,在0.98以下更甚理想。又,在0.90以上較為理想,在0.94以上更為理想,在0.96以上更甚理想。又藉由使該反應在對異氰酸酯基為鈍性的溶劑存在或不存在的情況下反應,可穩定地製造。就該溶劑而言,並不特別限定,可列舉如酯系溶劑(乙酸乙酯、乙酸丁酯、丁酸乙酯等)、醚系溶劑(二㗁烷、四氫呋喃、二乙基醚等)、酮系溶劑(環己酮、甲基乙基酮、甲基異丁基酮等)、芳香族烴系溶劑(苯、甲苯、二甲苯等)及它們的混合溶劑。就反應裝置而言,除了具備攪拌裝置之反應容器(反應罐),亦可使用如揉合機、雙軸擠製機之混合混練裝置。
為了促進如上述之胺甲酸脂化反應,可使用在一般的胺甲酸脂化反應中所用之觸媒。就觸媒而言,可使用例如錫系觸媒(三甲基月桂酸錫、二甲基二月桂酸錫、三甲基氫氧化錫、二甲基二氫氧化錫、辛酸錫(II)等)、鉍系觸媒、鉛系觸媒(油酸鉛、2-乙基己酸鉛等)胺系觸媒(三乙基胺、三丁基胺、𠰌啉、二氮雜雙環辛烷等)等。這些觸媒可單獨使用,亦可2種以上併用。
<交聯劑>
本發明中所用之交聯劑,只要是會與上述聚胺甲酸酯樹脂進行反應並交聯之物則無特別限定。宜為1分子中含有2個以上官能基之化合物,就官能基而言,可列舉如異氰酸酯基、環氧基、胺基、羥甲基、烷氧甲基、亞胺基、金屬螯合基、氮丙啶基等。就具體的化合物而言,可列舉如多官能異氰酸酯化合物、多官能環氧化合物、多官能三聚氰胺化合物、金屬交聯劑、多官能氮丙啶化合物等。
多官能異氰酸酯化合物係每1分子含有2個以上異氰酸酯基之化合物。就具體例而言,可列舉如甲苯二異氰酸酯(TDI)、4,4’-二苯基甲烷二異氰酸酯(MDI)、六亞基二異氰酸酯、鄰二甲苯二異氰酸酯、間二甲苯二異氰酸酯、對二甲苯二異氰酸酯、1,5-萘二異氰酸酯、1,4-萘二異氰酸酯、1,8-萘二異氰酸酯、氫化二苯基甲烷二異氰酸酯、氫化甲苯二異氰酸酯、氫化二甲苯二異氰酸酯、異佛酮二異氰酸酯等二異氰酸酯化合物、由它們所成之聚異氰酸酯化合物,可列舉如有機二異氰酸酯之胺甲酸脂改性物,脲甲酸酯改性物、尿素改性物、縮二脲改性物、脲二酮改性物、脲酮亞胺改性物、異氰尿酸酯改性物、碳二亞胺改性物等。這些可單獨使用,亦可2種以上併用。
多官能環氧化合物係每1分子含有2個以上環氧基之化合物。就具體例而言,可列舉如:1,6-己二醇、新戊二醇、聚伸烷二醇之類的脂肪族二醇的二環氧丙基醚;山梨醇、山梨醇酐、聚甘油、新戊四醇、二甘油、甘油、三羥甲丙烷等脂肪族多元醇的多環氧丙基醚;環己烷二甲醇等脂環族多元醇的多環氧丙基醚;對苯二甲酸、間苯二甲酸、萘二羧酸、偏苯三甲酸、己二酸、癸二酸等脂肪族或芳香族多元羧酸的二環氧丙基酯或多環氧丙基酯。又,可列舉如:間苯二酚、雙-(對羥基苯基)甲烷、2,2-雙-(對羥基苯基)丙烷、參-(對羥基苯基)甲烷、1,1,2,2-肆(對羥基苯基)乙烷等多元酚的二環氧丙基醚或多環氧丙基醚;N,N-二環氧丙基苯胺、N,N-二環氧丙基甲苯胺、N,N,N’,N’-四環氧丙基-雙-(對胺基苯基)甲烷之類的胺的N-環氧丙基衍生物;胺基苯酚的三環氧丙基衍生物;三環氧丙基參(2-羥乙基)異氰尿酸酯;異氰尿酸三環氧丙酯;鄰甲酚型環氧化合物;苯酚酚醛清漆型環氧化合物;雙酚型多官能環氧化合物。該等可單獨使用,亦可併用2種以上。
就金屬交聯劑而言,可列舉如使乙醯丙酮、乙醯乙酸甲酯、乙醯乙酸乙酯、乳酸乙酯、水楊酸甲酯等配位於鋁、鋅、鎘、鎳、鈷、銅、鈣、鋇、鈦、錳、鐵、鉛、鋯、鉻、錫等金屬而成的金屬螯合化合物等。該等可單獨使用,亦可併用2種以上。
多官能氮丙啶化合物係為每1分子含有2個以上氮丙啶基之化合物。就具體例而言,可列舉如N,N’-六亞甲基-1,6-雙(1-氮丙啶羧醯胺)、三羥甲丙烷-三-β-氮丙啶基丙酸酯、雙間苯二甲醯-1-(2-甲基氮丙啶)、三-1-氮丙啶基氧化膦、N,N’-二苯基乙烷-4,4’-雙(1-氮丙啶羧醯胺)等。該等可單獨使用,亦可併用2種以上。
就上述交聯劑而言,宜為多官能異氰酸酯化合物較為理想。更宜為二甲苯二異氰酸酯或宜為其改性物。
交聯劑的含量,相對於聚胺甲酸酯樹脂100質量份,宜為1質量份以上,更宜為2質量份以上,更甚宜為3質量份以上。又,宜為30質量份以下,更宜為25質量份以下,更甚宜為20質量份以下。藉由落在上述範圍內,可展現優異的黏接性及耐熱性。
<黏接劑組成物>
本發明之黏接劑組成物係為含有上述聚胺甲酸酯樹脂及交聯劑之組成物。黏接劑組成物之固體成分中,聚胺甲酸酯樹脂的含量宜為60質量%以上,更宜為70質量%以上,更甚宜為80質量%以上。又,宜為98質量%以下,更宜為95質量%以下,更甚宜為93質量%以下。藉由在上述範圍內含有,可展現優異的黏接性及耐熱性。
本發明之黏接劑組成物能以有機溶劑稀釋而形成清漆。就有機溶劑而言,並不特別限定,可列舉如酯系溶劑(乙酸乙酯、乙酸丁酯、丁酸乙酯等)、醚系溶劑(二㗁烷、四氫呋喃、二乙基醚等)、酮系溶劑(環己酮、甲基乙基酮、甲基異丁基酮等)、芳香族烴溶劑(苯、甲苯、二甲苯等)及它們的混合溶劑。有機溶劑相對於聚胺甲酸酯樹脂100質量份,宜為50質量份以上,更宜為100質量份以上,更甚宜為200質量份以上。又,宜為2000質量份以下,更宜為1000質量份以下,更甚宜為500質量份以下。若落在上述範圍內,黏接劑組成物的保存穩定性良好,對基材的塗覆性更好。此外在成本方面亦有利。
黏接劑組成物,在不損及本發明效果的範圍下,可含有紫外線吸收劑、抗氧化劑、阻燃劑、填料等習知的添加劑。
[實施例]
以下利用實施例針對本發明進行說明,但本發明不應受實施例任何限定。除非另有規定,實施例中簡單記載「份」係意指質量份,「%」係意指質量%。又,各測定項目係按照以下方法。
<數目平均分子量(Mn)>
在4ml之四氫呋喃(添加5mM之四丁基氯化銨)中將4mg之試樣(聚碳酸酯多元醇(A)或聚胺甲酸酯樹脂)溶解之後,以0.2μm之膜濾器過濾而製得試樣溶液。將試樣溶液以凝膠滲透層析法進行分析。裝置使用TOSOH HLC-8220,檢測器使用示差折射率偵檢器,以流速1mL/分、管柱溫度40℃進行測定。使用單分散聚苯乙烯作為分子量標準,將數目平均分子量計為標準聚苯乙烯換算值,並省去相當於分子量未達1000的部分而算出。
<玻璃轉移溫度(Tg)>
玻璃轉移溫度,係藉由動態黏彈性之溫度依存性測定結果,將儲存模數(E')之反曲點的溫度定義為玻璃轉移溫度。將所得之聚胺甲酸酯樹脂溶液以形成濕膜厚(乾燥前之厚度)200μm的方式予以塗佈於聚丙烯薄膜(東洋紡公司製P2161,厚度50μm)上,在120℃下進行1小時的加熱使溶劑揮發(乾燥)。接著,將聚胺甲酸酯樹脂溶液的乾燥後薄膜從聚丙烯薄膜剝離,製得聚胺甲酸酯樹脂的試樣薄膜。對該試樣薄膜的玻璃轉移溫度進行測定。裝置係使用ITK CO.,LTD.製之動態黏彈性測定裝置DVA-220,對0℃~150℃(4℃/min、10Hz)的溫度依存性進行測定。
聚胺甲酸酯樹脂(U1)之製造例
在具備溫度計、攪拌機、回流式冷卻管及蒸餾管之反應容器中,裝入UC-100(宇部興產製聚碳酸酯二醇)100份、新戊二醇5份、甲基乙基酮(MEK)204份,將其溶解後,投入異佛酮二異氰酸酯31份,予以攪拌而製得均勻溶液。之後,加入作為觸媒之BiCAT8210(The Shepherd Chemical Company製)0.5份在75℃下反應5小時。使其充分地反應,再投入甲基乙基酮(MEK)113份並攪拌後,獲得目標固體成分濃度(NV)30質量%之聚胺甲酸酯樹脂(U1)的溶液。將藉此而獲得之聚胺甲酸酯樹脂(U1)的特性顯示於表1。
聚胺甲酸酯樹脂(U2)~(U9)之製造例
與聚胺甲酸酯樹脂(U1)之製造例相同,但變更原料的種類及摻合比例,而獲得聚胺甲酸酯樹脂(U2)~(U9)。將它們的特性顯示於表1。
[表1]
實施例1~7、比較例1~3
使用上述聚胺甲酸酯樹脂(U1)~(U10)製得疊層體,進行初始黏接力(黏接性)及耐熱性之評價。又,就實施例8而言,相對於聚胺甲酸酯樹脂溶液100質量份(固體成分換算30質量份),添加作為交聯劑之D-110N(三井化學製,固體成分濃度75質量%)4質量份(固體成分換算3質量份)並進行評價。
疊層體之製作
利用塗佈棒將聚胺甲酸酯樹脂(P1)之溶液以使乾膜厚(乾燥後之膜厚)成為5μm的方式塗佈在聚碳酸酯薄膜(住友電木製、EC105、0.5mm)上,在120℃下進行3分鐘之加熱使溶劑揮發(乾燥)。接著,使用乾式層合機將聚碳酸酯薄膜(住友電木製、EC105、0.5mm)壓接(乾式層合)於上述薄膜之聚胺甲酸酯樹脂面。乾式層合係在輥溫度120℃、輥荷重3kg/cm、被壓接物速度1m/分下進行。接著,進行80℃、1小時的老化,獲得疊層體。
初始黏接力(黏接性)試驗
將上述疊層體裁切成寬15mm之長條形,以TENSILON(註冊商標)(東洋測器(股)製,UTM-IV)進行剝離(T型peel剝離、拉伸速度100mm/分)、觀察剝離的樣子並對黏接性進行評價。評價結果顯示於表2。
(評價)
○:黏接劑內聚破壞或材料破壞。
△:界面剝離,且黏接強度為10N/15mm。
×:黏接強度未達10N/15mm。
耐熱性試驗
將上述疊層體在105℃下進行300小時之處理(靜置),與初始黏接力試驗同樣地對黏接性進行評價。
(評價)
◎:不發生翻翹,黏接劑內聚破壞或材料破壞。
○:不發生翻翹,主要為內聚剝離,一部分為界面剝離。
△:不發生翻翹,形成界面剝離。
×:發生翻翹。
[表2]
表1、表2中使用之化合物係如以下。
UC-100:以1,4-環己烷二甲醇為基礎之宇部興產製的聚碳酸酯二醇,數目平均分子量=1000,在聚碳酸酯多元醇(A)中,以通式(1)所示之結構的含有比例為100莫耳%
UH-100:以1,6-己二醇為基礎之宇部興產製的聚碳酸酯二醇,數目平均分子量=1000,在聚碳酸酯多元醇(A)中,以通式(1)所示之結構的含有比例為0莫耳%
PH-100:以1,6-己二醇與1,5-戊二醇為基礎之宇部興產製的聚碳酸酯二醇,數目平均分子量=1000,在聚碳酸酯多元醇(A)中,以通式(1)所示之結構的含有比例為0莫耳%
UM-90(3/1):以1,4-環己烷二甲醇與1,6-己二醇為基礎之宇部興產製的聚碳酸酯二醇,數目平均分子量=900,在聚碳酸酯多元醇(A)中,以通式(1)所示之結構的含有比例為75莫耳%
UM-90(1/1):以1,4-環己烷二甲醇與1,6-己二醇為基礎之宇部興產製的聚碳酸酯二醇,數目平均分子量=900,在聚碳酸酯多元醇(A)中,以通式(1)所示之結構的含有比例為50莫耳%
D-110N:三井化學製,間二甲苯二異氰酸酯的三羥甲丙烷加成物體,固體成分比例為75質量%
IPDI:異佛酮二異氰酸酯
MDI:二苯基甲烷二異氰酸酯
HDI:六亞基二異氰酸酯
NPG:新戊二醇
HD:1,6-己二醇
Claims (4)
- 如請求項1之聚胺甲酸酯樹脂,其中,該有機二異氰酸酯(B)為異佛酮二異氰酸酯、4,4’-二苯基甲烷二異氰酸酯、或六亞基二異氰酸酯。
- 如請求項1或2之聚胺甲酸酯樹脂,其中,該鏈伸長劑(C)為碳數10以下之二元醇化合物。
- 一種黏接劑組成物,含有如請求項1至3中任一項之聚胺甲酸酯樹脂及交聯劑。
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