TWI828815B - 用於馬蘭葛尼乾燥的方法及設備 - Google Patents

用於馬蘭葛尼乾燥的方法及設備 Download PDF

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Publication number
TWI828815B
TWI828815B TW108143878A TW108143878A TWI828815B TW I828815 B TWI828815 B TW I828815B TW 108143878 A TW108143878 A TW 108143878A TW 108143878 A TW108143878 A TW 108143878A TW I828815 B TWI828815 B TW I828815B
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Taiwan
Prior art keywords
assembly
mounting assembly
crossbar
mounting
base
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TW108143878A
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English (en)
Chinese (zh)
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TW202029313A (zh
Inventor
愛德溫 費拉奎茲
傑更 朗加拉賈
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美商應用材料股份有限公司
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Publication of TW202029313A publication Critical patent/TW202029313A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
TW108143878A 2018-12-03 2019-12-02 用於馬蘭葛尼乾燥的方法及設備 TWI828815B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862774746P 2018-12-03 2018-12-03
US62/774,746 2018-12-03

Publications (2)

Publication Number Publication Date
TW202029313A TW202029313A (zh) 2020-08-01
TWI828815B true TWI828815B (zh) 2024-01-11

Family

ID=70849332

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108143878A TWI828815B (zh) 2018-12-03 2019-12-02 用於馬蘭葛尼乾燥的方法及設備

Country Status (6)

Country Link
US (1) US11735438B2 (https=)
JP (1) JP7607561B2 (https=)
KR (1) KR102746809B1 (https=)
CN (1) CN113169098B (https=)
TW (1) TWI828815B (https=)
WO (1) WO2020117685A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220282918A1 (en) * 2021-03-03 2022-09-08 Applied Materials, Inc. Drying system with integrated substrate alignment stage
EP4300556A1 (de) * 2022-06-27 2024-01-03 Siltronic AG Abdeckung für ein reinigungsmodul zum reinigen einer halbleiterscheibe und verfahren zum reinigen einer halbleiterscheibe in einer reinigungsstrasse

Citations (5)

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US20040200409A1 (en) * 2002-12-16 2004-10-14 Applied Materials, Inc. Scrubber with integrated vertical marangoni drying
JP2007111612A (ja) * 2005-10-19 2007-05-10 Tokyo Electron Ltd 塗布方法及び塗布装置
US20120235342A1 (en) * 2011-03-16 2012-09-20 Fuji Electric Co., Ltd. Substrate support jig
TW201505726A (zh) * 2013-07-01 2015-02-16 應用材料股份有限公司 線性馬蘭哥尼乾燥器中單次使用之沖洗
CN108831849A (zh) * 2018-06-25 2018-11-16 清华大学 基于热马兰哥尼效应的晶圆干燥装置和干燥方法

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US5609305A (en) * 1994-09-19 1997-03-11 Vortec Corporation Apparatus for providing an air curtain
US5505645A (en) * 1994-11-28 1996-04-09 E D F Products, Inc. Floatable assembly for swimming pools
US6164297A (en) 1997-06-13 2000-12-26 Tokyo Electron Limited Cleaning and drying apparatus for objects to be processed
US5933902A (en) 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system
TW391895B (en) * 1998-10-02 2000-06-01 Ultra Clean Technology Asia Pt Method and apparatus for washing and drying semi-conductor devices
US6575177B1 (en) * 1999-04-27 2003-06-10 Applied Materials Inc. Semiconductor substrate cleaning system
ATE379847T1 (de) * 1999-07-02 2007-12-15 Matsushita Electric Industrial Co Ltd Anordnung zur herstellung von löthöckern auf halbleitersubstraten unter generierung elektrischer ladung, methode und anordnung zum entfernen dieser ladungen, und elektrische ladung generierendes halbleitersubstrat
US20020121289A1 (en) 2001-03-05 2002-09-05 Applied Materials, Inc. Spray bar
US20030192570A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Method and apparatus for wafer cleaning
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US20080053486A1 (en) 2006-08-10 2008-03-06 Applied Materials, Inc. Semiconductor substrate cleaning apparatus
JP5220111B2 (ja) * 2008-07-29 2013-06-26 三菱電機株式会社 細孔放電加工装置及び放電加工方法
US8869422B2 (en) 2012-04-27 2014-10-28 Applied Materials, Inc. Methods and apparatus for marangoni substrate drying using a vapor knife manifold
US9984867B2 (en) * 2014-12-19 2018-05-29 Applied Materials, Inc. Systems and methods for rinsing and drying substrates
US20160178279A1 (en) 2014-12-19 2016-06-23 Applied Materials, Inc. Substrate edge residue removal systems, apparatus, and methods
CN108257894B (zh) * 2018-01-12 2020-05-19 清华大学 晶圆干燥装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040200409A1 (en) * 2002-12-16 2004-10-14 Applied Materials, Inc. Scrubber with integrated vertical marangoni drying
JP2007111612A (ja) * 2005-10-19 2007-05-10 Tokyo Electron Ltd 塗布方法及び塗布装置
US20120235342A1 (en) * 2011-03-16 2012-09-20 Fuji Electric Co., Ltd. Substrate support jig
TW201505726A (zh) * 2013-07-01 2015-02-16 應用材料股份有限公司 線性馬蘭哥尼乾燥器中單次使用之沖洗
CN108831849A (zh) * 2018-06-25 2018-11-16 清华大学 基于热马兰哥尼效应的晶圆干燥装置和干燥方法

Also Published As

Publication number Publication date
CN113169098A (zh) 2021-07-23
US20200176279A1 (en) 2020-06-04
WO2020117685A1 (en) 2020-06-11
KR20210088735A (ko) 2021-07-14
TW202029313A (zh) 2020-08-01
JP7607561B2 (ja) 2024-12-27
US11735438B2 (en) 2023-08-22
JP2022510960A (ja) 2022-01-28
KR102746809B1 (ko) 2024-12-27
CN113169098B (zh) 2025-08-05

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