CN113169098B - 用于马兰戈尼干燥的方法和设备 - Google Patents

用于马兰戈尼干燥的方法和设备

Info

Publication number
CN113169098B
CN113169098B CN201980079388.XA CN201980079388A CN113169098B CN 113169098 B CN113169098 B CN 113169098B CN 201980079388 A CN201980079388 A CN 201980079388A CN 113169098 B CN113169098 B CN 113169098B
Authority
CN
China
Prior art keywords
spray
mounting assembly
crossbar
substrate
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980079388.XA
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English (en)
Chinese (zh)
Other versions
CN113169098A (zh
Inventor
E·维拉兹克兹
J·兰加拉简
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN113169098A publication Critical patent/CN113169098A/zh
Application granted granted Critical
Publication of CN113169098B publication Critical patent/CN113169098B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
CN201980079388.XA 2018-12-03 2019-12-02 用于马兰戈尼干燥的方法和设备 Active CN113169098B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862774746P 2018-12-03 2018-12-03
US62/774,746 2018-12-03
PCT/US2019/064027 WO2020117685A1 (en) 2018-12-03 2019-12-02 Methods and apparatus for marangoni drying

Publications (2)

Publication Number Publication Date
CN113169098A CN113169098A (zh) 2021-07-23
CN113169098B true CN113169098B (zh) 2025-08-05

Family

ID=70849332

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980079388.XA Active CN113169098B (zh) 2018-12-03 2019-12-02 用于马兰戈尼干燥的方法和设备

Country Status (6)

Country Link
US (1) US11735438B2 (https=)
JP (1) JP7607561B2 (https=)
KR (1) KR102746809B1 (https=)
CN (1) CN113169098B (https=)
TW (1) TWI828815B (https=)
WO (1) WO2020117685A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220282918A1 (en) * 2021-03-03 2022-09-08 Applied Materials, Inc. Drying system with integrated substrate alignment stage
EP4300556A1 (de) * 2022-06-27 2024-01-03 Siltronic AG Abdeckung für ein reinigungsmodul zum reinigen einer halbleiterscheibe und verfahren zum reinigen einer halbleiterscheibe in einer reinigungsstrasse

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6250318B1 (en) * 1998-10-02 2001-06-26 Ultra Clean Technology Asia Pte. Ltd. Method and apparatus for washing and drying semi-conductor devices
JP2007111612A (ja) * 2005-10-19 2007-05-10 Tokyo Electron Ltd 塗布方法及び塗布装置
CN107112263A (zh) * 2014-12-19 2017-08-29 应用材料公司 用于漂洗与干燥基板的系统和方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609305A (en) * 1994-09-19 1997-03-11 Vortec Corporation Apparatus for providing an air curtain
US5505645A (en) * 1994-11-28 1996-04-09 E D F Products, Inc. Floatable assembly for swimming pools
US6164297A (en) 1997-06-13 2000-12-26 Tokyo Electron Limited Cleaning and drying apparatus for objects to be processed
US5933902A (en) 1997-11-18 1999-08-10 Frey; Bernhard M. Wafer cleaning system
US6575177B1 (en) * 1999-04-27 2003-06-10 Applied Materials Inc. Semiconductor substrate cleaning system
ATE379847T1 (de) * 1999-07-02 2007-12-15 Matsushita Electric Industrial Co Ltd Anordnung zur herstellung von löthöckern auf halbleitersubstraten unter generierung elektrischer ladung, methode und anordnung zum entfernen dieser ladungen, und elektrische ladung generierendes halbleitersubstrat
US20020121289A1 (en) 2001-03-05 2002-09-05 Applied Materials, Inc. Spray bar
US20030192570A1 (en) * 2002-04-11 2003-10-16 Applied Materials, Inc. Method and apparatus for wafer cleaning
US20040031167A1 (en) 2002-06-13 2004-02-19 Stein Nathan D. Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife
US20040200409A1 (en) * 2002-12-16 2004-10-14 Applied Materials, Inc. Scrubber with integrated vertical marangoni drying
US20080053486A1 (en) 2006-08-10 2008-03-06 Applied Materials, Inc. Semiconductor substrate cleaning apparatus
JP5220111B2 (ja) * 2008-07-29 2013-06-26 三菱電機株式会社 細孔放電加工装置及び放電加工方法
JP5966250B2 (ja) * 2011-03-16 2016-08-10 富士電機株式会社 基板支持治具
US8869422B2 (en) 2012-04-27 2014-10-28 Applied Materials, Inc. Methods and apparatus for marangoni substrate drying using a vapor knife manifold
US9728428B2 (en) * 2013-07-01 2017-08-08 Applied Materials, Inc. Single use rinse in a linear Marangoni drier
US20160178279A1 (en) 2014-12-19 2016-06-23 Applied Materials, Inc. Substrate edge residue removal systems, apparatus, and methods
CN108257894B (zh) * 2018-01-12 2020-05-19 清华大学 晶圆干燥装置
CN108831849A (zh) * 2018-06-25 2018-11-16 清华大学 基于热马兰哥尼效应的晶圆干燥装置和干燥方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6250318B1 (en) * 1998-10-02 2001-06-26 Ultra Clean Technology Asia Pte. Ltd. Method and apparatus for washing and drying semi-conductor devices
JP2007111612A (ja) * 2005-10-19 2007-05-10 Tokyo Electron Ltd 塗布方法及び塗布装置
CN107112263A (zh) * 2014-12-19 2017-08-29 应用材料公司 用于漂洗与干燥基板的系统和方法

Also Published As

Publication number Publication date
CN113169098A (zh) 2021-07-23
US20200176279A1 (en) 2020-06-04
WO2020117685A1 (en) 2020-06-11
KR20210088735A (ko) 2021-07-14
TW202029313A (zh) 2020-08-01
JP7607561B2 (ja) 2024-12-27
US11735438B2 (en) 2023-08-22
TWI828815B (zh) 2024-01-11
JP2022510960A (ja) 2022-01-28
KR102746809B1 (ko) 2024-12-27

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